CAV25040

CAV25010, CAV25020,
CAV25040
1-Kb, 2-Kb and 4-Kb SPI
Serial CMOS EEPROM
Description
The CAV25010/20/40 are 1−Kb/2−Kb/4−Kb Serial CMOS
EEPROM devices internally organized as 128x8/256x8/512x8 bits.
They feature a 16−byte page write buffer and support the Serial
Peripheral Interface (SPI) protocol. The device is enabled through a
Chip Select (CS) input. In addition, the required bus signals are a clock
input (SCK), data input (SI) and data output (SO) lines. The HOLD
input may be used to pause any serial communication with the
CAV25010/20/40 device. These devices feature software and
hardware write protection, including partial as well as full array
protection.
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SOIC−8
V SUFFIX
CASE 751BD
PIN CONFIGURATION
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Automotive Temperature Grade 1 (−40°C to +125°C)
10 MHz SPI Compatible
2.5 V to 5.5 V Supply Voltage Range
SPI Modes (0,0) & (1,1)
16−byte Page Write Buffer
Self−timed Write Cycle
Hardware and Software Protection
Block Write Protection
− Protect 1/4, 1/2 or Entire EEPROM Array
Low Power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Range
SOIC and TSSOP 8−Lead Packages
These Devices are Pb−Free, Halogen Free/BFR Free, and RoHS
Compliant
CS
HOLD
SO
VCC
HOLD
WP
SCK
VSS
SI
SOIC (V), TSSOP (Y)
For the location of Pin 1, please consult the
corresponding package drawing.
PIN FUNCTION
Pin Name
Function
CS
Chip Select
SO
Serial Data Output
WP
Write Protect
VSS
Ground
SI
Serial Data Input
VCC
CAV25010
CAV25020
CAV25040
1
SO
HOLD
SI
WP
CS
SCK
VCC
TSSOP−8
Y SUFFIX
CASE 948AL
Serial Clock
Hold Transmission Input
Power Supply
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
SCK
VSS
Figure 1. Functional Symbol
© Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 0
1
Publication Order Number:
CAV25010/D
CAV25010, CAV25020, CAV25040
MARKING DIAGRAMS
25xx0E
AYMXXX
G
(SOIC−8)
25010E = CAV25010
25020E = CAV25020
25040E = CAV25040
A
= Assembly Location
Y
= Production Year (Last Digit)
M = Production Month (1−9, O, N, D)
XXX = Last Three Digits of
XXX = Assembly Lot Number
G
= Pb−Free Package
S01E = CAV25010
S02E = CAV25020
S04E = CAV25040
A
= Assembly Location
Y
= Production Year (Last Digit)
M = Production Month (1−9, O, N, D)
XXX = Last Three Digits of
XXX = Assembly Lot Number
G
= Pb−Free Package
SxxE
AYMXXX
G
(TSSOP−8)
Table 1. ABSOLUTE MAXIMUM RATINGS
Ratings
Units
Operating Temperature
Parameters
−45 to +130
°C
Storage Temperature
−65 to +150
°C
−0.5 to VCC + 0.5
V
Voltage on any Pin with Respect to Ground (Note 1)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 2. RELIABILITY CHARACTERISTICS (Note 2)
Symbol
Parameter
NEND (Note 3)
TDR
Endurance
Min
Units
1,000,000
Program / Erase Cycles
100
Years
Data Retention
Table 3. D.C. OPERATING CHARACTERISTICS (VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min
Max
Units
ICCR
Supply Current (Read Mode)
Read, VCC = 5.5 V, 10 MHz, SO open
2
mA
ICCW
Supply Current (Write Mode)
Write, VCC = 5.5 V, 10 MHz, SO open
2
mA
ISB1
Standby Current
VIN = GND or VCC, CS = VCC,
WP = VCC, VCC = 5.5 V
2
mA
ISB2
Standby Current
VIN = GND or VCC, CS = VCC,
WP = GND, VCC = 5.5 V
5
mA
Input Leakage Current
VIN = GND or VCC
−2
2
mA
ILO
Output Leakage Current
CS = VCC,
VOUT = GND or VCC
−1
2
mA
VIL
Input Low Voltage
−0.5
0.3 VCC
V
VIH
Input High Voltage
0.7 VCC
VCC + 0.5
V
VOL
Output Low Voltage
IOL = 3.0 mA
0.4
V
VOH
Output High Voltage
IOH = −1.6 mA
IL
VCC − 0.8 V
V
Table 4. PIN CAPACITANCE (Note 2) (TA = 25°C, f = 1.0 MHz, VCC = +5.0 V)
Symbol
COUT
CIN
Test
Conditions
Output Capacitance (SO)
Input Capacitance (CS, SCK, SI, WP, HOLD)
Min
Typ
Max
Units
VOUT = 0 V
8
pF
VIN = 0 V
8
pF
1. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may
undershoot to no less than −1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns.
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
3. Page Mode, VCC = 5 V, 25°C.
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CAV25010, CAV25020, CAV25040
Table 5. A.C. CHARACTERISTICS (TA = −40°C to +125°C) (Note 4)
VCC = 2.5 V − 5.5 V
Symbol
Parameter
Min
Max
Units
10
MHz
fSCK
Clock Frequency
DC
tSU
Data Setup Time
10
ns
tH
Data Hold Time
10
ns
tWH
SCK High Time
40
ns
tWL
SCK Low Time
40
ns
tLZ
HOLD to Output Low Z
25
ns
tRI (Note 5)
Input Rise Time
2
ms
tFI (Note 5)
Input Fall Time
2
ms
tHD
HOLD Setup Time
0
ns
tCD
HOLD Hold Time
10
ns
tV
Output Valid from Clock Low
tHO
Output Hold Time
tDIS
Output Disable Time
tHZ
35
ns
0
HOLD to Output High Z
ns
20
ns
25
ns
tCS
CS High Time
40
ns
tCSS
CS Setup Time
30
ns
tCSH
CS Hold Time
30
ns
tCNS
CS Inactive Setup Time
20
ns
tCNH
CS Inactive Hold Time
20
ns
tWPS
WP Setup Time
10
ns
tWPH
WP Hold Time
10
tWC (Note 6)
ns
Write Cycle Time
5
ms
4. AC Test Conditions:
Input Pulse Voltages: 0.3 VCC to 0.7 VCC
Input rise and fall times: ≤ 10 ns
Input and output reference voltages: 0.5 VCC
Output load: current source IOL max/IOH max; CL = 30 pF
5. This parameter is tested initially and after a design or process change that affects the parameter.
6. tWC is the time from the rising edge of CS after a valid write sequence to the end of the internal write cycle.
Table 6. POWER−UP TIMING (Notes 7, 8)
Symbol
Parameter
Min
Max
Units
tPUR
Power−up to Read Operation
0.1
1
ms
tPUW
Power−up to Write Operation
0.1
1
ms
7. This parameter is tested initially and after a design or process change that affects the parameter.
8. tPUR and tPUW are the delays required from the time VCC is stable at the operating voltage until the specified operation can be initiated.
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CAV25010, CAV25020, CAV25040
Pin Description
Functional Description
SI: The serial data input pin accepts op−codes, addresses
and data. In SPI modes (0,0) and (1,1) input data is latched
on the rising edge of the SCK clock input.
SO: The serial data output pin is used to transfer data out of
the device. In SPI modes (0,0) and (1,1) data is shifted out
on the falling edge of the SCK clock.
SCK: The serial clock input pin accepts the clock provided
by the host and used for synchronizing communication
between host and CAV25010/20/40.
CS: The chip select input pin is used to enable/disable the
CAV25010/20/40. When CS is high, the SO output is
tri−stated (high impedance) and the device is in Standby
Mode (unless an internal write operation is in progress).
Every communication session between host and
CAV25010/20/40 must be preceded by a high to low
transition and concluded with a low to high transition of the
CS input.
WP: The write protect input pin will allow all write
operations to the device when held high. When WP pin is
tied low all write operations are inhibited.
HOLD: The HOLD input pin is used to pause transmission
between host and CAV25010/20/40, without having to
retransmit the entire sequence at a later time. To pause,
HOLD must be taken low and to resume it must be taken
back high, with the SCK input low during both transitions.
When not used for pausing, the HOLD input should be tied
to VCC, either directly or through a resistor.
The CAV25010/20/40 devices support the Serial
Peripheral Interface (SPI) bus protocol, modes (0,0) and
(1,1). The device contains an 8−bit instruction register. The
instruction set and associated op−codes are listed in Table 7.
Reading data stored in the CAV25010/20/40 is
accomplished by simply providing the READ command and
an address. Writing to the CAV25010/20/40, in addition to
a WRITE command, address and data, also requires
enabling the device for writing by first setting certain bits in
a Status Register, as will be explained later.
After a high to low transition on the CS input pin, the
CAV25010/20/40 will accept any one of the six instruction
op−codes listed in Table 7 and will ignore all other possible
8−bit combinations. The communication protocol follows
the timing from Figure 2.
Table 7. INSTRUCTION SET (Note 9)
Instruction
Opcode
WREN
0000 0110
Enable Write Operations
WRDI
0000 0100
Disable Write Operations
RDSR
0000 0101
Read Status Register
WRSR
0000 0001
Write Status Register
READ
0000 X011
Read Data from Memory
WRITE
0000 X010
Write Data to Memory
Operation
9. X = 0 for CAV25010, CAV25020. X = A8 for CAV25040
tCS
CS
tCSS
tCNH
tWH
tWL
tCSH
tCNS
SCK
tSU
tH
tRI
tFI
VALID
IN
SI
tV
tV
tDIS
tHO
SO
HI−Z
HI−Z
VALID
OUT
Figure 2. Synchronous Data Timing
Status Register
The Status Register, as shown in Table 8, contains a
number of status and control bits.
The RDY (Ready) bit indicates whether the device is busy
with a write operation. This bit is automatically set to 1 during
an internal write cycle, and reset to 0 when the device is ready
to accept commands. For the host, this bit is read only.
The WEL (Write Enable Latch) bit is set/reset by the
WREN/WRDI commands. When set to 1, the device is in a
Write Enable state and when set to 0, the device is in a Write
Disable state.
The BP0 and BP1 (Block Protect) bits determine which
blocks are currently write protected. They are set by the user
with the WRSR command and are non−volatile. The user is
allowed to protect a quarter, one half or the entire memory,
by setting these bits according to Table 9. The protected
blocks then become read−only.
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CAV25010, CAV25020, CAV25040
Table 8. STATUS REGISTER
7
6
5
4
3
2
1
0
1
1
1
1
BP1
BP0
WEL
RDY
Table 9. BLOCK PROTECTION BITS
Status Register Bits
BP1
BP0
0
0
None
No Protection
0
1
CAV25010: 060−07F, CAV25020: 0C0−0FF, CAV25040: 180−1FF
Quarter Array Protection
1
0
CAV25010: 040−07F, CAV25020: 080−0FF, CAV25040: 100−1FF
Half Array Protection
1
1
CAV25010: 000−07F, CAV25020: 000−0FF, CAV25040: 000−1FF
Full Array Protection
Array Address Protected
Protection
WRITE OPERATIONS
instruction to the CAV25010/20/40. Care must be taken to
The CAV25010/20/40 device powers up into a write
take the CS input high after the WREN instruction, as
disable state. The device contains a Write Enable Latch
(WEL) which must be set before attempting to write to the
otherwise the Write Enable Latch will not be properly set.
memory array or to the status register. In addition, the
WREN timing is illustrated in Figure 3. The WREN
address of the memory location(s) to be written must be
instruction must be sent prior to any WRITE or WRSR
outside the protected area, as defined by BP0 and BP1 bits
instruction.
from the status register.
The internal write enable latch is reset by sending the
WRDI instruction as shown in Figure 4. Disabling write
Write Enable and Write Disable
operations by resetting the WEL bit, will protect the device
The internal Write Enable Latch and the corresponding
against inadvertent writes.
Status Register WEL bit are set by sending the WREN
CS
SCK
0
SI
SO
0
0
0
0
1
1
0
HIGH IMPEDANCE
Dashed Line = mode (1, 1)
Figure 3. WREN Timing
CS
SCK
SI
SO
0
0
0
0
0
1
0
HIGH IMPEDANCE
Dashed Line = mode (1, 1)
Figure 4. WRDI Timing
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5
0
CAV25010, CAV25020, CAV25040
Byte Write
Page Write
Once the WEL bit is set, the user may execute a write
sequence, by sending a WRITE instruction, a 8−bit address
and data as shown in Figure 5. For the CAV25040, bit 3 of
the write instruction opcode contains A8 address bit.
Internal programming will start after the low to high CS
transition. During an internal write cycle, all commands,
except for RDSR (Read Status Register) will be ignored.
The RDY bit will indicate if the internal write cycle is in
progress (RDY high), or the device is ready to accept
commands (RDY low).
After sending the first data byte to the CAV25010/20/40,
the host may continue sending data, up to a total of 16 bytes,
according to timing shown in Figure 6. After each data byte,
the lower order address bits are automatically incremented,
while the higher order address bits (page address) remain
unchanged. If during this process the end of page is
exceeded, then loading will “roll over” to the first byte in the
page, thus possibly overwriting previously loaded data.
Following completion of the write cycle, the
CAV25010/20/40 is automatically returned to the write
disable state.
CS
0
1
2
3
4
5
6
7
8
13
14 15
16
17
18 19
20
21
22 23
SCK
OPCODE
SI
0
0
0
0
X*
0
DATA IN
BYTE ADDRESS
1
0
A0 D7 D6 D5 D4 D3 D2 D1 D0
A7
HIGH IMPEDANCE
SO
Dashed Line = mode (1, 1)
* X = 0 for CAV25010, CAV25020. x = A8 for CAV25040
Figure 5. Byte WRITE Timing
CS
0
1
2
3
4
5
6
7
8
13
15 16−23 24−31 16+(N−1)x8−1..16+(N−1)x8
16+Nx8−1
14
SCK
BYTEADDRESS
OPCODE
SI
SO
0
0
0
0
X*
0
1
0
A7
DATA IN
A0
Data Data Data
Byte 1 Byte 2 Byte 3
HIGH IMPEDANCE
Dashed Line = mode (1, 1)
* X = 0 for CAV25010, CAV25020. x = A8 for CAV25040
Figure 6. Page WRITE Timing
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Data Byte N
7..1
0
CAV25010, CAV25020, CAV25040
Write Status Register
Write Protection
The Status Register is written by sending a WRSR
instruction according to timing shown in Figure 7. Only bits
2 and 3 can be written using the WRSR command.
When WP input is low all write operations to the memory
array and Status Register are inhibited. WP going low while
CS is still low will interrupt a write operation. If the internal
write cycle has already been initiated, WP going low will
have no effect on any write operation to the Status Register
or memory array. The WP input timing is shown in Figure 8.
CS
0
1
2
3
4
5
6
7
8
9
1
7
6
10
11
5
4
12
13
14
15
2
1
0
SCK
OPCODE
SI
0
0
0
0
0
0
0
MSB
HIGH IMPEDANCE
SO
Dashed Line = mode (1, 1)
Figure 7. WRSR Timing
tWPS
tWPH
CS
SCK
WP
WP
Dashed Line = mode (1, 1)
Figure 8. WP Timing
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DATA IN
3
CAV25010, CAV25020, CAV25040
READ OPERATIONS
Read from Memory Array
Read Status Register
To read from memory, the host sends a READ instruction
followed by a 8−bit address (for the CAV25040, bit 3 of the
read instruction opcode contains A8 address bit).
After receiving the last address bit, the CAV25010/20/40
will respond by shifting out data on the SO pin (as shown in
Figure 9). Sequentially stored data can be read out by simply
continuing to run the clock. The internal address pointer is
automatically incremented to the next higher address as data
is shifted out. After reaching the highest memory address,
the address counter “rolls over” to the lowest memory
address, and the read cycle can be continued indefinitely.
The read operation is terminated by taking CS high.
To read the status register, the host simply sends a RDSR
command. After receiving the last bit of the command, the
CAV25010/20/40 will shift out the contents of the status
register on the SO pin (Figure 10). The status register may
be read at any time, including during an internal write cycle.
While the internal write cycle is in progress, the RDSR
command will output the full content of the status register.
For easy detection of the internal write cycle completion,
both during writing to the memory array and to the status
register, we recommend sampling the RDY bit only through
the polling routine. After detecting the RDY bit “0”, the next
RDSR instruction will always output the expected content
of the status register.
CS
0
1
2
3
4
5
6
7
8
12 13
9
14 15
16
17
18 19
20
21 22
SCK
OPCODE
SI
0
0
0
0
X*
0
BYTE ADDRESS
1
1
A0
A7
DATA OUT
HIGH IMPEDANCE
SO
D7 D6 D5 D4 D3 D2 D1 D0
Dashed Line = mode (1, 1)
* X = 0 for CAV25010, CAV25020. X = A8 for CAV25040
MSB
Figure 9. READ Timing
CS
0
1
2
3
4
5
6
7
1
0
1
8
9
10
11
7
6
5
4
12
13
14
2
1
SCK
OPCODE
SI
SO
0
0
0
0
0
DATA OUT
HIGH IMPEDANCE
MSB
Dashed Line = mode (1, 1)
Figure 10. RDSR Timing
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3
0
CAV25010, CAV25020, CAV25040
Hold Operation
VCC drops below the POR trigger level. This bi−directional
POR behavior protects the device against ‘brown−out’
failure following a temporary loss of power.
The CAV25010/20/40 device powers up in a write disable
state and in a low power standby mode. A WREN instruction
must be issued prior to any writes to the device.
After power up, the CS pin must be brought low to enter
a ready state and receive an instruction. After a successful
byte/page write or status register write, the device goes into
a write disable mode. The CS input must be set high after the
proper number of clock cycles to start the internal write
cycle. Access to the memory array during an internal write
cycle is ignored and programming is continued. Any invalid
op−code will be ignored and the serial output pin (SO) will
remain in the high impedance state.
The HOLD input can be used to pause communication
between host and CAV25010/20/40. To pause, HOLD must
be taken low while SCK is low (Figure 11). During the hold
condition the device must remain selected (CS low). During
the pause, the data output pin (SO) is tri−stated (high
impedance) and SI transitions are ignored. To resume
communication, HOLD must be taken high while SCK is low.
Design Considerations
The CAV25010/20/40 devices incorporate Power−On
Reset (POR) circuitry which protects the internal logic
against powering up in the wrong state. The device will
power up into Standby mode after VCC exceeds the POR
trigger level and will power down into Reset mode when
CS
tCD
tCD
SCK
tHD
tHD
HOLD
tHZ
HIGH IMPEDANCE
SO
tLZ
Dashed Line = mode (1, 1)
Figure 11. HOLD Timing
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CAV25010, CAV25020, CAV25040
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD−01
ISSUE O
E1
E
SYMBOL
MIN
A
1.35
1.75
A1
0.10
0.25
b
0.33
0.51
MAX
c
0.19
0.25
D
4.80
5.00
E
5.80
6.20
E1
3.80
e
PIN # 1
IDENTIFICATION
NOM
4.00
1.27 BSC
h
0.25
0.50
L
0.40
1.27
θ
0º
8º
TOP VIEW
D
h
A1
θ
A
c
e
b
L
END VIEW
SIDE VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
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CAV25010, CAV25020, CAV25040
PACKAGE DIMENSIONS
TSSOP8, 4.4x3
CASE 948AL−01
ISSUE O
b
SYMBOL
MIN
NOM
A
E1
E
MAX
1.20
A1
0.05
A2
0.80
b
0.19
0.15
0.90
1.05
0.30
c
0.09
D
2.90
3.00
3.10
E
6.30
6.40
6.50
E1
4.30
4.40
4.50
0.20
e
0.65 BSC
L
1.00 REF
L1
0.50
θ
0º
0.60
0.75
8º
e
TOP VIEW
D
A2
c
q1
A
A1
L1
SIDE VIEW
L
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
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CAV25010, CAV25020, CAV25040
ORDERING INFORMATION
Specific
Device
Marking
(Note 10)
Package Type
Temperature
Range
Lead Finish
Shipping
CAV25010VE−G
25010E
SOIC−8, JEDEC
−40°C to +125°C
NiPdAu
Tube, 100 Units / Tube
CAV25010VE−GT3
25010E
SOIC−8, JEDEC
−40°C to +125°C
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAV25010YE−G
S01E
TSSOP−8
−40°C to +125°C
NiPdAu
Tube, 100 Units / Tube
CAV25010YE−GT3
S01E
TSSOP−8
−40°C to +125°C
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAV25020VE−GT3
25020E
SOIC−8, JEDEC
−40°C to +125°C
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAV25020YE−GT3
S02E
TSSOP−8
−40°C to +125°C
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAV25040VE−G
25040E
SOIC−8, JEDEC
−40°C to +125°C
NiPdAu
Tube, 100 Units / Tube
CAV25040VE−GT3
25040E
SOIC−8, JEDEC
−40°C to +125°C
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAV25040YE−GT3
S04E
TSSOP−8
−40°C to +125°C
NiPdAu
Tape & Reel, 3,000 Units / Reel
Device Order
Number
10. Specific Device Marking shows the first row top package marking.
11. All packages are RoHS−compliant (Lead−free, Halogen−free).
12. The standard lead finish is NiPdAu.
13. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
14. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
15. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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