NCP2809 D

NCP2809 Series
NOCAPt 135 mW Stereo
Headphone Power Amplifier
The NCP2809 is a cost−effective stereo audio power amplifier
capable of delivering 135 mW of continuous average power per
channel into 16 loads.
The NCP2809 audio power amplifier is specifically designed to
provide high quality output power from low supply voltage,
requiring very few external components. Since NCP2809 does not
require bootstrap capacitors or snubber networks, it is optimally
suited for low−power portable systems. NCP2809A has an internal
gain of 0 dB while specific external gain can externally be set with
NCP2809B.
If the application allows it, the virtual ground provided by the
device can be connected to the middle point of the headset (Figure 1).
In such case, the two external heavy coupling capacitors typically
used can be removed. Otherwise, you can also use both outputs in
single ended mode with external coupling capacitors (Figure 43).
Due to its excellent Power Supply Rejection Ratio (PSRR), it can
be directly connected to the battery, saving the use of an LDO.
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MARKING
DIAGRAM
1
x
•
•
•
•
•
•
A
L
Y
W
G
•
•
•
•
Typical Applications
•
•
•
•
Cellular Phone
Portable Stereo
MP3 Player
Personal and Notebook Computers
2809B
ALYWG
G
10 PIN DFN
MU SUFFIX
CASE 506AT
Features
135 mW to a 16 Load from a 5.0 V Power Supply
Excellent PSRR (85 dB Typical): Direct Connection to the Battery
“Pop and Click” Noise Protection Circuit
Ultra Low Current Shutdown Mode
2.2 V–5.5 V Operation
Outstanding Total Harmonics Distortion + Noise (THD+N): Less
than 0.01%
External Turn−on and Turn−off Configuration Capability
Thermal Overload Protection Circuitry
NCP2809B available in Ultra Thin UDFN Package (3x3)
Pb−Free Packages are Available
MAx
AYWG
G
Micro10
DM SUFFIX
CASE 846B
10
= E for NCP2809A
C for NCP2809B
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
IN_R
1
10
SD
BYP
2
3
9
8
REF_I
4
7
VP
IN_L
5
6
OUT_L
OUT_R
VM
OUT_I
(Top View)
Micro10
IN_R
1
10
SD
BYP
2
3
9
8
REF_I
4
7
VP
IN_L
5
6
OUT_L
OUT_R
VM
OUT_I
(Top View)
UDFN10
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 22 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
April, 2008 − Rev. 11
1
Publication Order Number:
NCP2809/D
NCP2809 Series
VP
1 F
CS
VP
CI
AUDIO
INPUT
20 k
IN_L
390 nF
VP
BYPASS
Cbypass
20 k
BYPASS
+
OUT_L
+
-
OUT_I
HEADPHONE JACK
LEFT
VMC
BRIDGE
SLEEVE
1 F
REF_I
CI
AUDIO
INPUT
IN_R
20 k
390 nF
20 k
SHUTDOWN
VIH
RIGHT
OUT_R
+
-
VM
VIL
SHUTDOWN
CONTROL
Figure 1. NCP2809A Typical Application Schematic without Output Coupling Capacitor
(NOCAP Configuration)
VP
1 F
CS
VP
AUDIO
INPUT
CI
20 k
IN_L
390 nF
VP
BYPASS
CI
BYPASS
VMC
BRIDGE
1 F
AUDIO
INPUT
20 k
+
OUT_L
+
-
OUT_I
Cout
REF_I
OUT_R
+
-
IN_R
HEADPHONE JACK
LEFT
NC
NC
220 F
+
SLEEVE
RIGHT
Cout
20 k
390 nF
220 F
+
20 k
SHUTDOWN
VIH
VIL
VM
SHUTDOWN
CONTROL
Figure 2. NCP2809A Typical Application Schematic with Output Coupling Capacitor
TIP
(LEFT)
RING
SLEEVE
(RIGHT)
Figure 3. Typical 3−Wire Headphone Plug
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2
NCP2809 Series
20 k
VP
1 F
AUDIO
INPUT
CI
20 k
VP
IN_L
390 nF
VP
BYPASS
Cbypass
AUDIO
INPUT
CI
CS
BYPASS
+
OUT_L
+
-
OUT_I
HEADPHONE JACK
LEFT
VMC
BRIDGE
SLEEVE
1 F
20 k
REF_I
OUT_R
+
-
IN_R
RIGHT
390 nF
SHUTDOWN
SHUTDOWN
CONTROL
VM
VIH
VIL
20 k
Figure 4. NCP2809B Typical Application Schematic without Output Coupling Capacitor
(NOCAP Configuration)
20 k
VP
1 F
CS
VP
AUDIO
INPUT
CI
20 k
IN_L
VP
390 nF
BYPASS
1 F
Cbypass
AUDIO
INPUT
CI
20 k
BYPASS
VMC
BRIDGE
+
OUT_L
+
-
OUT_I
IN_R
390 nF
SHUTDOWN
VIH
VIL
VM
Cout
REF_I
+
-
220 F
+
OUT_R
HEADPHONE JACK
LEFT
NC
SLEEVE
NC
220 F
+
RIGHT
Cout
SHUTDOWN
CONTROL
20 k
Figure 5. NCP2809B Typical Application Schematic with Output Coupling Capacitor
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3
NCP2809 Series
PIN FUNCTION DESCRIPTION
Pin
Type
Symbol
1
I
IN_R
2
I
SHUTDOWN
3
I
BYPASS
4
O
REF_I
5
I
IN_L
6
O
OUT_L
7
I
VP
8
O
OUT_I
9
I
VM
10
O
OUT_R
Description
Negative input of the second amplifier. It receives the audio input signal. Connected to the input
capicator Cin (NCP2809A) or the external Rin (NCP2809B).
The device enters in shutdown mode when a a low level is applied on this pin.
Bypass capacitor pin which provides the common mode voltage (VP/2).
Virtual ground amplifier feed back. This pin sets the stereo headset ground. In order to improve
crosstalk, this pin must be connected as close as possible to the ground connection of the headset
(ideally at the ground pin of the headset connector). When one uses bypassing capacitors, this pin
must be left unconnected.
Negative input of the first amplifier. It receives the audio input signal. Connected to the input
capacitor Cin (NCP2809A) or the external Rin (NCP2809B).
Stereo headset amplifier analog output left. This pin will output the amplified analog signal and,
depending on the application, must be coupled with a capacitor or directly connected to the left
loudspeaker of the headset. This output is able to drive a 16 load in a single−ended configuration.
Positive analog supply of the cell. Range: 2.2 V – 5.5 V
Virtual ground for stereo Headset common connection. This pin is directly connected to the
common connection of the headset when use of bypassing capacitor is not required. When one
uses bypassing capacitors, this pin must be left unconnected.
Analog Ground
Stereo headset amplifier analog output right. This pin will output the amplified analog signal and,
depending on the application, must be coupled with a capacitor or directly connected to the right
loudspeaker of the headset. This output is able to drive a 16 load in a single−ended configuration.
MAXIMUM RATINGS (TA = +25°C)
Symbol
Value
Unit
Vp
6.0
V
Op Vp
2.2 to 5.5
V
Input Voltage
Vin
−0.3 to VCC + 0.3
V
Max Output Current
Iout
250
mA
Power Dissipation
Pd
Internally Limited
−
Operating Ambient Temperature
TA
−40 to +85
°C
Max Junction Temperature
TJ
150
°C
Tstg
−65 to +150
°C
RJA
200
240
°C/W
−
8000
200
V
±100
mA
Rating
Supply Voltage
Operating Supply Voltage
Storage Temperature Range
Thermal Resistance, Junction−to−Air
ESD Protection
Micro10
UDFN
Human Body Model (HBM) (Note 1)
Machine Model (MM) (Note 2)
Latch up current at Ta = 85_C (Note 3)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Human Body Model, 100 pF discharged through a 1.5 k resistor following specification JESD22/A114 8.0 kV can be applied on OUT_L,
OUT_R, REF_I and OUT_I outputs. For other pins, 2.0 kV is the specified voltage.
2. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
3. Maximum ratings per JEDEC standard JESD78.
*This device contains 752 active transistors and 1740 MOS gates.
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4
NCP2809 Series
ELECTRICAL CHARACTERISTICS All the parameters are given in the capless configuration (typical application).
The following parameters are given for the NCP2809A and NCP2809B mounted externally with 0 dB gain, unless otherwise noted.
(For typical values TA = 25°C, for min and max values TA = −40°C to 85°C, TJmax = 125°C, unless otherwise noted.)
Characteristic
Min
(Note 4)
Typ
Max
(Note 4)
1.54
1.84
2.8
3.6
1.0
+25
mV
10
600
nA
Symbol
Conditions
IDD
Vin = 0 V, RL = 16 Vp = 2.4 V
Vp = 5.0 V
Output Offset Voltage
Voff
Vp = 2.4 V
Vp = 5.0 V
Shutdown Current
ISD
Vp = 5.0 V
Shutdown Voltage High (Note 5)
VSDIH
−
Shutdown Voltage Low
VSDIL
−
Turning On Time (Note 6)
TWU
Cby = 1.0 F
285
ms
Turning Off Time (Note 6)
TSD
Cby = 1.0 F
50
ms
Vloadpeak
Vp = 2.4 V, RL = 16 Vp = 5.0 V, RL = 16 0.9
2.05
V
Supply Quiescent Current
Max Output Swing
Max Rms Output Power
POrms
mA
−25
1.2
V
0.4
0.82
1.94
Vp = 2.4 V, RL = 32 Vp = 5.0 V, RL = 32 1.04
2.26
Vp = 2.4 V, RL = 16 , THD+N<0.1%
Vp = 5.0 V, RL = 16 , THD+N<0.1%
24
131
Vp = 2.4 V, RL = 32 , THD+N<0.1%
Vp = 5.0 V, RL = 32 , THD+N<0.1%
17
80
Voltage Gain
G
NCP2809A only
Input Impedance
Zin
NCP2809A only
20
Crosstalk
CS
f = 1.0 kHz
Vp = 2.4 V, RL = 16 , Pout = 20 mW
Vp = 2.4 V, RL = 32 , Pout = 10 mW
−63.5
−72.5
Vp = 3.0 V, RL = 16 , Pout = 30 mW
Vp = 3.0 V, RL = 32 , Pout = 20 mW
−64
−73
Vp = 5.0 V, RL = 16 , Pout = 75 mW
Vp = 5.0 V, RL = 32 , Pout = 50 mW
−64
−73
f = 1.0 kHz
Vp = 2.4 V, RL = 16 , Pout = 20 mW
Vp = 2.4 V, RL = 32 , Pout = 10 mW
88.3
89
Vp = 3.0 V, RL = 16 , Pout = 30 mW
Vp = 3.0 V, RL = 32 , Pout = 20 mW
90.5
92
Vp = 5.0 V, RL = 16 , Pout = 75 mW
Vp = 5.0 V, RL = 32 , Pout = 50 mW
95.1
96.1
Signal to Noise Ratio
SNR
4. Min/Max limits are guaranteed by production test.
5. At TA = −40°C, the minimum value is set to 1.5 V.
6. See page 10 for a theoretical approach to these parameters.
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5
Unit
−0.5
0
V
mW
+0.5
dB
k
dB
dB
NCP2809 Series
ELECTRICAL CHARACTERISTICS All the parameters are given in the capless configuration (typical application).
The following parameters are given for the NCP2809A and NCP2809B mounted externally with 0 dB gain, unless otherwise noted.
(For typical values TA = 25°C, for min and max values TA = −40°C to 85°C, TJmax = 125°C, unless otherwise noted.)
Characteristic
Positive Supply Rejection Ratio
Positive Supply Rejection Ratio
Min
(Note 7)
Symbol
Conditions
PSRR V+
RL = 16 Vpripple_pp = 200 mV
Cby = 1.0 F
Input Terminated with 10 NCP2809A
F = 217 Hz
Vp = 5.0 V
Vp = 2.4 V
−73
−82
F = 1.0 kHz
Vp = 5.0 V
Vp = 2.4 V
−73
−85
Max
(Note 7)
Unit
dB
RL = 16 Vpripple_pp = 200 mV
Cby = 1.0 F
Input Terminated with 10 NCP2809B
with 0 dB External Gain
F = 217 Hz
Vp = 5.0 V
Vp = 2.4 V
−80
−82
F = 1.0 kHz
Vp = 5.0 V
Vp = 2.4 V
−81
−81
VP = 5.0 V, RL = 16 = 135 mW
63
%
Thermal Shutdown Temperature
(Note 8)
Tsd
−
160
°C
Total Harmonic Distortion + Noise
(Note 9)
THD+N
VP = 2.4 V, f = 1.0 kHz
RL = 16 , Pout = 20 mW
RL = 32 , Pout = 15 mW
0.006
0.004
VP = 5.0 V, f = 1.0 kHz
RL = 16 , Pout = 120 mW
RL = 32 , Pout = 70 mW
0.005
0.003
Efficiency
PSRR V+
Typ
dB
%
7. Min/Max limits are guaranteed by production test.
8. This thermal shutdown is made with an hysteresis function. Typically, the device turns off at 160°C and turns on again when the junction
temperature is less than 140°C.
9. The outputs of the device are sensitive to a coupling capacitor to Ground. To ensure THD+N at very low level for any sort of headset
(16 or 32 , outputs (OUT_R, OUT_L, OUT_I and REF_I) must not be grounded with more than 500 pF.
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6
NCP2809 Series
10
10
1
1
THD+N (%)
THD+N (%)
TYPICAL CHARACTERISTICS
0.1
0.01
0.001
10
0.1
0.01
100
1000
10000
FREQUENCY (Hz)
0.001
10
100000
10
10
1
1
0.1
0.01
0.001
10
0.01
100
1000
10000
FREQUENCY (Hz)
0.001
10
100000
100
1000
10000
FREQUENCY (Hz)
100000
Figure 9. THD+N vs. Frequency
Vp = 3.0 V, RL = 32 , Pout = 20 mW
10
10
1
1
THD+N (%)
THD+N (%)
100000
0.1
Figure 8. THD+N vs. Frequency
Vp = 3.0 V, RL = 16 , Pout = 30 mW
0.1
0.01
0.001
10
1000
10000
FREQUENCY (Hz)
Figure 7. THD+N vs. Frequency
Vp = 5.0 V, RL = 32 , Pout = 50 mW
THD+N (%)
THD+N (%)
Figure 6. THD+N vs. Frequency
Vp = 5.0 V, RL = 16 , Pout = 75 mW
100
0.1
0.01
100
1000
10000
FREQUENCY (Hz)
100000
0.001
10
Figure 10. THD+N vs. Frequency
Vp = 2.4 V, RL = 16 , Pout = 20 mW
100
1000
10000
FREQUENCY (Hz)
Figure 11. THD+N vs. Frequency
Vp = 2.4 V, RL = 32 , Pout = 10 mW
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7
100000
NCP2809 Series
10
10
1
1
THD+N (%)
THD+N (%)
TYPICAL CHARACTERISTICS
0.1
0.01
0.001
0
0.1
0.01
20
40
60
80
100
120
140
0.001
0
160
10
20
30
OUTPUT POWER (mW)
1
1
THD+N (%)
THD+N (%)
10
0.1
0.01
70
80
90
0.1
0.01
10
20
30
40
50
0.001
0
60
10
OUTPUT POWER (mW)
20
30
40
OUTPUT POWER (mW)
Figure 14. THD+N vs. Power Out
Vp = 3.3 V, RL = 16 , 1.0 kHz
Figure 15. THD+N vs. Power Out
Vp = 3.3 V, RL = 32 , 1.0 kHz
10
10
1
1
THD+N (%)
THD+N (%)
60
Figure 13. THD+N vs. Power Out
Vp = 5.0 V, RL = 32 , 1.0 kHz
10
0.1
0.01
0.001
0
50
OUTPUT POWER (mW)
Figure 12. THD+N vs. Power Out
Vp = 5.0 V, RL = 16 , 1.0 kHz
0.001
0
40
0.1
0.01
10
20
30
40
0.001
0
50
OUTPUT POWER (mW)
5
10
15
20
25
30
OUTPUT POWER (mW)
Figure 17. THD+N vs. Power Out
Vp = 3.0 V, RL = 32 , 1.0 kHz
Figure 16. THD+N vs. Power Out
Vp = 3.0 V, RL = 16 , 1.0 kHz
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35
NCP2809 Series
10
10
1
1
THD+N (%)
THD+N (%)
TYPICAL CHARACTERISTICS
0.1
0.01
0.001
0.1
0.01
0
5
10
15
20
25
0.001
30
0
5
OUTPUT POWER (mW)
−50
−50
CROSSTALK (dB)
CROSSTALK (dB)
−40
−80
10
100
1000
10000
100000
−60
−70
−80
10
100
FREQUENCY (Hz)
−50
−50
CROSSTALK (dB)
CROSSTALK (dB)
−40
−60
−70
1000
10000
100000
Figure 21. Crosstalk
Vp = 5.0 V, RL = 32 , Pout = 50 mW
−40
100
1000
FREQUENCY (Hz)
Figure 20. Crosstalk
Vp = 5.0 V, RL = 16 , Pout = 75 mW
−80
10
20
Figure 19. THD+N vs. Power Out
Vp = 2.4 V, RL = 3.2 , 1.0 kHz
−40
−70
15
OUTPUT POWER (mW)
Figure 18. THD+N vs. Power Out
Vp = 2.4 V, RL = 16 , 1.0 kHz
−60
10
10000
100000
−60
−70
−80
10
FREQUENCY (Hz)
100
1000
10000
FREQUENCY (Hz)
Figure 23. Crosstalk
Vp = 3.0 V, RL = 32 , Pout = 20 mW
Figure 22. Crosstalk
Vp = 3.0 V, RL = 16 , Pout = 30 mW
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100000
NCP2809 Series
−40
−40
−50
−50
CROSSTALK (dB)
CROSSTALK (dB)
TYPICAL CHARACTERISTICS
−60
−70
−80
10
100
1000
10000
−60
−70
−80
10
100000
100
FREQUENCY (Hz)
−10
−10
−20
NCP2809A
−30
−30
−40
−40
−50
−50
PSRR (dB)
PSRR (dB)
−20
−60
−70
−70
−80
−90
−90
−100
−100
100
1000
10000
100000
NCP2809A
−60
−80
−110
10
100
FREQUENCY (Hz)
10000
100000
Figure 27. PSRR − Input Grounded with 10 Vp = 2.4 V, Vripple = 200 mV pk−pk, RL = 32 −10
−10
−20
−20
NCP2809A
−30
−30
−40
−40
−50
−50
PSRR (dB)
PSRR (dB)
1000
FREQUENCY (Hz)
Figure 26. PSRR − Input Grounded with 10 Vp = 2.4 V, Vripple = 200 mV pk−pk, RL =16 −60
−70
−70
−80
−90
−90
−100
−100
100
1000
10000
100000
NCP2809A
−60
−80
−110
10
100000
Figure 25. Crosstalk
Vp = 2.4 V, RL = 32 , Pout = 10 mW
Figure 24. Crosstalk
Vp = 2.4 V, RL = 16 , Pout = 20 mW
−110
10
1000
10000
FREQUENCY (Hz)
−110
10
100
FREQUENCY (Hz)
1000
10000
100000
FREQUENCY (Hz)
Figure 29. PSRR − Input Grounded with 10 Vp =3.0 V, Vripple = 200 mV pk−pk, RL = 32 Figure 28. PSRR − Input Grounded with 10 Vp = 3.0 V, Vripple = 200 mV pk−pk, RL =16 http://onsemi.com
10
NCP2809 Series
TYPICAL CHARACTERISTICS
−10
−10
−20
NCP2809A
−30
−30
−40
−40
−50
−50
PSRR (dB)
PSRR (dB)
−20
−60
−70
−80
−60
−70
−80
−90
−90
−100
−100
−110
10
NCP2809A
100
1000
10000
100000
−110
10
100
FREQUENCY (Hz)
−10
100000
−10
−20
−20
NCP2809A
−30
−30
−40
−40
−50
−50
PSRR (dB)
PSRR (dB)
10000
Figure 31. PSRR − Input Grounded with 10 Vp = 3.3 V, Vripple = 200 mV pk−pk, RL = 32 Figure 30. PSRR − Input Grounded with 10 Vp = 3.3 V, Vripple = 200 mV pk−pk, RL =16 −60
−70
−70
−80
−90
−90
−100
−100
100
1000
10000
100000
NCP2809A
−60
−80
−110
10
1000
FREQUENCY (Hz)
−110
10
100
FREQUENCY (Hz)
1000
10000
100000
FREQUENCY (Hz)
Figure 32. PSRR − Input Grounded with 10 Vp = 5.0 V, Vripple = 200 mV pk−pk, RL =16 Figure 33. PSRR − Input Grounded with 10 Vp = 5.0 V, Vripple = 200 mV pk−pk, RL = 32 http://onsemi.com
11
NCP2809 Series
TYPICAL CHARACTERISTICS
−10
−10
−20
NCP2809B
−30
−30
−40
−40
PSRR (dB)
PSRR (dB)
−20
−50
−60
−70
−80
−50
−60
−70
−80
−90
−90
−100
−100
−110
NCP2809B
10
100
1000
10000
100000
−110
10
100
FREQUENCY (Hz)
100000
Figure 35. PSRR − Input Grounded with 10 Vp = 5.0 V, Vripple = 200 mV pk−pk, RL = 16 ,
G = 1 (0 dB)
−10
−10
−20
−20
NCP2809B
−30
NCP2809B
−30
−40
PSRR (dB)
−40
PSRR (dB)
10000
FREQUENCY (Hz)
Figure 34. PSRR − Input Grounded with 10 Vp = 2.4 V, Vripple = 200 mV pk−pk, RL =16 ,
G = 1 (0 dB)
G=4
−50
−60
G=1
−70
−80
G=4
−50
−60
G=1
−70
−80
−90
−90
−100
−100
−110
1000
10
100
1000
10000
100000
−110
10
100
FREQUENCY (Hz)
1000
10000
100000
FREQUENCY (Hz)
Figure 37. PSRR − Input Grounded with 10 Vp = 5.0 V, Vripple = 200 mV pk−pk, RL = 16 ,
G = 1 (0 dB) and G = 4 (12 dB)
Figure 36. PSRR − Input Grounded with 10 Vp = 2.4 V, Vripple = 200 mV pk−pk, RL =16 ,
G = 1 (0 dB) and G = 4 (12 dB)
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12
NCP2809 Series
TYPICAL CHARACTERISTICS
Figure 38. Turning–On Time/Vp = 5.0 V
and F = 100 Hz
Ch1 = OUT_R, Ch2 = VMC and Ch3 = Shutdown
Figure 39. Turning–On Time Zoom/Vp = 5.0 V
and F = 400 Hz
Ch1 = OUT_R, Ch2 = VMC and Ch3 = Shutdown
Figure 40. Turning–Off Time/Vp = 5.0 V
and F = 100 Hz
Ch1 = OUT_R, Ch2 = VMC and Ch3 = Shutdown
Figure 41. TurningOff Time Zoom/Vp = 5.0 V
and F = 400 Hz
Ch1 = OUT_R, Ch2 = VMC and Ch3 = Shutdown
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13
NCP2809 Series
APPLICATION INFORMATION
Current Limit Protection Circuitry
The maximum output power of the circuit (POrms =
135 mW, VP = 5.0 V, RL = 16 ) requires a peak current in
the load of 130 mA.
In order to limit excessive power dissipation in the load
when a short−circuit occurs, the current limit in the load is
fixed to 250 mA. The current in the output MOS transistors
is real−time monitored, and when exceeding 250 mA, the
gate voltage of the corresponding MOS transistor is clipped
and no more current can be delivered.
Detailed Description
The NCP2809 power audio amplifier can operate from
2.6 V to 5.0 V power supply. It delivers 24 mWrms output
power to a 16 load (VP = 2.4 V) and 131 mWrms output
power to a 16 load (VP = 5.0 V).
The structure of NCP2809 is basically composed of two
identical internal power amplifiers; NCP2809A has a fixed
internal gain of 0 dB and the gain can be set externally with
the NCP2809B.
Internal Power Amplifier
The output Pmos and Nmos transistors of the amplifier are
designed to deliver the specified output power without
clipping. The channel resistance (Ron) of the Nmos and Pmos
transistors does not exceed 3.0 when driving current.
The structure of the internal power amplifier is
composed of three symmetrical gain stages, first and
medium gain stages are transconductance gain stages in
order to maximize bandwidth and DC gain.
Thermal Overload Protection Circuitry
Internal amplifiers are switched off when temperature
exceeds 160°C, and will be switched back on only when the
temperature goes below 140°C.
NCP2809 is a stereo power audio amplifier.
If the application requires a Single Ended topology with
output coupling capacitors, then the current provided by
the battery for one output is as following:
• VO(t) is the AC voltage seen by the load. Here we
consider a sine wave signal with a period T and a peak
voltage VO.
• RL is the load.
Turn−On and Turn−Off Transitions
A Turn−on/off transition is shown in the following plot
corresponding to curves in Figures 38 to 41.
In order to eliminate “pop and click” noises during
transitions, output power in the load must be slowly
established or cut. When logic high is applied to the
shutdown pin, the bypass voltage begins to rise
exponentially and once the output DC level is around the
common mode voltage, the gain is established slowly
(50 ms). This way to turn−on the device is optimized in
terms of rejection of “pop and click” noises.
A theoretical value of turn−on time at 25°C is given by
the following formula.
Cby: Bypass Capacitor
R: Internal 300 k resistor with a 25% accuracy
Ton = 0.95 * R * Cby
When logic is turned low on shutdown pin, the device
enters in shutdown mode:
− 50 ms later the audio signal is cut off as the gain is
turned to zero internally as shown in Figure 41.
− 385 ms later, the DC signal will reach 0.7 V due to
exponential discharge of the bypass voltage. It is then tied
to Ground as shown in Figure 40.
A theoretical approach of this time is:
Toff = R * Cby * Ln(Vp/1.4)
Ip(t)
VO/RL
T/2
T
TIME
So, the total power delivered by the battery to the device is:
PTOT + Vp
Ipavg
Ipavg + 1
2
ŕ 0 RVoL sin(t)dt + .RVoL
Vp.Vo
PTOT +
.RL
The power in the load is POUT.
V 2
POUT + O
2RL
Shutdown Function
The device enters shutdown mode when shutdown signal
is low. During the shutdown mode, the DC quiescent
current of the circuit does not exceed 600 nA.
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14
NCP2809 Series
The dissipated power by the device is
PD + PTOT * POUT
PD + PTOT * POUT
ƪVP * V2Oƫ
V
PD + o
RL
At a given power supply voltage, the maximum power
dissipated happens when VO = Vp/2.
At a given power supply voltage, the maximum power
dissipated is:
PDmax +
PDmax +
VP2
22.RL
ƪ
0.19VP2
RL
Of course, if the device is used in a typical stereo
application, each load with the same output power will give
the same dissipated power. Thus the total lost power for the
device is:
Of course, if the device is used in a typical stereo
application, each load with the same output power will give
the same dissipated power. Thus the total lost power for the
device is:
V
PD + o
RL
ƪ2VP * V2Oƫ
V
PD + o
RL
V
PD + o
RL
ƫ
2VP * V
O
ƪ4VP * VOƫ
And in this case, the maximum power dissipated will be:
And in this case, the maximum power dissipated will be:
PDmax +
V 2
PDmax + P
2.RL
0.38VP2
RL
In NOCAP operation, the efficiency is:
In single ended operation, the efficiency is:
+
.VO
+
2VP
.VO
4VP
Gain−Setting Selection
With NCP2809 Audio Amplifier family, you can select
a closed−loop gain of 0db for the NCP2809A and an
external gain setting with the NCP2809B. In order to
optimize device and system performance, NCP2809 needs
to be used in low gain configurations. It minimizes THD+N
values and maximizes the signal−to−noise ratio, and the
amplifier can still be used without running into the
bandwidth limitations.
NCP2809A can be used when a 0 dB gain is required.
Adjustable gain is available on NCP2809B.
If the application requires a NOCAP scheme without
output coupling capacitors, then the current provided by
the battery for one output is as following:
• Vo(t) is the AC voltage seen by the load. Here we
consider a sine wave signal with a period T and a peak
voltage VO.
• RL is the load.
Ip(t)
VO/RL
NCP2809 Amplifier External Components
T/2
T
Input Capacitor Selection (Cin)
TIME
The input coupling capacitor blocks the DC voltage at
the amplifier input terminal. This capacitor creates a
high−pass filter with the internal (A version with 20 k) or
external (B version) resistor. Its cut−off frequency is given
by:
So, the total power delivered by the battery to the device is:
PTOT + Vp
Ipavg + 1
Ipavg
2Vo
ŕ 0 RVoL sin(t)dt + .R
L
1
fc +
2 * * Rin * Cin
(eq. 1)
The size of the capacitor must be large enough to couple
in low frequencies without severe attenuation. However a
large input coupling capacitor requires more time to reach
its quiescent DC voltage (VP/2) and can increase the
turn−on pops.
An input capacitor value of 100 nF performs well in
many applications (in case of Rin = 20 k).
2Vp.Vo
PTOT +
.RL
The power in the load is POUT
V 2
POUT + O
2RL
The dissipated power by the device is
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15
NCP2809 Series
Bypass Capacitor Selection (Cbypass)
To obtain a frequency equal to when frequency is 5 times
the cut off frequency, attenuation is 0.5 dB. So if we want
a ±0.5 dB at 150 Hz, we need to have a –3 dB cut off
frequency of 30 Hz:
The bypass capacitor Cby provides half−supply filtering
and determines how fast the NCP2809 turns on.
A proper supply bypassing is critical for low noise
performance and high power supply rejection ratio.
Moreover, this capacitor is a critical component to
minimize the turn−on pop noise. A 1.0 F bypass capacitor
value should produce clickless and popless shutdown
transitions. The amplifier is still functional with a 0.1 F
capacitor value but is more sensitive to “pop and click”
noises.
Thus, for optimized performances, a 1.0 F ceramic
bypassing capacitor is recommended.
f−3dB w
2
Cout w
2
As described in Figure 42, the internal circuitry of the
NCP2809 device eliminates need of heavy bypassing
capacitors when connecting a stereo headset with 3
connecting points. This circuitry produces a virtual ground
and does not affect either output power or PSRR.
Additionally, eliminating these capacitors reduces cost and
PCB place.
However, user must take care to the connection between
pin REF_I and ground of the headset: this pin is the ground
reference for the headset. So, in order to improve
crosstalk performances, this pin must be plugged
directly to the middle point of the headset connector.
Cin
[
2
1
RL
Cout
f−3dB
(eq. 3)
(eq. 4)
Cellular phone and wireless portable device designers
normally place several Radio Frequency filtering
capacitors and ESD protection devices between the outputs
and the headset connector. Those devices are usually
connected between amplifier outputs and ground, or
amplifier output and virtual ground. Different headsets
with different impedance can be used with NCP2809. 16,
32 and 64Ohm are standard values. The extra impedance
resulting of parasitic headset inductance and protections
capacitance can affect sound quality.
In order to achieve the best sound quality, we suggest the
optimum value of total equivalent capacitance:
• Between each output terminal to the virtual ground
should be less than or equal to 100pF
• Between each output terminal to the ground should be
less than or equal to 100pF.
This total equivalent capacitance consists of the radio
frequency filtering capacitors and ESD protection device
equivalent parasitic capacitance. Because of their very low
parasitic capacitance value, diode based ESD protection
are preferred.
If for some reason the above requirements cannot be met,
a series resistor between each NCP2809 output and the
protection device can improve amplifier operation. In
order to keep dynamic output signal range, the resistor
value should be very small compared to the loudspeaker
impedance. For example, a 10Ohm resistor for a 64Ohm
loudspeaker allows up to 400pF parasitic capacitance load.
However, when using a low cost jack connector (with
third connection to ground), the headset amplifier requires
very few external components as described in Figure 43.
Only two external coupling capacitors are needed. The
main concern is in output coupling capacitors, because of
the value and consequently the size of the components
required. Purpose of these capacitors is biasing DC voltage
and very low frequency elimination. Both, coupling
capacitor and output load form a high pass filter. Audible
frequency ranges from 20 Hz to 20 kHz, but headset used
in portable appliance has poor ability to reproduce signals
below 75 or 100 Hz. Input coupling capacitor and input
resistance also form a high pass filter. These two first order
filters form a second order high pass filter with the same
−3 dB cut off frequency. Consequently, the below formula
must be followed:
1
Rin
1
RL
Cout
Optimum Equivalent Capacitance at Output Stage
With Output Coupling Capacitor
1
RL
With RL = 16 , and f−3dB = 30 Hz formula (4) shows that
Cout ≥ 330 F.
With Cout = 220 F, ±0.5 dB attenuation frequency will
be 225 Hz with a –3.0 dB cut off frequency of 45 Hz.
Following this, the input coupling capacitor choice is
straightforward. Using formula (2) input coupling
capacitor value would be 68 nF for a 220 F output
coupling capacitor and 100 nF for a 330 F output coupling
capacitor.
When using the NCP2809 with this configuration, pins
REF_I and OUT_I must be left unconnected
(see Figure 43).
Without Output Coupling Capacitor
2
(eq. 2)
As for a loudspeaker amplifier, the input impedance
value for calculating filters cut off frequency is the
minimum input impedance value at maximum output
volume.
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16
NCP2809 Series
VP
1 F
CS
VP
CI
AUDIO
INPUT
20 k
IN_L
390 nF
VP
BYPASS
Cbypass
BYPASS
+
OUT_L
+
16 VMC
BRIDGE
+
-
1 F
CI
AUDIO
INPUT
20 k
−
OUT_I
−
REF_I
+
-
IN_R
16 +
OUT_R
20 k
390 nF
20 k
SHUTDOWN
SHUTDOWN
CONTROL
VIH
VM
VIL
Figure 42. Typical Application Schematic Without Output Coupling Capacitor
VP
1 F
CS
VP
CI
AUDIO
INPUT
20 k
IN_L
390 nF
VP
BYPASS
Cbypass
BYPASS
+
OUT_L
Cout
VMC
BRIDGE
+
-
OUT_I
REF_I
+
-
IN_R
20 k
390 nF
220 F
+
+
16 1 F
CI
AUDIO
INPUT
20 k
OUT_R
−
NC
−
NC
220 F
+
16 +
Cout
20 k
SHUTDOWN
VIH
VIL
SHUTDOWN
CONTROL
VM
Figure 43. Typical Application Schematic With Output Coupling Capacitor
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17
NCP2809 Series
DEMONSTRATION BOARD AND LAYOUT GUIDELINES
Demonstration Board for Micro10 Devices
J4
VP
VP
1 F
C1
VM1
VP
C2
20 k
1 IN_R
390 nF
VP
BYPASS
C3
VM1
3
+
2
-
VMC
BRIDGE
1 F
VM1
C4
3
+
2 -
5 IN_L
16 1
OUT_R
1
OUT_I
8
REF_I
4
OUT_L
6
−
10
J3 & U2
1
−
20 k
390 nF
VP
R1
+
20 k
2
3 +
J2
3 BYPASS
U1
7
VM1
16 20 k
100 k
2 SHUTDOWN
J1
VM
+
SHUTDOWN
CONTROL
9
VM1
VM1
J10
VP
VP
1 F
C5
VM2
VM2
VP
C6
20 k
1 IN_R
390 nF
VP
BYPASS
J8
3 BYPASS
C7
VM2
1 F
VMC
BRIDGE
OUT_R
10
+
C9
−
220 F
J9 & U4
1
1
OUT_I
8
REF_I
4
OUT_L
6
NC
NC
VM2
C10
+
220 F
20 k
100 k
2 SHUTDOWN
J7
VM2
1
16 20 k
390 nF
VP
R2
2
3 +
3
+
2 -
5 IN_L
+
20 k
3
+
2
-
VM2
C8
U3
7
VM
SHUTDOWN
CONTROL
9
VM2
Figure 44. Schematic of the Demonstration Board for Micro10 Device
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18
VM2
−
16 +
NCP2809 Series
TOP LAYER
BOTTOM LAYER
Figure 45. Demonstration Board for Micro10 Device – PCB Layers
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19
NCP2809 Series
Demonstration Board for UDFN10 Device
20 k
VP
U3
C1
R3
1 F
20 k
J1
R4
J25
IN_L
BYPASS
J3
OUT_L
+
C3 100 F
VP
+
BYPASS
C2
1 F
J4
20 k
R1
REF_I
+
IN_R
OUT_R
J15
C3 100 F
SHUTDOWN
J24
R2
VP
J7
20 k
VP
ON
J8
C5
1 F
J5
J9
OFF
U1
-
C7
1 F
J2
OUT_I
J14
R5
20 k
Figure 46. Schematic of the Demonstration Board for UDFN10 Device
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20
J22
NCP2809 Series
Table 1. Bill of Material − Micro10
Item
Part Description
Ref.
PCB
Footprint
Manufacturer
Manufacturer
Reference
1
NCP2809 Audio Amplifier
U1,U3
Micro10
ON Semiconductor
NCP2809
2
SMD Resistor 100 K
R1,R2
0805
Vishay−Draloric
D12CRCW Series
3
Ceramic Capacitor 390 nF 50 V Z5U
C2,C4,
C6,C8
1812
Kemet
C1812C394M5UAC
4
Ceramic Capacitor 1.0 F 16 V X7R
Optimized Performance
C1,C3,
C5,C7
1206
Murata
GRM42−6X7R105K16
5
Tantalum Capacitor 220 F 10 V
C9,C10
−
Kemet
T495X227010AS
6
I/O Connector. It can be plugged by
BLZ5.08/2 (Weidmüller Reference)
J4,J10
−
Weidmüller
SL5.08/2/90B
7
I/O Connector. It can be plugged by
BLZ5.08/3 (Weidmüller Reference)
J2,J3,
J8,J9
−
Weidmüller
SL5.08/3/90B
8
3.5 mm PCB Jack Connector
U2,U4
−
Decelect−Forgos
IES 101−3
9
Jumper Header Vertical Mount
2*1, 2.54 mm
J1,J7
−
−
−
Table 2. Bill of Material − UDFN10
Item
Part Description
Ref.
PCB Footprint
Manufacturer
Manufacturer Part Number
1
Stereo Headphone Amplifier
U1
UDFN10 3x3
ON Semiconductor
NCP2809B
2
Thick Film Chip Resistor
R1−R5
0805
Vishay
CRCW08052022FNEA
3
Ceramic Chip Capacitor
C1,C2,C5,C7
0805
TDK
C2012X7R1C105K
4
PCB Header, 2 Poles
J5
NA
Phoenix
MSTBA 2,5/2−G
5
SMB Connector
J1,J2,J8
NA
RS
RS 546−3406
6
3.5 mm PCB Jack Connector
U2
NA
CUI Inc
SJ−3515N
7
Short Connector
J14,J15
NA
NA
NA
8
Short Connector
J24,J25
NA
NA
NA
PCB LAYOUT GUIDELINES
How to Optimize the Accuracy of VMC
How to Optimize THD+N Performances
The main innovation of the NCP2809 stereo NOCAP
audio amplifier is the use of a virtual ground that allows
connecting directly the headset on the outputs of the device
saving DC−blocking output capacitors. In order to have the
best performances in terms of crosstalk, noise and supply
current, the feedback connection on the virtual ground
amplifier is not closed internally. To reach this goal of
excellence, one must connect OUT_I and REF_I as close
as possible from the middle point of the output jack
connector. The most suitable place for this connection is
directly on the pad of this middle point.
To get the best THD+N level on the headset speakers, the
traces of the power supply, ground, OUT_R, OUT_L and
OUT_I need the lowest resistance. Thus, the PCB traces for
these nets should be as wide and short as possible.
You need to avoid ground loops, run digital and analog
traces parallel to each other. Due to its internal structure,
the amplifier can be sensitive to coupling capacitors
between Ground and each output (OUT_R, OUT_L and
OUT_I). Avoid running the output traces between two
ground layers or if traces must cross over on different
layers, do it at 90 degrees.
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21
NCP2809 Series
ORDERING INFORMATION
Marking
Package
Shipping†
NCP2809ADMR2
Device
MAE
Micro10
4000/Tape & Reel
NCP2809ADMR2G
MAE
Micro10
(Pb−Free)
4000/Tape & Reel
NCP2809BDMR2
MAC
Micro10
4000/Tape & Reel
NCP2809BDMR2G
MAC
Micro10
(Pb−Free)
4000/Tape & Reel
NCP2809BMUTXG
2809B
UDFN10
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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22
NCP2809 Series
PACKAGE DIMENSIONS
Micro10
CASE 846B−03
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B−01 OBSOLETE. NEW STANDARD
846B−02
−A−
−B−
K
D 8 PL
0.08 (0.003)
PIN 1 ID
G
SEATING
PLANE
T B
S
A
S
C
0.038 (0.0015)
−T−
M
DIM
A
B
C
D
G
H
J
K
L
H
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.95
1.10
0.20
0.30
0.50 BSC
0.05
0.15
0.10
0.21
4.75
5.05
0.40
0.70
L
J
SOLDERING FOOTPRINT*
10X
1.04
0.041
0.32
0.0126
3.20
0.126
8X
0.50
0.0196
10X
4.24
0.167
5.28
0.208
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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23
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.037
0.043
0.008
0.012
0.020 BSC
0.002
0.006
0.004
0.008
0.187
0.199
0.016
0.028
NCP2809 Series
PACKAGE DIMENSIONS
UDFN10 3x3, 0.5P
CASE 506AT−01
ISSUE A
D
PIN ONE
REFERENCE
2X
B
A
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
0.15 C
2X
TOP VIEW
0.15 C
A3
0.10 C
A
10X
0.08 C
A1
SIDE VIEW
C
L
1
K
10
2.40
1.70
0.30
2.6016
e
5
8X
2.1746
E2
10X
0.18
MILLIMETERS
NOM
MAX
0.50
0.55
0.03
0.05
0.127 REF
0.25
0.30
3.00 BSC
2.50
2.60
3.00 BSC
1.80
1.90
0.50 BSC
0.19 TYP
0.40
0.50
SOLDERING FOOTPRINT*
SEATING
PLANE
D2
10X
MIN
0.45
0.00
6
BOTTOM VIEW
b
10X
1.8508 3.3048
10X
0.10 C A
0.05 C
0.5651
B
NOTE 3
10X
0.3008
0.5000 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOCAP is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
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Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
NCP2809/D