ONSEMI NL17SH08

NL17SH08
Single 2-Input AND Gate
The NL17SH08 is an advanced high speed CMOS 2−input AND
gate fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
The NL17SH08 input structure provides protection when voltages
up to 7.0 V are applied, regardless of the supply voltage. This allows
the NL17SH08 to be used to interface 5.0 V circuits to
3.0 V circuits.
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MARKING
DIAGRAM
Features
•
•
•
•
•
•
High Speed: tPD = 3.5 ns (Typ) at VCC = 5.0 V
Low Power Dissipation: ICC = 1.0 mA (Max) at TA = 25°C
SOT−953
CASE 527AE
EM
1
Power Down Protection Provided on Inputs
Balanced Propagation Delays
E
M
Pin and Function Compatible with Other Standard Logic Families
= Specific Device Code
= Month Code
These are Pb−Free Devices
PIN ASSIGNMENT
IN A
1
GND
2
IN B
3
5
4
VCC
&
August, 2011 − Rev. 1
2
GND
3
IN B
4
OUT Y
5
VCC
FUNCTION TABLE
Inputs
Output
A
B
Y
L
L
H
H
L
H
L
H
L
L
L
H
OUT Y
ORDERING INFORMATION
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2011
IN A
OUT Y
Figure 1. Pinout (Top View)
IN A
IN B
1
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
1
Publication Order Number:
NL17SH08/D
NL17SH08
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
−0.5 to VCC +0.5
V
VOUT
Parameter
DC Output Voltage
IIK
DC Input Diode Current
−20
mA
IOK
DC Output Diode Current
±20
mA
IOUT
DC Output Sink Current
±25
mA
ICC
DC Supply Current per Supply Pin
50
mA
−65 to +150
°C
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
PD
Power Dissipation in Still Air
50
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
ILATCHUP
Latchup Performance
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Above VCC and Below GND at 125°C (Note 1)
mA
±100
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
DC Supply Voltage
2.0
5.5
V
VIN
DC Input Voltage
0.0
5.5
V
0.0
VCC
V
Operating Temperature Range
−55
+125
°C
0
0
100
20
ns/V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80 ° C
Time, Hours
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 90 ° C
Junction
Temperature °C
NORMALIZED FAILURE RATE
Device Junction Temperature versus
Time to 0.1% Bond Failures
TJ = 100 ° C
Input Rise and Fall Time
TJ = 110° C
tr , tf
DC Output Voltage
TJ = 120° C
TA
TJ = 130 ° C
VOUT
1
1
10
100
TIME, YEARS
Figure 3. Failure Rate vs. Time
Junction Temperature
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2
1000
NL17SH08
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
Min
1.5
2.1
3.15
3.85
VIH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
5.5
VIL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
5.5
VOH
Minimum High−Level
Output Voltage
VIN = VIH or VIL
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
TA = 255C
VCC
(V)
Typ
TA v 855C
Max
Min
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
VIN = VIH or VIL
IOH = −50 mA
2.0
3.0
4.5
1.9
2.9
4.4
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
Max
2.0
3.0
4.5
0.0
0.0
0.0
*555C to 1255C
Min
Max
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
V
0.5
0.9
1.35
1.65
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
Unit
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Maximum Input
Leakage Current
VIN = 5.5 V or GND
0 to 5.5
$0.1
$1.0
$1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
5.5
1.0
10
40
mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
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ÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
TA = 25°C
Symbol
tPLH,
tPHL
CIN
Parameter
Maximum Propagation Delay,
Input A or B to Y
Min
Test Conditions
TA ≤ 85°C
Typ
Max
Min
Max
−55 ≤ TA ≤ 125°C
Min
Max
Unit
ns
VCC = 3.3 ± 0.3 V
CL = 15 pF
CL = 50 pF
4.1
5.9
8.8
12.3
10.5
14.0
12.5
16.5
VCC = 5.0 ± 0.5 V
CL = 15 pF
CL = 50 pF
3.5
4.2
5.9
7.9
7.0
9.0
9.0
11.0
5.5
10
10
10
Maximum Input Capacitance
pF
Typical @ 25°C, VCC = 5.0 V
CPD
11
Power Dissipation Capacitance (Note 2)
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL17SH08
VCC
Input A or B
50% VCC
50%
CL*
GND
tPLH
tPHL
VOH
Output Y
OUTPUT
INPUT
50% VCC
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended
for propagation delay tests.
VOL
Figure 4. Switching Waveforms
Figure 5. Test Circuit
DEVICE ORDERING INFORMATION
Device
NL17SH08P5T5G
Package
Shipping†
SOT−953
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL17SH08
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
Y
PIN ONE
INDICATOR
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
4
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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Phone: 81−3−5773−3850
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5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NL17SH08/D