Data Sheet

BAS21H
Single high-voltage switching diode
Rev. 02 — 3 November
Product data sheet
1. Product profile
1.1 General description
Single high-voltage switching diode, encapsulated in a SOD123F small and flat lead
Surface-Mounted Device (SMD) plastic package.
1.2 Features
n Small and flat lead SMD plastic package
n Reverse voltage: VR ≤ 200 V
1.3 Applications
n General-purpose switching
1.4 Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
IF
forward current
VR
reverse voltage
trr
reverse recovery time
Conditions
[1]
[2]
Min
Typ
Max
Unit
-
-
200
mA
-
-
200
V
-
-
50
ns
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2]
When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA.
BAS21H
NXP Semiconductors
Single high-voltage switching diode
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Symbol
[1]
1
1
2
2
sym001
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
BAS21H
Package
Name
Description
Version
-
plastic surface-mounted package; 2 leads
SOD123F
4. Marking
Table 4.
Marking codes
Type number
Marking code
BAS21H
B2
BAS21H_2
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 02 — 3 November
2 of 10
BAS21H
NXP Semiconductors
Single high-voltage switching diode
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VRRM
repetitive peak reverse
voltage
VR
reverse voltage
Min
Max
Unit
-
250
V
-
200
V
-
200
mA
-
625
mA
tp = 1 µs
-
9
A
tp = 100 µs
-
3
A
[1]
IF
forward current
IFRM
repetitive peak forward
current
tp = 1 ms;
δ = 0.25
IFSM
non-repetitive peak forward
current
square wave
[2]
tp = 10 ms
-
1.7
A
-
375
mW
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
Ptot
total power dissipation
Tj
Tamb ≤ 25 °C
[3]
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2]
Tj = 25 °C prior to surge.
[3]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
in free air
Rth(j-sp)
thermal resistance from
junction to solder point
Typ
Max
Unit
-
-
330
K/W
[3]
-
-
70
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Soldering point of cathode tab.
BAS21H_2
Product data sheet
Min
[1][2]
© NXP B.V. 2006. All rights reserved.
Rev. 02 — 3 November
3 of 10
BAS21H
NXP Semiconductors
Single high-voltage switching diode
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
VF
IR
Cd
trr
Conditions
forward voltage
reverse current
diode capacitance
IF = 100 mA
[1]
IF = 200 mA
[1]
Typ
Max
Unit
-
-
1
V
-
-
1.25
V
VR = 200 V
-
-
100
nA
VR = 200 V; Tj = 150 °C
-
-
100
µA
-
-
5
pF
-
-
50
ns
VR = 0 V; f = 1 MHz
reverse recovery time
[2]
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2]
When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA.
BAS21H_2
Product data sheet
Min
© NXP B.V. 2006. All rights reserved.
Rev. 02 — 3 November
4 of 10
BAS21H
NXP Semiconductors
Single high-voltage switching diode
mbg384
600
IF
(mA)
IFSM
(A)
(1)
(2)
(3)
400
10
200
1
0
mbg703
102
10−1
0
1
VF (V)
2
1
10
102
103
104
tp (µs)
(1) Tamb = 150 °C; typical values
Based on square wave currents.
(2) Tamb = 25 °C; typical values
Tj = 25 °C; prior to surge
(3) Tamb = 25 °C; maximum values
Fig 1. Forward current as a function of forward
voltage
mbg381
102
Fig 2. Non-repetitive peak forward current as a
function of pulse duration; maximum values
mbg447
1.0
IR
(µA)
Cd
(pF)
10
0.8
(1)
1
(2)
0.6
10−1
10−2
0.4
0
100
Tj (°C)
200
0.2
0
2
4
6
VR (V)
8
f = 1 MHz; Tamb = 25 °C
(1) VR = VRmax; maximum values
(2) VR = VRmax; typical values
Fig 3. Reverse current as a function of junction
temperature
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
BAS21H_2
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 02 — 3 November
5 of 10
BAS21H
NXP Semiconductors
Single high-voltage switching diode
8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
V = VR + IF × RS
trr
t
Ri = 50 Ω
VR
(1)
90 %
mga881
input signal
output signal
(1) IR = 3 mA
Fig 5. Reverse recovery time test circuit and waveforms
9. Package outline
1.7
1.5
1.2
1.0
1
0.55
0.35
3.6
3.4
2.7
2.5
2
0.70
0.55
Dimensions in mm
0.25
0.10
04-11-29
Fig 6. Package outline SOD123F
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
BAS21H
[1]
Package
SOD123F
Description
4 mm pitch, 8 mm tape and reel
3000
10000
-115
-135
For further information and the availability of packing methods, see Section 15.
BAS21H_2
Product data sheet
Packing quantity
© NXP B.V. 2006. All rights reserved.
Rev. 02 — 3 November
6 of 10
BAS21H
NXP Semiconductors
Single high-voltage switching diode
11. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD123F
12. Mounting
43.4
1.2
1.2
1.2
40
1.2
0.5
Dimensions in mm
006aaa670
PCB thickness = 1.6 mm
Fig 8. FR4 PCB, standard footprint SOD123F
BAS21H_2
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 02 — 3 November
7 of 10
BAS21H
NXP Semiconductors
Single high-voltage switching diode
13. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAS21H_2
20061103
Product data sheet
-
BAS21H_1
Modifications:
BAS21H_1
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
•
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Section 1.1 “General description”: amended
Table 1 “Quick reference data”: IF forward current table note added
Table 5 “Limiting values”: IF forward current table note added
Table 5 “Limiting values”: IFRM repetitive peak forward current condition amended
Table 5 “Limiting values”: IFSM non-repetitive peak forward current condition amended
Table 6: Rth(j-sp) thermal resistance from junction to solder point table note added
Table 7 “Characteristics”: VF forward voltage unit amended
Figure 2: figure title and figure note amended
Figure 3: amended
Section 12 “Mounting”: added
Section 14.4 “Trademarks”: added
20050411
Product data sheet
BAS21H_2
Product data sheet
-
-
© NXP B.V. 2006. All rights reserved.
Rev. 02 — 3 November
8 of 10
BAS21H
NXP Semiconductors
Single high-voltage switching diode
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
BAS21H_2
Product data sheet
© NXP B.V. 2006. All rights reserved.
Rev. 02 — 3 November
9 of 10
BAS21H
NXP Semiconductors
Single high-voltage switching diode
16. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information. . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 3 November
Document identifier: BAS21H_2
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