MC10ELT25 D

MC10ELT25, MC100ELT25
-5 V Differential ECL to TTL
Translator
Description
Features
•
•
•
MARKING DIAGRAMS*
8
8
1
SOIC−8
D SUFFIX
CASE 751
1
1
TSSOP−8
DT SUFFIX
CASE 948R
1
KLT25
ALYW
G
1
8
8
2.6 ns Typical Propagation Delay
100 MHz FMAX CLK
24 mA TTL Outputs
Flow Through Pinouts
Operating Range: VCC = 4.5 V to 5.5 V with GND = 0 V;
VEE = −4.2 V to −5.7 V with GND = 0 V
Internal Input 50 KW Pulldown Resistors
Q Output will default HIGH with inputs open or < 1.3 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
8
HLT25
ALYW
G
8
HT25
ALYWG
G
1
KT25
ALYWG
G
5F MG
G
•
•
•
•
•
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2U MG
G
The MC10ELT/100ELT25 is a differential ECL to TTL translator.
Because ECL levels are used, a +5 V, −5.2 V (or −4.5 V) and ground
are required. The small outline 8-lead package and the single gate of
the ELT25 makes it ideal for those applications where space,
performance and low power are at a premium.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
The 100 Series contains temperature compensation.
1
4
1
4
DFN8
MN SUFFIX
CASE 506AA
H
K
5F
2U
M
= MC10
= MC100
= MC10
= MC100
= Date Code
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. 14
1
Publication Order Number:
MC10ELT25/D
MC10ELT25, MC100ELT25
VEE
D
1
8
TTL
2
7
Table 1. PIN DESCRIPTION
VCC
Pin
Q
ECL
D
VBB
3
6
4
5
NC
GND
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
Function
D, D
ECL Differential Inputs
Q
TTL Output
VBB
Reference Voltage Output
VCC
Positive Supply
VEE
Negative Supply
GND
Ground
NC
No Connect
EP
(DFN8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND)
or leave unconnected, floating open.
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
ESD Protection
N/A
Human Body Model
Machine Model
> 1 kV
> 400 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb−Free Pkg
SOIC−8
TSSOP−8
DFN8
Flammability Rating
Level 1
Level 3
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
38 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
VCC
Positive Power Supply
GND = 0 V
VEE = −5.0 V
VEE
Negative Power Supply
GND = 0 V
VCC = +5.0 V
VIN
Input Voltage
GND = 0 V
IBB
VBB Sink/Source
TA
Tstg
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
qJC
Thermal Resistance (Junction−to−Case)
qJA
Rating
Unit
7
V
−8
V
0 to VEE
V
± 0.5
mA
Operating Temperature Range
−40 to +85
°C
Storage Temperature Range
−65 to +150
°C
SOIC−8
SOIC−8
190
130
°C/W
°C/W
Standard Board
SOIC−8
41 to 44
°C/W
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 260°C
265
°C
qJC
Thermal Resistance (Junction−to−Case)
DFN8
35 to 40
°C/W
Pb−Free
(Note 2)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
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2
MC10ELT25, MC100ELT25
Table 4. 10ELT SERIES NECL INPUT DC CHARACTERISTICS VCC = 5.0 V; VEE = −5.0 V; GND = 0 V (Note 3)
−40°C
Typ
85°C
Characteristic
Min
Max
Min
Max
Min
Max
Unit
VIH
Input HIGH Voltage (Single−Ended) (Note 4)
−1230
−890
−1130
−810
−1060
−720
mV
VIL
Input LOW Voltage (Single−Ended) (Note 4)
−1950
−1500
−1950
−1480
−1950
−1445
mV
VBB
Output Voltage Reference
−1.43
−1.30
−1.35
−1.25
−1.31
−1.19
V
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential) (Notes 4 and 5)
−2.8
0.0
−2.8
0.0
−2.8
0.0
V
IIH
Input HIGH Current
175
mA
IIL
Input LOW Current
Symbol
Typ
25°C
255
0.5
Typ
175
0.5
mA
0.3
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
3. Input parameters vary 1:1 with GND. VEE can vary +0.06 V to −0.5 V.
4. TTL output RL = 500 W to GND
5. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with GND.
Table 5. 100ELT SERIES NECL INPUT DC CHARACTERISTICS VCC = 5.0 V; VEE = −5.0 V; GND = 0 V (Note 6)
−40°C
Characteristic
Min
Max
Min
VIH
Input HIGH Voltage (Single−Ended) (Note 7)
−1165
−880
VIL
Input LOW Voltage (Single−Ended) (Note 7)
−1810
VBB
Output Voltage Reference
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential) (Notes 7 and 8)
IIH
Input HIGH Current
IIL
Input LOW Current
Symbol
Typ
25°C
Typ
85°C
Max
Min
−1165
−880
−1475
−1810
−1.38
−1.26
−2.8
0.0
Max
Unit
−1165
−880
mV
−1475
−1810
−1475
mV
−1.38
−1.26
−1.38
−1.26
V
−2.8
0.0
−2.8
0.0
V
175
mA
255
0.5
Typ
175
0.5
mA
0.5
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
6. Input parameters vary 1:1 with GND. VEE can vary +0.8 V to −0.5 V.
7. TTL output RL = 500 W to GND
8. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with GND.
Table 6. TTL OUTPUT DC CHARACTERISTICS VCC = 4.5 V to 5.5 V; TA = −40°C to +85°C
Symbol
Characteristic
Condition
VOH
Output HIGH Voltage
IOH = −3.0 mA
VOL
Output LOW Voltage
IOL = 24 mA
ICCH
Power Supply Current
ICCL
Min
Typ
Max
2.4
Unit
V
0.5
V
11
16
mA
Power Supply Current
13
18
mA
IEE
Negative Power Supply Current
15
21
mA
IOS
Output Short Circuit Current
−60
mA
−150
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
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3
MC10ELT25, MC100ELT25
Table 7. AC CHARACTERISTICS VCC= 5.0 V; VEE= −5.0 V; GND= 0 V (Note 9 and Note 10)
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
85°C
Max
Min
Typ
Max
100
Unit
fmax
Maximum Toggle Frequency
tPLH
Propagation Delay @ 1.5 V
1.7
3.6
1.7
3.6
1.7
3.6
ns
tPHL
Propagation Delay @ 1.5 V
2.6
4.1
2.6
4.1
2.6
4.1
ns
tJITTER
Random Clock Jitter (RMS)
35
ps
tr
tf
Output Rise/Fall Times QTTL
10% − 90%
1.9
2.3
ns
VPP
Input Swing (Note 11)
200
1000
200
MHz
1000
200
1000
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
9. VCC can vary ± 0.25 V.
VEE can vary +0.06 V to −0.5 V for 10ELT; VEE can vary +0.8 V to −0.5 V for 100ELT.
10. RL = 500 W to GND and CL = 20 pF to GND. Refer to Figure 2.
11. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of ≈ 40.
APPLICATION
TTL RECEIVER
CHARACTERISTIC TEST
*CL includes
fixture
capacitance
CL *
RL
AC TEST LOAD
GND
Figure 2. TTL Output Loading Used for Device Evaluation
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4
MC10ELT25, MC100ELT25
ORDERING INFORMATION
Package
Shipping†
MC10ELT25DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC10ELT25DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC10ELT25DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC10ELT25DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC10ELT25MNR4G
DFN8
(Pb−Free)
1000 / Tape & Reel
MC100ELT25DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC100ELT25DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC100ELT25DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100ELT25DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100ELT25MNR4G
DFN8
(Pb−Free)
1000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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5
MC10ELT25, MC100ELT25
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
K
−Y−
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC10ELT25, MC100ELT25
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
K REF
0.10 (0.004)
S
2X
L/2
8
1
PIN 1
IDENT
S
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
5
0.25 (0.010)
B
−U−
L
0.15 (0.006) T U
M
M
4
A
−V−
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
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7
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
MC10ELT25, MC100ELT25
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AA
ISSUE E
D
PIN ONE
REFERENCE
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L
L1
ÇÇÇ
ÇÇÇ
ÇÇÇ
0.10 C
2X
A
B
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
ÉÉÉ
ÉÉÉ
EXPOSED Cu
TOP VIEW
A
DETAIL B
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTION
0.08 C
(A3)
NOTE 4
A1
C
SIDE VIEW
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
8X
DETAIL A
1.30
D2
1
8X
L
8
5
8X
e/2
e
0.50
PACKAGE
OUTLINE
4
E2
K
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.30 REF
0.25
0.35
−−−
0.10
0.90
2.30
1
b
0.10 C A B
0.05 C
8X
0.30
NOTE 3
0.50
PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
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the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
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For additional information, please contact your local
Sales Representative
MC10ELT25/D