NL17SZ05 D

NL17SZ05
Product Preview
Single Inverter with Open
Drain Outputs
The NL17SZ05 is a high performance single inverter with open
drain outputs operating from a 1.65 to 5.5 V supply.
The Output stage is open drain with Over Voltage Tolerance. This
allows the NL17SZ05 to be used to interface 5.0 V circuits to circuits
of any voltage between 0 and +7.0 V.
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MARKING
DIAGRAM
Features
•
•
•
•
•
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Tiny SOT−953 Package
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation, CMOS Compatible
LVCMOS Compatible
24 mA Output Sink Capability, Pullup may be between 0 and 7.0 V
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 20
These Devices are Pb−Free and are RoHS Compliant
IN A
1
GND
2
5
VCC
SOT−953
CASE 527AE
A
M
AM
1
= Specific Device Code
= Month Code
PIN ASSIGNMENT
Pin
Function
1
IN A
2
GND
3
NC
4
OUT Y
5
VCC
FUNCTION TABLE
NC
3
4
OUT Y
1
Y Output
L
Z
H
L
ORDERING INFORMATION
Figure 1. Pinout (Top View)
IN A
A Input
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
OUT Y
Figure 2. Logic Symbol
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. P0
1
Publication Order Number:
NL17SZ05/D
NL17SZ05
MAXIMUM RATINGS
Symbol
VCC
Characteristics
Value
Unit
−0.5 to +7.0
V
−0.5 ≤ VI ≤ +7.0
V
−0.5 to VCC + 0.5
−0.5 to + 0.5
V
VI < GND
−50
mA
VO < GND
−50
mA
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air
SOT−353
SOT−553
186
135
mW
qJA
Thermal Resistance
SOT−353
SOT−553
350
496
°C/W
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
MSL
Moisture Sensitivity
FR
Flammability Rating
ESD
ESD Classification
ILatch−Up
Output at High or Low State
Power−Down Mode (VCC = 0 V)
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
Latchup Performance
Class IC
Class A
N/A
Above VCC and Below GND at 85°C (Note 3)
mA
±500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
2. Tested to JESD22−C101−A.
3. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Operating
Data Retention Only
(Z or LOW State)
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
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2
Min
Max
Unit
1.65
1.5
5.5
5.5
V
0
5.5
V
0
VCC
V
−55
+125
°C
0
0
0
20
10
5
ns/V
NL17SZ05
DC ELECTRICAL CHARACTERISTICS
Min
0.75 VCC
0.7 VCC
Typ
−55°C ≤ TA ≤ 125°C
Max
Min
Max
Symbol
Parameter
VIH
High−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
VIL
Low−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
0.25 VCC
0.3 VCC
0.25 VCC
0.3 VCC
V
ILKG
Z−State Output
Leakage Current
VIN = VIL
VOUT = VCC or GND
2.3 to 5.5
±5.0
±10.0
mA
VOL
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 100 mA
1.65 to 5.5
0.0
0.1
0.1
V
IOL = 4 mA
1.65
0.08
0.24
0.24
IIN
Condition
TA = 25°C
VCC
(V)
Input Leakage Current
IOFF
Power Off
Leakage Current
ICC
Quiescent Supply Current
0.75 VCC
0.7 VCC
Unit
V
IOL = 8 mA
2.3
0.22
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
VIN = 5.5 V or GND
0 to 5.5
±0.1
±1.0
mA
VIN = 5.5 V or
VOUT = 5.5 V
0
1.0
10
mA
VIN = 5.5 V or GND
5.5
1.0
10
mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
TA = 25°C
Symbol
tPZL
tPLZ
Condition
VCC (V)
Min
Typ
Max
Min
Max
Unit
RL = R1= 500 W, CL = 50 pF
1.65
0.8
5.3
11.6
0.8
12.0
ns
2.5 ± 0.2
0.8
3.0
3.6
0.8
4.1
3.3 ± 0.3
0.8
2.4
3.2
0.8
3.7
5.0 ± 0.5
0.5
2.4
3.0
0.5
3.5
1.65
0.8
5.3
11.6
0.8
12.0
2.5 ± 0.2
0.8
2.5
3.6
0.8
4.1
3.3 ± 0.3
0.8
2.1
3.2
0.8
3.7
5.0 ± 0.5
0.5
1.2
3.0
0.5
3.5
Parameter
Propagation Delay
(Figure 3 and 4)
Propagation Delay
(Figure 3 and 4)
−55°C ≤ TA ≤ 125°C
RL = R1= 500 W, CL = 50 pF
ns
CAPACITIVE CHARACTERISTICS
Symbol
Condition
Typical
Unit
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
u2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
CPD
Power Dissipation Capacitance (Note 4)
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
CIN
Parameter
4. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL17SZ05
A
VCC
50%
tPZL
Y
GND
tPLZ
50% VCC
HIGH
IMPEDANCE
VOL +0.3 V
Figure 3. Switching Waveforms
VCC
R1
PULSE
GENERATOR
DUT
RT
CL
VCC x 2
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Order Number
NL17SZ05P5T5G
Package Type
Shipping†
SOT−953
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL17SZ05
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
Y
PIN ONE
INDICATOR
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
4
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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PUBLICATION ORDERING INFORMATION
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Phone: 421 33 790 2910
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NL17SZ05/D