MC10SX1189 D

MC10SX1189
Fibre Channel Coaxial
Cable Driver and Loop
Resiliency Circuit
Description
The MC10SX1189 is a differential receiver, differential transmitter
specifically designed to drive coaxial cables. It incorporates the output
cable drive capability of the MC10EL89 Coaxial Cable Driver with
additional circuitry to multiplex the output cable drive source between
the cable receiver or the local transmitter inputs. The multiplexer
control circuitry is TTL compatible for ease of operation.
The MC10SX1189 is useful as a bypass element for Fibre
Channel-Arbitrated Loop (FC-AL) or Serial Storage Architecture
(SSA) applications, to create loop style interconnects with fault
tolerant, active switches at each device node. This device is
particularly useful for back panel applications where small size is
desirable.
The EL89 style drive circuitry produces swings twice as large as a
standard PECL output. When driving a coaxial cable, proper
termination is required at both ends of the line to minimize reflections.
The 1.6 V output swings allow for proper termination at both ends of
the cable, while maintaining the required swing at the receiving end of
the cable. Because of the larger output swings, the QT, QT outputs are
terminated into the thevenin equivalent of 50 W to VCC − 3.0 V
instead of 50 W to VCC − 2.0 V.
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FIBRE CHANNEL COAXIAL
CABLE DRIVER AND LOOP RESILIENCY CIRCUIT
10SX1189G
AWLYWW
16
1
SOIC
CASE 751B
10SX1189 = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
Features
•
•
•
•
•
•
•
TRUTH TABLE
425 ps Propagation Delay
1.6 V Output Swing on the Cable Driving Output
Operation Range: VCC = 4.5 V to 5.5 V
75 kW Internal Input Pull Down Resistors
>1000 V ESD Protection
Transistor Count = 102
Pb−Free Packages are Available*
VCC
DR
DR
GND
VBB
DT
DT
SEL
16
15
14
13
12
11
10
9
SEL
Function
L
H
DR → QT
DT → QT
PIN NAMES
Pins
Function
DR/DR
QR/QR
Differential Input from Receive Cable
Buffered Differential Output from Receive Cable
Differential Input to Transmit Cable
Buffered Differential Output to
Transmit Cable
Multiplexer Control Signal (TTL)
Positive Power Supply
Ground
Reference Voltage Output
DT/DT
QT/QT
1
2
3
4
5
6
7
QR
QR
VCC
NC
VCC
QT
QT
SEL
VCC
GND
VBB
8
VCC
Figure 1. Pinout: 16-Lead SOIC (Top View)
ORDERING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 4
1
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
MC10SX1189/D
MC10SX1189
LOCAL
RECEIVE DATA
(ECL LEVELS)
QR
QR
DR
DR
FROM
INPUT CABLE
(ECL LEVELS)
VBB
1
LOCAL
TRANSMIT DATA
(ECL LEVELS)
DT
DT
0
QT
QT
TO OUTPUT CABLE
(ENHANCED SWING)
SEL (TTL)
Figure 2. LOGIC DIAGRAM
Table 1. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
Power Supply Voltage (Referenced to GND)
0 to +7.0
Vdc
VIN
Input Voltage (Referenced to GND)
0 to +6.0
Vdc
IOUT
Output Current
50
100
mA
TA
Operating Temperature Range
−40 to +85
°C
TSTG
Storage Temperature Range
−50 to +150
°C
Continuous
Surge
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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2
MC10SX1189
Table 2. DC CHARACTERISTICS (VCC = 5.0 V, VEE = 0 V)
-40°C
Characteristic
Symbol
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
VOH
Output Voltage High (QR,QR)
VCC =5.0 V, GND = 0 V (Notes 1, 2)
3.92
4.05
4.22
3.97
4.11
4.27
4.00
4.16
4.30
V
VOL
Output Voltage Low (QR,QR)
VCC =5.0 V, GND = 0 V (Notes 1, 2)
3.05
3.23
3.35
3.07
3.24
3.37
3.10
3.25
3.41
V
VOH
Output Voltage High (QT,QT)
VCC =5.0 V, GND = 0 V (Notes 1, 3)
3.83
3.95
4.10
3.88
4.02
4.15
3.90
4.09
4.17
V
VOL
Output Voltage Low (QT,QT)
VCC =5.0 V, GND = 0 V (Notes 1, 3)
1.90
2.33
2.50
1.85
2.26
2.45
1.85
2.23
2.45
V
ICC
Quiescent Supply Current (Note 4)
20
25
42
23
27
47
25
28
47
mA
VIH
Input Voltage High (DR,DR & DT,DT)
VCC = 5.0 V, GND = 0 V (Note 1)
3.77
4.11
3.87
4.19
3.94
4.28
V
VIL
Input Voltage Low (DR,DR & DT,DT)
VCC = 5.0 V, GND = 0 V (Note 1)
3.05
3.50
3.05
3.52
3.05
3.56
V
VIH
Input Voltage High SEL
2.0
VIL
Input Voltage Low SEL
VBB
Output Reference Voltage
VCC = 5.0 V, GND = 0 V (Note 1)
IIH
Input HIGH Current
IIL
Input LOW Current
2.0
2.0
0.8
3.57
3.63
3.70
0.8
3.65
150
0.5
V
3.70
3.75
3.69
150
0.5
0.5
3.75
0.8
V
3.81
V
150
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Values will track 1:1 with the VCC supply. VEE can vary +0.5 V to −0.5 V.
2. Outputs loaded with 50 W to VCC − 2.0 V.
3. Outputs loaded with 50 W to VCC − 3.0 V.
4. Outputs open circuited.
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MC10SX1189
Table 3. AC CHARACTERISTICS (VCC = 4.5 V to 5.5 V) (Note 5)
−40°C
Characteristic
Symbol
tPLH,
tPHL
0 to 85°C
Min
Typ
Max
Min
Typ
Max
Unit
ps
Propagation Delay
to Output
DR → QR (Diff)
(SE)
DR → QT (Diff)
(SE)
DT → QT (Diff)
(SE)
175
150
250
225
225
200
300
300
425
425
400
400
450
500
650
700
650
725
225
175
300
250
275
225
325
325
450
450
425
425
500
550
650
700
650
725
Propagation Delay
SEL → QT,QT
450
600
850
500
650
800
Condition
Note 6
Note 7
1.5V to 50% Pt
tr,
tf
Rise Time
Fall Time
QR,QR
100
100
275
275
400
400
125
125
275
275
400
400
ps
20% to 80%
80% to 20%
tr,
tf
Rise Time
Fall Time
QT,QT
150
150
300
300
550
550
150
150
300
300
550
550
ps
20% to 80%
80% to 20%
tskew
Within Device Skew
ps
Note 8
VPP
Minimum Input Swing
200
1000
200
1000
mV
Note 9
VCMR
Common Mode Range
3.00
4.35
3.00
4.35
V
Note 10
15
15
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. VEE can vary +0.5 V to −0.5 V.
6. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the
differential output signals.
7. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal.
8. Duty cycle skew is the difference between tPLH and tPHL propagation delay through a device.
9. Minimum input swing for which AC parameters are guaranteed.
10. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls
within the specified range and the peak-to-peak voltage lies between VPP Min and 1.0 V.
ORDERING INFORMATION
Package
Shipping †
MC10SX1189D
SOIC−16
45 Units / Rail
MC10SX1189DG
SOIC−16
(Pb−Free)
45 Units / Rail
MC10SX1189DR2
SOIC−16
2500 / Tape & Reel
MC10SX1189DR2G
SOIC−16
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC10SX1189
PACKAGE DIMENSIONS
SOIC
CASE 751B−05
ISSUE J
−A−
16
9
1
8
−B−
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
8 PL
0.25 (0.010)
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MC10SX1189/D