MBR40250 D

MBR40250G,
MBR40250TG,
MBRF40250TG,
MBRB40250TG
Switch-mode Schottky
Power Rectifier
250 V, 40 A
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MARKING
DIAGRAMS
4
Features
•
•
•
•
•
TO−220 (2−LEAD)
CASE 221B
250 V Blocking Voltage
Low Forward Voltage Drop, VF = 0.86 V
Soft Recovery Characteristic, TRR < 35 ns
Stable Switching Performance Over Temperature
These Devices are Pb−Free and are RoHS Compliant
3
1, 4
AYWW
B40250G
KA
1
3
4
Benefits
•
•
•
•
TO−220
CASE 221A
T SUFFIX
Reduces or Eliminates Reverse Recovery Oscillations
Minimizes Need for EMI Filtering
Reduces Switching Losses
Improved Efficiency
1
2, 4
3
Applications
•
•
•
•
1
Power Supply
Power Management
Automotive
Instrumentation
2
3
TO−220 FULLPACKt
CASE 221D
T SUFFIX
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 1.9 grams (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
AYWW
B40250TG
AKA
AYWW
B40250TG
AKA
1
2
3
1
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Epoxy Meets UL 94 V−0 at 0.125 in
2
3
4
AY WW
D2PAK 3
CASE 418B
B40250TG
AKA
1
1
3
4
3
B40250 = Device Code
T
= 3 pins
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
KA, AKA = Polarity Designator
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 13
1
Publication Order Number:
MBR40250/D
MBR40250G, MBR40250TG, MBRF40250TG, MBRB40250TG
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
250
V
Average Rectified Forward Current
(Rated VR) TC = 82°C MBR40250, MBR40250T, MBRB40250T
(Rated VR) TC = 46°C MBRF40250T
IF(AV)
40
A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz) TC = 82°C MBR40250, MBR40250T, MBRB40250T
(Rated VR, Square Wave, 20 kHz) TC = 46°C MBRF40250T
IFRM
80
A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
150
A
Storage Temperature
Tstg
*65 to +175
°C
TJ
*65 to +150
°C
dv/dt
10,000
V/ms
Operating Junction Temperature
Voltage Rate of Change (Rated VR)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
°C/W
Maximum Thermal Resistance
Junction−to−Case
MBR40250(T) and MBRB40250T
MBRF40250
Junction−to−Ambient
MBR40250(T)
MBRF40250
MBRB40250T
RqJC
RqJA
2.0
3.0
60
50
50
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 1)
IF = 20 A, TC = 25°C
IF = 20 A, TC = 125°C
IF = 40 A, TC = 25°C
IF = 40 A, TC = 125°C
VF
Maximum Instantaneous Reverse Current (Note 1)
Rated DC Voltage, TC = 25°C
Rated DC Voltage, TC = 125°C
IR
Maximum Reverse Recovery Time
IF = 1.0 A, di/dt = 50 A/ms, TC = 25°C
trr
Value
Unit
V
0.86
0.71
0.97
0.86
mA
0.25
30
ns
35
DYNAMIC CHARACTERISTICS
Capacitance
VR = −5.0 V, TC = 25°C, Frequency = 1.0 MHz
CT
pF
500
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
MBR40250G, MBR40250TG, MBRF40250TG, MBRB40250TG
100
100
IF, MAXIMUM FORWARD CURRENT (A)
IF, INSTANTANEOUS FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
TJ = 150°C
TJ = 125°C
10
TJ = 100°C
TJ = 25°C
1
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TJ = 150°C
10
TJ = 100°C
TJ = 125°C
TJ = 25°C
1
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
VF, MAXIMUM FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E-01
700
1.0E-02
600
1.1
IR, REVERSE CURRENT (A)
TJ = 25°C
C, CAPACITANCE (pF)
TJ = 150°C
TJ = 125°C
1.0E-03
TJ = 100°C
1.0E-04
1.0E-05
1.0E-06
500
400
300
200
100
TJ = 25°C
1.0E-07
25
50
100
75
125
150
175
200
225
0
250
1
10
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
DC
Figure 4. Typical Capacitance
PF(AV), AVERAGE POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 3. Typical Reverse Current
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
100
RATED VOLTAGE
RqJC = 2°C/W
SQUARE WAVE
MBR40250
MBR40250T
MBRB40250T
0 10 20 30 40 50 60 70 80 90 100110 120 130 140150
50
MBR40250
MBR40250T
MBRB40250T
40
30
SQUARE WAVE
20
DC
10
0
0
TC, CASE TEMPERATURE (°C)
5
10
15
20
25
30
35
IO, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating (Case) for
MBR40250, MBR40250T and MBRB40250T
Figure 6. Forward Power Dissipation for
MBR40250, MBR40250T and MBRB40250T
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3
40
MBR40250G, MBR40250TG, MBRF40250TG, MBRB40250TG
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
PF(AV), AVERAGE POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
RATED VOLTAGE
RqJC = 3°C/W
DC
SQUARE WAVE
MBRF40250T
0 10 20 30 40 50 60 70 80 90 100110 120 130 140150
50
MBRF40250T
40
30
SQUARE WAVE
20
DC
10
0
0
TC, CASE TEMPERATURE (°C)
5
10
15
20
25
30
35
40
IO, AVERAGE FORWARD CURRENT (A)
Figure 7. Current Derating (Case) for
MBRF40250T
Figure 8. Forward Power Dissipation for
MBRF40250T
ORDERING INFORMATION
Package
Shipping†
TO−220 (2−LEAD)
(Pb−Free)
50 Units / Rail
TO−220
(Pb−Free)
50 Units / Rail
MBRF40250TG
TO−220 FULLPACK
(Pb−Free)
50 Units / Rail
MBRB40250TG
D2PAK 3
(Pb−Free)
50 Units / Rail
MBRB40250TT4G
D2PAK 3
(Pb−Free)
800 Units / Tape & Reel
Device
MBR40250G
MBR40250TG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MBR40250G, MBR40250TG, MBRF40250TG, MBRB40250TG
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AH
−T−
B
SEATING
PLANE
C
F
T
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
1 2 3
U
H
K
Z
L
R
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
J
G
D
INCHES
MIN
MAX
0.570
0.620
0.380
0.415
0.160
0.190
0.025
0.038
0.142
0.161
0.095
0.105
0.110
0.161
0.014
0.024
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.53
4.07
4.83
0.64
0.96
3.61
4.09
2.42
2.66
2.80
4.10
0.36
0.61
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
N
STYLE 6:
PIN 1.
2.
3.
4.
ANODE
CATHODE
ANODE
CATHODE
TO−220, 2−LEAD
CASE 221B−04
ISSUE F
C
B
Q
F
S
T
DIM
A
B
C
D
F
G
H
J
K
L
Q
R
S
T
U
4
A
1
U
3
H
K
L
R
D
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
J
INCHES
MIN
MAX
0.595
0.620
0.380
0.405
0.160
0.190
0.025
0.039
0.142
0.161
0.190
0.210
0.110
0.130
0.014
0.025
0.500
0.562
0.045
0.060
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
STYLE 1:
PIN 1.
2.
3.
4.
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5
CATHODE
N/A
ANODE
CATHODE
MILLIMETERS
MIN
MAX
15.11
15.75
9.65
10.29
4.06
4.82
0.64
1.00
3.61
4.09
4.83
5.33
2.79
3.30
0.36
0.64
12.70
14.27
1.14
1.52
2.54
3.04
2.04
2.79
1.14
1.39
5.97
6.48
0.000
1.27
MBR40250G, MBR40250TG, MBRF40250TG, MBRB40250TG
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
V
W
−B−
4
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
A
1
2
S
3
−T−
SEATING
PLANE
K
W
J
G
D
H
3 PL
0.13 (0.005)
VARIABLE
CONFIGURATION
ZONE
M
T B
M
N
R
M
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
P
U
L
L
L
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
10.49
8.38
16.155
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
MBR40250G, MBR40250TG, MBRF40250TG, MBRB40250TG
PACKAGE DIMENSIONS
TO−220 FULLPAK
CASE 221D−03
ISSUE K
−T−
−B−
F
SEATING
PLANE
C
S
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
U
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
U
A
1 2 3
H
−Y−
K
G
N
L
D
J
R
3 PL
0.25 (0.010)
M
B
M
INCHES
MIN
MAX
0.617
0.635
0.392
0.419
0.177
0.193
0.024
0.039
0.116
0.129
0.100 BSC
0.118
0.135
0.018
0.025
0.503
0.541
0.048
0.058
0.200 BSC
0.122
0.138
0.099
0.117
0.092
0.113
0.239
0.271
MILLIMETERS
MIN
MAX
15.67
16.12
9.96
10.63
4.50
4.90
0.60
1.00
2.95
3.28
2.54 BSC
3.00
3.43
0.45
0.63
12.78
13.73
1.23
1.47
5.08 BSC
3.10
3.50
2.51
2.96
2.34
2.87
6.06
6.88
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
Y
FULLPAK is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
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PUBLICATION ORDERING INFORMATION
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7
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MBR40250/D