MC10ELT22 D

MC10ELT22, MC100ELT22
5.0 V Dual TTL to Differential
PECL Translator
The MC10ELT/100ELT22 is a dual TTL to differential PECL
translator. Because PECL (Positive ECL) levels are used only +5 V
and ground are required. The small outline 8-lead package and the low
skew, dual gate design of the ELT22 makes it ideal for applications
which require the translation of a clock and a data signal.
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MARKING
DIAGRAMS*
Features
•
•
•
•
•
•
•
1.2 ns Typical Propagation Delay
8
8
< 300 ps Typical Output to Output Skew
8
HLT22
ALYW
G
1
PNP TTL Inputs for Minimal Loading
SO−8
D SUFFIX
CASE 751
Flow Through Pinouts
1
KLT22
ALYW
G
1
Operating Range: VCC = 4.75 V to 5.25 V with GND = 0 V
No Internal Input Pulldown Resistors
8
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
8
1
TSSOP−8
DT SUFFIX
CASE 948R
8
HT22
ALYWG
G
1
KT22
ALYWG
G
1
H = MC10
K = MC100
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
*For additional information, see Application Note
AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. 10
1
Publication Order Number:
MC10ELT22/D
MC10ELT22, MC100ELT22
Table 1. PIN DESCRIPTION
Q0
Q0
1
8
2
7
PECL
VCC
Pin
D0
TTL
Function
Qn, Qn
PECL Differential Outputs*
Dn
TTL Inputs
VCC
Positive Supply
GND
Ground
*Output state undetermined when inputs are open.
Q1
3
6
D1
Q1
4
5
GND
Figure 1. Logic Diagram and Pinout Assignment
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
N/A
Internal Input Pullup Resistor
ESD Protection
N/A
Human Body Model
Machine Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
> 2 kV
> 200 V
Level 1
UL 94 V−0 @ 0.125 in
51
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
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2
MC10ELT22, MC100ELT22
Table 3. MAXIMUM RATINGS
Rating
Units
VCC
Symbol
Positive Power Supply
Parameter
GND = 0 V
Condition 1
Condition 2
7
V
VIN
Input Voltage
GND = 0 V
GND + 0.025 v VI
v VCC − 0.025
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 SOIC
8 SOIC
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 SOIC
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 TSSOP
8 TSSOP
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 TSSOP
41 to 44 ± 5%
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
265
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 4. 10ELT SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 2)
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
22
85°C
Max
Min
ICC
Power Supply Current
VOH
Output HIGH Voltage (Note 3)
3920
4010
4110
4020
4105
4190
4090
VOL
Output LOW Voltage (Note 3)
3050
3200
3350
3050
3210
3370
3050
Typ
Max
Unit
22
mA
4185
4280
mV
3227
3405
mV
22
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
2. Output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V.
3. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 5. 100ELT SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 4)
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
22
85°C
Max
Min
ICC
Power Supply Current
VOH
Output HIGH Voltage (Note 5)
3915
3995
4120
3975
4045
4120
3975
VOL
Output LOW Voltage (Note 5)
3170
3305
3445
3190
3295
3380
3190
Typ
Max
Unit
22
mA
4050
4120
mV
3295
3380
mV
22
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
4. Output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V.
5. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
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3
MC10ELT22, MC100ELT22
Table 6. TTL INPUT DC CHARACTERISTICS VCC = 4.75 V to 5.25 V; TA = −40°C to 85°C
Symbol
Characteristic
Condition
Min
Typ
Max
Unit
IIH
Input HIGH Current
VIN = 2.7 V;
VIN = (VCC − 0.025) V
20
mA
IIHH
Input HIGH Current
VIN = 7.0 V
100
mA
IIL
Input LOW Current
VIN = 0.5 V;
VIN = (GND + 0.025) V
−0.6
mA
VIK
Input Clamp Diode Voltage
IIN = −18 mA
−1.2
V
VIH
Input HIGH Voltage
2.0
VCC − 0.025 V
V
VIL
Input LOW Voltage
GND + 0.025 V
0.8
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
Table 7. AC CHARACTERISTICS VCC= 4.75 V to 5.25 V; GND= 0.0 V
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
85°C
Max
Min
Typ
Max
500
Unit
fMAX
Maximum Input Frequency
tPLH
Propagation Delay (Note 6)
1.5 V to 50%
0.6
1.2
0.9
1.2
1.5
0.6
1.35
ns
tPHL
Propagation Delay (Note 6)
1.5 V to 50%
0.4
1.0
0.5
0.8
1.1
0.7
1.30
ns
tskew
Within−Device Skew (Note 7)
Device−to−Device Skew (Note 8)
50
300
100
600
100
750
ps
tJITTER
CLOCK Random Jitter (RMS)
tr/tf
Output Rise/Fall Time
(20−80%)
50
300
100
600
MHz
50
350
0.5
0.4
1.6
0.4
ps
1.6
0.4
1.6
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
6. Specifications for standard TTL input signal.
7. Skew is measured between outputs under identical transitions and conditions on any one device.
8. Device−to−Device Skew for identical transitions at identical VCC levels.
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4
MC10ELT22, MC100ELT22
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
Zo = 50 W
D
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping†
MC10ELT22DG
SO−8
(Pb−Free)
98 Units / Rail
MC10ELT22DR2G
SO−8
(Pb−Free)
2500 Tape & Reel
MC10ELT22DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC10ELT22DTR2G
TSSOP−8
(Pb−Free)
2500 Tape & Reel
MC100ELT22DG
SO−8
(Pb−Free)
98 Units / Rail
MC100ELT22DR2G
SO−8
(Pb−Free)
2500 Tape & Reel
MC100ELT22DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100ELT22DTR2G
TSSOP−8
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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5
MC10ELT22, MC100ELT22
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
K
−Y−
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC10ELT22, MC100ELT22
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
K REF
0.10 (0.004)
S
2X
L/2
8
1
PIN 1
IDENT
S
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
5
0.25 (0.010)
B
−U−
L
0.15 (0.006) T U
M
M
4
A
−V−
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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MC10ELT22/D