DAP222 D

DAP222, DAP202U
Preferred Device
Common Anode Silicon
Dual Switching Diodes
These Common Anode Silicon Epitaxial Planar Dual Diodes are
designed for use in ultra high speed switching applications. The
DAP222 device is housed in the SC−75/SOT−416 package which is
designed for low power surface mount applications, where board
space is at a premium. The DAP202U device is housed in the
SC−70/SOT−323 package.
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ANODE
3
Features
• Fast trr
• Low CD
• Pb−Free Packages are Available
1
2
CATHODE
MARKING
DIAGRAMS
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
VR
80
Vdc
VRM
80
Vdc
IF
100
mAdc
Peak Forward Current
IFM
300
mAdc
Peak Forward Surge Current
IFSM(1)
2.0
Adc
Reverse Voltage
Peak Reverse Voltage
Forward Current
Rating
2
1
Symbol
Max
Unit
Power Dissipation
PD
150
mW
Junction Temperature
TJ
150
°C
Storage Temperature
Tstg
−55 ~ + 150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
P9 M G
G
1
3
1
THERMAL CHARACTERISTICS
SC−75
CASE 463
STYLE 4
3
NB M G
G
SC−70
CASE 419
2
1
P9, NB = Device Codes
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or orientation may
vary depending upon manufacturing location.
ORDERING INFORMATION
Package
Shipping †
SC−75
3000 / Tape & Reel
DAP222G
SC−75
(Pb−Free)
3000 / Tape & Reel
DAP202U
SC−70
3000 / Tape & Reel
DAP202UG
SC−70
(Pb−Free)
3000 / Tape & Reel
DAP222T1
SC−75
3000 / Tape & Reel
SC−75
(Pb−Free)
3000 / Tape & Reel
Device
DAP222
DAP222T1G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2005
October, 2005 − Rev. 5
1
Publication Order Number:
DAP222/D
DAP222, DAP202U
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Condition
Min
Max
Unit
Reverse Voltage Leakage Current
IR
VR = 70 V
−
0.1
mAdc
Forward Voltage
VF
IF = 100 mA
−
1.2
Vdc
Reverse Breakdown Voltage
VR
IR = 100 mA
80
−
Vdc
Diode Capacitance
CD
VR = 6.0 V, f = 1.0 MHz
−
3.5
pF
trr(2)
ttt(3)
IF = 5.0 mA, VR = 6.0 V, RL = 100 W, Irr = 0.1 IR
IF = 5.0 mA, VR = 6.0 V, RL = 50 W, Irr = 0.1 IR
−
−
4.0
10.0
ns
Reverse Recovery Time
1.
2.
3.
DAP222
DAP202U
t = 1 mS
trr Test Circuit for DAP222 in Figure 4.
trr Test Circuit for DAP202U in Figure 5.
TYPICAL ELECTRICAL CHARACTERISTICS
10
IR , REVERSE CURRENT (μA)
TA = 85°C
10
TA = −40°C
1.0
0.1
TA = 25°C
0.2
0.4
0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
0.001
1.2
TA = 150°C
TA = 25°C
0
10
Figure 1. Forward Voltage
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Reverse Current
1.75
CD, DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
100
1.5
1.25
1.0
0.75
0
2
4
6
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Diode Capacitance
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2
8
50
DAP222, DAP202U
tr
tp
t
IF
trr
t
10%
A
RL
Irr = 0.1 IR
90%
VR
IF = 5.0 mA
VR = 6 V
RL = 100 W
tp = 2 ms
tr = 0.35 ns
INPUT PULSE
RECOVERY TIME EQUIVALENT TEST CIRCUIT
OUTPUT PULSE
Figure 4. Reverse Recovery Time Test Circuit for the DAP222
tr
tp
t
IF
trr
t
10%
A
RL
Irr = 0.1 IR
90%
VR
tp = 2 ms
tr = 0.35 ns
INPUT PULSE
RECOVERY TIME EQUIVALENT TEST CIRCUIT
Figure 5. Reverse Recovery Time Test Circuit for the DAP202U
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3
IF = 5.0 mA
VR = 6 V
RL = 100 W
OUTPUT PULSE
DAP222, DAP202U
PACKAGE DIMENSIONS
SC−75 (SOT−416)
CASE 463−01
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
−E−
2
3
b 3 PL
0.20 (0.008)
e
−D−
DIM
A
A1
b
C
D
E
e
L
HE
1
M
D
0.20 (0.008) E
HE
C
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
A
L
MILLIMETERS
MIN
NOM MAX
0.70
0.80
0.90
0.00
0.05
0.10
0.15
0.20
0.30
0.10
0.15
0.25
1.55
1.60
1.65
0.70
0.80
0.90
1.00 BSC
0.10
0.15
0.20
1.50
1.60
1.70
A1
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
INCHES
NOM MAX
0.031 0.035
0.002 0.004
0.008 0.012
0.006 0.010
0.063 0.067
0.031 0.035
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
MIN
0.027
0.000
0.006
0.004
0.059
0.027
DAP222, DAP202U
PACKAGE DIMENSIONS
SC−70 (SOT−323)
CASE 419−04
ISSUE M
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
e1
3
E
HE
1
2
b
e
A
0.05 (0.002)
c
A2
DIM
A
A1
A2
b
c
D
E
e
e1
L
HE
MIN
0.80
0.00
0.30
0.10
1.80
1.15
1.20
2.00
MILLIMETERS
NOM
MAX
0.90
1.00
0.05
0.10
0.7 REF
0.35
0.40
0.18
0.25
2.10
2.20
1.24
1.35
1.30
1.40
0.65 BSC
0.425 REF
2.10
2.40
MIN
0.032
0.000
0.012
0.004
0.071
0.045
0.047
0.079
INCHES
NOM
0.035
0.002
0.028 REF
0.014
0.007
0.083
0.049
0.051
0.026 BSC
0.017 REF
0.083
MAX
0.040
0.004
0.016
0.010
0.087
0.053
0.055
0.095
L
A1
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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5
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DAP222/D
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