ICL3224, ICL3226, ICL3238, ICL3244 ® Data Sheet November 2002 1 Microamp, +3V to +5.5V, 250kbps, RS-232 Transceivers with Enhanced Automatic Powerdown FN4876.6 Features • ±15kV ESD Protected (Human Body Model) • Manual and Enhanced Automatic Powerdown Features The Intersil ICL32XX devices are 3.0V to 5.5V powered RS-232 transmitters/receivers which meet ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Targeted applications are PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with manual and enhanced automatic powerdown functions, reduce the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. This family is fully compatible with 3.3V only systems, mixed 3.3V and 5.0V systems, and 5.0V only systems. The ICL3244 is a 3 driver, 5 receiver device that provides a complete serial port suitable for laptop or notebook computers. The ICL3244/38 also include a noninverting always-active receiver for RING INDICATOR monitoring. These devices feature an enhanced automatic powerdown function which powers down the on-chip powersupply and driver circuits. This occurs when all receiver and transmitter inputs detect no signal transitions for a period of 30sec. These devices power back up, automatically, whenever they sense a transition on any transmitter or receiver input. Table 1 summarizes the features of the devices represented by this data sheet, while Application Note AN9863 summarizes the features of each device comprising the ICL32XX 3V family. • Drop in Replacements for MAX3224, MAX3226, MAX3238, MAX3244 • Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V • Latch-Up Free • RS-232 Compatible with VCC = 2.7V • On-Chip Voltage Converters Require Only Four External 0.1µF Capacitors • Flow-Through Pinout (ICL3238) • Guaranteed Mouse Driveability (ICL3244) • “Ready to Transmit” Indicator Output (ICL3224/26) • Receiver Hysteresis For Improved Noise Immunity • Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps • Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs • Wide Power Supply Range . . . . . . . Single +3V to +5.5V • Low Supply Current in Powerdown State. . . . . . . . . . .1µA Applications • Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - Digital Cameras - Cellular/Mobile Phones - Data Cradles Related Literature • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” • AN9863, “3V to +5.5V, 250k-1Mbps, RS-232 Transmitters/Receivers” TABLE 1. SUMMARY OF FEATURES PART NUMBER NO. OF NO. OF Tx. Rx. NO. OF MONITOR Rx. (ROUTB) DATA RATE (kbps) Rx. ENABLE FUNCTION? READY OUTPUT? MANUAL POWERDOWN? ENHANCED AUTOMATIC POWERDOWN ICL3224 2 2 0 250 NO YES YES YES ICL3226 1 1 0 250 NO YES YES YES ICL3238 5 3 1 250 NO NO YES YES ICL3244 3 5 1 250 NO NO YES YES 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ICL3224, ICL3226, ICL3238, ICL3244 Ordering Information Ordering Information (NOTE 1) PART NO. TEMP. RANGE (oC) PACKAGE PKG. NO. (NOTE 1) PART NO. TEMP. RANGE (oC) (Continued) PACKAGE PKG. NO. ICL3224CA 0 to 70 20 Ld SSOP M20.209 ICL3244IA -40 to 85 28 Ld SSOP M28.209 ICL3224IA -40 to 85 20 Ld SSOP M20.209 ICL3244CB 0 to 70 28 Ld SOIC M28.3 ICL3224CP 0 to 70 20 Ld PDIP E20.3 ICL3244IB -40 to 85 28 Ld SOIC M28.3 ICL3226CA 0 to 70 16 Ld SSOP M16.209 ICL3244CV 0 to 70 28 Ld TSSOP M28.173 ICL3226IA -40 to 85 16 Ld SSOP M16.209 ICL3244IV -40 to 85 28 Ld TSSOP M28.173 ICL3238CA 0 to 70 28 Ld SSOP M28.209 NOTE: ICL3238IA -40 to 85 28 Ld SSOP M28.209 ICL3244CA 0 to 70 28 Ld SSOP M28.209 1. Most surface mount devices are available on tape and reel; add “-T” to suffix. Pinouts ICL3224 (PDIP, SSOP) TOP VIEW ICL3226 (SSOP) TOP VIEW 20 FORCEOFF READY 1 C1+ 2 19 VCC READY 1 3 16 FORCEOFF 18 GND C1+ 2 15 VCC C1- 4 17 T1OUT V+ 3 14 GND C2+ 5 16 R1IN C1- 4 13 T1OUT C2- 6 15 R1OUT C2+ 5 12 FORCEON 14 FORCEON C2- 6 11 T1IN V+ V- 7 T2OUT 8 13 T1IN V- 7 R2IN 9 12 T2IN R1IN 8 9 R1OUT 11 INVALID R2OUT 10 ICL3238 (SSOP) TOP VIEW C2+ 1 GND 2 C2- 10 INVALID ICL3244 (SOIC, SSOP, TSSOP) TOP VIEW 28 C1+ C2+ 1 28 C1+ 27 V+ C2- 2 27 V+ 26 VCC 3 3 26 VCC 25 C1- R1IN 4 25 GND T1OUT 5 24 T1IN R2IN 5 24 C1- T2OUT 6 23 T2IN R3IN 6 23 FORCEON T3OUT 7 22 T3IN R4IN 7 22 FORCEOFF R1IN 8 21 R1OUT R5IN 8 21 INVALID R2IN 9 20 R2OUT T1OUT 9 20 R2OUTB 19 T4IN T2OUT 10 19 R1OUT 18 R3OUT V- 4 T4OUT 10 R3IN 11 V- T3OUT 11 18 R2OUT 17 T5IN T3IN 12 17 R3OUT FORCEON 13 16 R1OUTB T2IN 13 16 R4OUT FORCEOFF 14 15 INVALID T1IN 14 15 R5OUT T5OUT 12 2 ICL3224, ICL3226, ICL3238, ICL3244 Pin Descriptions PIN FUNCTION System power supply input (3.0V to 5.5V). VCC V+ Internally generated positive transmitter supply (+5.5V). V- Internally generated negative transmitter supply (-5.5V). GND Ground connection. C1+ External capacitor (voltage doubler) is connected to this lead. C1- External capacitor (voltage doubler) is connected to this lead. C2+ External capacitor (voltage inverter) is connected to this lead. C2- External capacitor (voltage inverter) is connected to this lead. TIN TTL/CMOS compatible transmitter Inputs. RS-232 level (nominally ±5.5V) transmitter outputs. TOUT RIN RS-232 compatible receiver inputs. ROUT TTL/CMOS level receiver outputs. TTL/CMOS level, noninverting, always enabled receiver outputs. ROUTB INVALID Active low output that indicates if no valid RS-232 levels are present on any receiver input. READY Active high output that indicates when the ICL32XX is ready to transmit (i.e., V- ≤ -4V) FORCEOFF Active low to shut down transmitters and on-chip power supply. This overrides any automatic circuitry and FORCEON (see Table 2). Active high input to override automatic powerdown circuitry thereby keeping transmitters active. (FORCEOFF must be high). FORCEON Typical Operating Circuits ICL3224 +3.3V + C1 0.1µF C2 0.1µF +3.3V 0.1µF 2 + 4 5 + 6 C1+ ICL3226 VCC C1C2+ V+ 3 V- 7 C2T1 13 T1IN C4 +0.1µF T2OUT 16 10 2 + 4 1 READY FORCEOFF INVALID FORCEON GND 18 3 20 11 15 VCC 3 V- 7 C4 + 0.1µF T1 13 T1IN T1OUT 9 8 R1OUT 1 + C3 0.1µF V+ 5kΩ R1 READY VCC TO POWER CONTROL LOGIC 12 16 FORCEON GND 14 INVALID RS-232 LEVELS R1IN FORCEOFF R2IN 5kΩ R2 C1+ C15 C2+ + 6 C2- 9 R2OUT 14 RS-232 LEVELS R1IN 5kΩ R1 C2 0.1µF TTL/CMOS LOGIC LEVELS 8 15 R1OUT C1 0.1µF 0.1µF 11 T1OUT T2IN TTL/CMOS LOGIC LEVELS + C3 0.1µF 17 T2 12 + 19 10 VCC TO POWER CONTROL LOGIC ICL3224, ICL3226, ICL3238, ICL3244 Typical Operating Circuits (Continued) ICL3238 ICL3244 +3.3V NOTE 3 + 0.1µF 28 C1 0.1µF + C2 0.1µF C11 C2+ + 3 C2- 26 C1+ 27 VCC V+ 25 VT1 24 + 4 C + 3 0.1µF NOTE 3 + C2 0.1µF C11 C2+ + 2 C2- T2 C4 0.1µF + 22 7 T3IN T3OUT T3 19 T4 T1 T2OUT T3 RS-232 LEVELS 11 T3OUT 20 TTL/CMOS LOGIC LEVELS 4 R1OUT R1 R1IN 5kΩ 18 5 R2OUT R1OUTB R2 R2IN 5kΩ 8 R1OUT R1 5kΩ 20 R2 5kΩ 18 17 R1IN R2IN RS-232 LEVELS R3 5kΩ R3IN R3 7 R4OUT R4 8 5kΩ R5 FORCEON FORCEON VCC 14 FORCEOFF TO POWER CONTROL LOGIC 15 INVALID GND NOTES: 2. THE NEGATIVE TERMINAL OF C3 CAN BE CONNECTED TO EITHER VCC OR GND. 3. FOR VCC = 3.15V (3.3V -5%), USE C1 - C4 = 0.1µF OR GREATER. FOR VCC = 3.0V (3.3V -10%), USE C1 - C4 = 0.22µF. 4 22 FORCEOFF 21 INVALID GND 25 2 R4IN 5kΩ 15 R5OUT 23 13 R3IN 5kΩ 16 11 R3OUT 6 R3OUT 9 R2OUT TO POWER CONTROL LOGIC 10 19 16 VCC C4 0.1µF + R2OUTB T5OUT 21 3 C3 0.1µF T1OUT T3IN RS-232 LEVELS + 9 T2 12 12 T5IN V- 13 T4OUT 17 27 V+ T2IN 10 T4IN VCC T1IN T2OUT T3 C1+ 14 6 T2IN 26 24 T1OUT 23 0.1µF 28 C1 0.1µF 5 T1IN TTL/CMOS LOGIC LEVELS +3.3V + C3 (OPTIONAL CONNECTION, NOTE 2) R5IN RS-232 LEVELS ICL3224, ICL3226, ICL3238, ICL3244 Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, FORCEOFF, FORCEON . . . . . . . . . . . . . . . . . . -0.3V to 6V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V ROUT, INVALID, READY . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical, Note 4) θJA (oC/W) 20 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 80 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 140 20 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 125 28 Ld SSOP and TSSOP Packages . . . . . . . . . . . . 100 Moisture Sensitivity (see Technical Brief TB363) All Packages Not Listed Below . . . . . . . . . . . . . . . . . . . . . Level 1 16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 2 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC, SSOP, TSSOP - Lead Tips Only) Operating Conditions Temperature Range ICL32XXC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC ICL32XXI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 4. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF (ICL3238: C1 - C4 = 0.22µF @ VCC = 3V); Unless Otherwise Specified. Typicals are at TA = 25oC Electrical Specifications PARAMETER TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS DC CHARACTERISTICS Supply Current, Automatic Powerdown All RIN Open, FORCEON = GND, FORCEOFF = VCC 25 - 1.0 10 µA Supply Current, Powerdown FORCEOFF = GND 25 - 1.0 10 µA Supply Current, Automatic Powerdown Disabled All Outputs Unloaded, FORCEON ICL3244, VCC = 3V = FORCEOFF = VCC All Others, VCC = 3.15V 25 - 0.3 1.0 mA 25 - 0.3 1.0 mA Full - - 0.8 V VCC = 3.3V Full 2.0 - - V VCC = 5.0V Full 2.4 - - V LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low TIN, FORCEON, FORCEOFF Input Logic Threshold High TIN, FORCEON, FORCEOFF Transmitter Input Hysteresis Input Leakage Current 25 - 0.5 - V TIN, FORCEON, FORCEOFF Full - ±0.01 ±1.0 µA Output Leakage Current FORCEOFF = GND Full - ±0.05 ±10 µA Output Voltage Low IOUT = 1.6mA Full - - 0.4 V Output Voltage High IOUT = -1.0mA Full - V VCC -0.6 VCC -0.1 RECEIVER INPUTS Input Voltage Range Full -25 - 25 V Input Threshold Low VCC = 3.3V 25 0.6 1.2 - V VCC = 5.0V 25 0.8 1.5 - V Input Threshold High VCC = 3.3V 25 - 1.5 2.4 V VCC = 5.0V 25 - 1.8 2.4 V Input Hysteresis 25 - 0.5 - V Input Resistance 25 3 5 7 kΩ Full ±5.0 ±5.4 - V TRANSMITTER OUTPUTS Output Voltage Swing All Transmitter Outputs Loaded with 3kΩ to Ground 5 ICL3224, ICL3226, ICL3238, ICL3244 Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF (ICL3238: C1 - C4 = 0.22µF @ VCC = 3V); Unless Otherwise Specified. Typicals are at TA = 25oC (Continued) Electrical Specifications PARAMETER TEST CONDITIONS VCC = V+ = V- = 0V, Transmitter Output = ±2V Output Resistance Output Short-Circuit Current VOUT = ±12V, VCC = 0V or 3V to 5.5V, Automatic Powerdown or FORCEOFF = GND Output Leakage Current TEMP (oC) MIN TYP Full 300 10M - Ω Full - ±35 ±60 mA Full - - ±25 µA Full ±5 - - V MAX UNITS MOUSE DRIVEABILITY (ICL3244 Only) Transmitter Output Voltage (See Figure 11) T1IN = T2IN = GND, T3IN = VCC, T3OUT Loaded with 3kΩ to GND, T1OUT and T2OUT Loaded with 2.5mA Each ENHANCED AUTOMATIC POWERDOWN (FORCEON = GND, FORCEOFF = VCC) Receiver Input Thresholds to INVALID High See Figure 6 Full -2.7 - 2.7 V Receiver Input Thresholds to INVALID Low See Figure 6 Full -0.3 - 0.3 V INVALID, READY Output Voltage Low IOUT = 1.6mA Full - - 0.4 V INVALID, READY Output Voltage High IOUT = -1.0mA Full VCC-0.6 - - V ICL3238 25 - 0.1 - µs All Others 25 - 1 - µs ICL3238 25 - 50 - µs All Others 25 - 30 - µs Receiver or Transmitter Edge to Transmitters Enabled Delay (tWU) ICL3238, Note 5 25 - 25 - µs All Others, Note 5 25 - 100 - µs Receiver or Transmitter Edge to Transmitters Disabled Delay (tAUTOPWDN) Note 5 Full 15 30 60 sec Receiver Positive or Negative Threshold to INVALID High Delay (tINVH) Receiver Positive or Negative Threshold to INVALID Low Delay (tINVL) TIMING CHARACTERISTICS Maximum Data Rate RL = 3kΩ, CL = 1000pF, One Transmitter Switching Full 250 500 - kbps Receiver Propagation Delay Receiver Input to Receiver Output, CL = 150pF tPHL 25 - 0.15 - µs tPLH 25 - 0.15 - µs Receiver Output Enable Time Normal Operation (ICL3238/44 Only) 25 - 200 - ns Receiver Output Disable Time Normal Operation (ICL3238/44 Only) 25 - 200 - ns Transmitter Skew tPHL - tPLH 25 - 100 - ns Receiver Skew tPHL - tPLH Transition Region Slew Rate VCC = 3.3V, RL = 3kΩ to 7kΩ, Measured From 3V to -3V or -3V to 3V 25 - 50 - ns CL = 150pF to 1000pF 25 6 - 30 V/µs CL = 150pF to 2500pF 25 4 8 30 V/µs Human Body Model 25 - ±15 - kV IEC1000-4-2 Contact Discharge 25 - ±8 - kV IEC1000-4-2 Air Gap Discharge 25 - ±10 - kV Human Body Model 25 - ±2.5 - kV ESD PERFORMANCE RS-232 Pins (TOUT, RIN) All Other Pins NOTE: 5. An “edge” is defined as a transition through the transmitter or receiver input thresholds. 6 ICL3224, ICL3226, ICL3238, ICL3244 Detailed Description These ICL32XX interface ICs operate from a single +3V to +5.5V supply, guarantee a 250kbps minimum data rate, require only four small external 0.1µF capacitors, feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitters, and the receivers. Charge-Pump Intersil’s new ICL32XX family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate ±5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter functions at VCC = 3.3V. See the “Capacitor Selection” section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings. The ICL3238 and ICL3244 inverting receivers disable during forced (manual) powerdown, but not during automatic powerdown (see Table 2). Conversely, the monitor receiver remains active even during manual powerdown making it extremely useful for Ring Indicator monitoring. Standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral’s protection diodes (see Figures 2 and 3). This renders them useless for wake up functions, but the corresponding monitor receiver can be dedicated to this task as shown in Figure 3. VCC RXIN RXOUT -25V ≤ VRIN ≤ +25V 5kΩ GND ≤ VROUT ≤ VCC GND FIGURE 1. INVERTING RECEIVER CONNECTIONS VCC VCC CURRENT FLOW VCC Transmitters VOUT = VCC The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip ±5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. Transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see Table 2). These outputs may be driven to ±12V when disabled. All devices guarantee a 250kbps data rate for full load conditions (3kΩ and 1000pF), VCC ≥ 3.0V, with one transmitter operating at full speed. Under more typical conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF, one transmitter easily operates at 1Mbps. Transmitter inputs float if left unconnected, and may cause ICC increases. Connect unused inputs to GND for the best performance. Rx POWERED DOWN UART Tx SHDN = GND GND FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL VCC TRANSITION DETECTOR TO WAKE-UP LOGIC R2OUTB RX 7 ICL3238/44 VCC Receivers All the ICL32XX devices contain standard inverting receivers, but only the ICL3238 and ICL3244 receivers can tristate, via the FORCEOFF control line. Additionally, the ICL3238 and ICL3244 include a noninverting (monitor) receiver (denoted by the ROUTB label) that is always active, regardless of the state of any control lines. Both receiver types convert RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3kΩ to 7kΩ input impedance (see Figure 1) even if the power is off (VCC = 0V). The receivers’ Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. OLD RS-232 CHIP POWERED DOWN UART VOUT = HI-Z R2OUT TX R2IN T1IN T1OUT FORCEOFF = GND FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN Powerdown Functionality This 3V family of RS-232 interface devices requires a nominal supply current of 0.3mA during normal operation ICL3224, ICL3226, ICL3238, ICL3244 TABLE 2. POWERDOWN LOGIC TRUTH TABLE RCVR OR XMTR EDGE WITHIN 30 SEC? (NOTE 6) ROUTB FORCEOFF FORCEON TRANSMITTER RECEIVER INPUT INPUT OUTPUTS OUTPUTS OUTPUTS RS-232 LEVEL PRESENT AT RECEIVER INPUT? INVALID OUTPUT MODE OF OPERATION ICL3224, ICL3226 NO H H Active Active N.A. NO L NO H YES H H Active Active N.A. YES H L Active Active N.A. NO L YES H L Active Active N.A. YES H NO H L High-Z Active N.A. NO L NO H L High-Z Active N.A. YES H X L X High-Z Active N.A. NO L X L X High-Z Active N.A. YES H Normal Operation (Enhanced Auto Powerdown Disabled) Normal Operation (Enhanced Auto Powerdown Enabled) Powerdown Due to Enhanced Auto Powerdown Logic Manual Powerdown ICL322X - INVALID DRIVING FORCEON AND FORCEOFF (EMULATES AUTOMATIC POWERDOWN) X NOTE 7 NOTE 7 Active Active N.A. YES H Normal Operation X NOTE 7 NOTE 7 High-Z Active N.A. NO L Forced Auto Powerdown Normal Operation (Enhanced Auto Powerdown Disabled) ICL3238, ICL3244 NO H H Active Active Active NO L NO H H Active Active Active YES H YES H L Active Active Active NO L YES H L Active Active Active YES H NO H L High-Z Active Active NO L NO H L High-Z Active Active YES H X L X High-Z High-Z Active NO L X L X High-Z High-Z Active YES H Normal Operation (Enhanced Auto Powerdown Enabled) Powerdown Due to Enhanced Auto Powerdown Logic Manual Powerdown ICL3238, ICL3244 - INVALID DRIVING FORCEON AND FORCEOFF (EMULATES AUTOMATIC POWERDOWN) X NOTE 7 NOTE 7 Active Active Active YES H Normal Operation X NOTE 7 NOTE 7 High-Z High-Z Active NO L Forced Auto Powerdown NOTES: 6. Applies only to the ICL3238 and ICL3244. 7. Input is connected to INVALID Output. (not in powerdown mode). This is considerably less than the 5mA to 11mA current required of 5V RS-232 devices. The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 1µA, because the on-chip charge pump turns off (V+ collapses to VCC, V- collapses to GND), and the transmitter outputs tristate. Inverting receiver outputs may or may not disable in powerdown; refer to Table 2 for details. This micro-power mode makes these devices ideal for battery powered and portable applications. active and powerdown modes, under logic or software control, only the FORCEOFF input need be driven. The FORCEON state isn’t critical, as FORCEOFF dominates over FORCEON. Nevertheless, if strictly manual control over powerdown is desired, the user must strap FORCEON high to disable the enhanced automatic powerdown circuitry. ICL3238 and ICL3244 inverting (standard) receiver outputs also disable when the device is in powerdown, thereby eliminating the possible current path through a shutdown peripheral’s input protection diode (see Figures 2 and 3). Software Controlled (Manual) Powerdown Connecting FORCEOFF and FORCEON together disables the enhanced automatic powerdown feature, enabling them to function as a manual SHUTDOWN input (see Figure 4). These devices allow the user to force the IC into the low power, standby state, and utilize a two pin approach where the FORCEON and FORCEOFF inputs determine the IC’s mode. For always enabled operation, FORCEON and FORCEOFF are both strapped high. To switch between 8 With any of the above control schemes, the time required to exit powerdown, and resume transmission is only 100µs. ICL3224, ICL3226, ICL3238, ICL3244 uses this indicator to power down the interface block. Reconnecting the cable restores valid levels at the receiver inputs, INVALID switches high, and the power management logic wakes up the interface block. INVALID can also be used to indicate the DTR or RING INDICATOR signal, as long as the other receiver inputs are floating, or driven to GND (as in the case of a powered down driver). FORCEOFF PWR MGT LOGIC FORCEON INVALID ICL32XX VALID RS-232 LEVEL - INVALID = 1 2.7V I/O UART INDETERMINATE CPU 0.3V INVALID LEVEL - INVALID = 0 -0.3V FIGURE 4. CONNECTIONS FOR MANUAL POWERDOWN WHEN NO VALID RECEIVER SIGNALS ARE PRESENT When using both manual and enhanced automatic powerdown (FORCEON = 0), the ICL32XX won’t power up from manual powerdown until both FORCEOFF and FORCEON are driven high, or until a transition occurs on a receiver or transmitter input. Figure 5 illustrates a circuit for ensuring that the ICL32XX powers up as soon as FORCEOFF switches high. The rising edge of the Master Powerdown signal forces the device to power up, and the ICL32XX returns to enhanced automatic powerdown mode an RC time constant after this rising edge. The time constant isn’t critical, because the ICL32XX remains powered up for 30 seconds after the FORCEON falling edge, even if there are no signal transitions. This gives slow-to-wake systems (e.g., a mouse) plenty of time to start transmitting, and as long as it starts transmitting within 30 seconds both systems remain enabled. POWER MANAGEMENT UNIT MASTER POWERDOWN LINE 0.1µF FORCEOFF 1MΩ FORCEON INDETERMINATE -2.7V VALID RS-232 LEVEL - INVALID = 1 FIGURE 6. DEFINITION OF VALID RS-232 RECEIVER LEVELS Enhanced Automatic Powerdown Even greater power savings is available by using these devices which feature an enhanced automatic powerdown function. When the enhanced powerdown logic determines that no transitions have occurred on any of the transmitter nor receiver inputs for 30 seconds, the charge pump and transmitters powerdown, thereby reducing supply current to 1µA. The ICL32XX automatically powers back up whenever it detects a transition on one of these inputs. This automatic powerdown feature provides additional system power savings without changes to the existing operating system. Enhanced automatic powerdown operates when the FORCEON input is low, and the FORCEOFF input is high. Tying FORCEON high disables automatic powerdown, but manual powerdown is always available via the overriding FORCEOFF input. Table 2 summarizes the enhanced automatic powerdown functionality. FORCEOFF ICL32XX FIGURE 5. CIRCUIT TO ENSURE IMMEDIATE POWER UP WHEN EXITING FORCED POWERDOWN T_IN EDGE DETECT S 30sec TIMER INVALID Output The INVALID output always indicates (see Table 2) whether or not 30µs have elapsed with invalid RS-232 signals (see Figures 6 and 8) persisting on all of the receiver inputs, giving the user an easy way to determine when the interface block should power down. Invalid receiver levels occur whenever the driving peripheral’s outputs are shut off (powered down) or when the RS-232 interface cable is disconnected. In the case of a disconnected interface cable where all the receiver inputs are floating (but pulled to GND by the internal receiver pull down resistors), the INVALID logic detects the invalid levels and drives the output low. The power management logic then 9 R_IN AUTOSHDN R EDGE DETECT FORCEON FIGURE 7. ENHANCED AUTOMATIC POWERDOWN LOGIC Figure 7 illustrates the enhanced powerdown control logic. Note that once the ICL32XX enters powerdown (manually or automatically), the 30 second timer remains timed out (set), keeping the ICL32XX powered down until FORCEON The INVALID output signal switches low to indicate that invalid levels have persisted on all of the receiver inputs for more than 30µs (see Figure 8), but this has no direct effect on the state of the ICL32XX (see the next sections for methods of utilizing INVALID to power down the device). INVALID switches high 1µs after detecting a valid RS-232 level on a receiver input. INVALID operates in all modes (forced or automatic powerdown, or forced on), so it is also useful for systems employing manual powerdown circuitry. FORCEOFF INVALID transitions high, or until a transition occurs on a receiver or transmitter input. FORCEON ICL3224, ICL3226, ICL3238, ICL3244 ICL32XX I/O UART CPU The time to recover from automatic powerdown mode is typically 100µs. Emulating Standard Automatic Powerdown If enhanced automatic powerdown isn’t desired, the user can implement the standard automatic powerdown feature (mimics the function on the ICL3221/23/43) by connecting the INVALID output to the FORCEON and FORCEOFF inputs, as shown in Figure 9. After 30µs of invalid receiver levels, INVALID switches low and drives the ICL32XX into a forced powerdown condition. INVALID switches high as soon as a receiver input senses a valid RS-232 level, forcing the ICL32XX to power on. See the “INVALID DRIVING FORCEON AND FORCEOFF” section of Table 2 for an operational summary. This operational mode is perfect for handheld devices that communicate with another computer via a detachable cable. Detaching the cable allows the internal receiver pull-down resistors to pull the inputs to GND (an invalid RS-232 level), causing the 30µs timer to time-out and drive the IC into powerdown. Reconnecting the cable restores valid levels, causing the IC to power back up. FIGURE 9. CONNECTIONS FOR AUTOMATIC POWERDOWN WHEN NO VALID RECEIVER SIGNALS ARE PRESENT Hybrid Automatic Powerdown Options For devices which communicate only through a detachable cable, connecting INVALID to FORCEOFF (with FORCEON = 0) may be a desirable configuration. While the cable is attached INVALID and FORCEOFF remain high, so the enhanced automatic powerdown logic powers down the RS232 device whenever there is 30 seconds of inactivity on the receiver and transmitter inputs. Detaching the cable allows the receiver inputs to drop to an invalid level (GND), so INVALID switches low and forces the RS-232 device to power down. The ICL32XX remains powered down until the cable is reconnected (INVALID = FORCEOFF = 1) and a transition occurs on a receiver or transmitter input (see Figure 7). For immediate power up when the cable is RECEIVER INPUTS } INVALID REGION TRANSMITTER INPUTS TRANSMITTER OUTPUTS tINVH INVALID OUTPUT tINVL tAUTOPWDN tAUTOPWDN tWU tWU READY OUTPUT V+ VCC 0 V- FIGURE 8. ENHANCED AUTOMATIC POWERDOWN, INVALID AND READY TIMING DIAGRAMS 10 ICL3224, ICL3226, ICL3238, ICL3244 reattached, connect FORCEON to FORCEOFF through a network similar to that shown in Figure 5. Ready Output (ICL3224 and ICL3226 only) The Ready output indicates that the ICL322X is ready to transmit. Ready switches low whenever the device enters powerdown, and switches back high during power-up when V- reaches -4V or lower. Capacitor Selection The charge pumps require 0.1µF capacitors for 3.3V operation. For other supply voltages refer to Table 3 for capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without increasing C1’s value, however, do not increase C1 without also increasing C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors). When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-. ICL32XX transmitter outputs meet RS-562 levels (±3.7V), at the full data rate, with VCC as low as 2.7V. RS-562 levels typically ensure interoperability with RS-232 devices. Mouse Driveability The ICL3244 is specifically designed to power a serial mouse while operating from low voltage supplies. Figure 11 shows the transmitter output voltages under increasing load current. The on-chip switching regulator ensures the transmitters will supply at least ±5V during worst case conditions (15mA for paralleled V+ transmitters, 7.3mA for single V- transmitter). 5V/DIV FORCEOFF T1 VCC = +3.3V C1 - C4 = 0.1µF 2V/DIV T2 5V/DIV READY TABLE 3. REQUIRED CAPACITOR VALUES (Note 8) C1 (µF) C2, C3, C4 (µF) 3.0 to 3.6 (3.3V ±10%) 0.1 (0.22) 0.1 (0.22) 3.15 to 3.6 (3.3V ±5%) (0.1) (0.1) 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.1 (0.22) 0.47 (1.0) NOTE: 8. Parenthesized values apply only to the ICL3238 Power Supply Decoupling In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC. TIME (20µs/DIV.) FIGURE 10. TRANSMITTER OUTPUTS WHEN EXITING POWERDOWN 6 TRANSMITTER OUTPUT VOLTAGE (V) VCC (V) 5 3 Figure 10 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3kΩ in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V. Operation Down to 2.7V 11 VCC = 3.0V 2 1 T1 0 VOUT+ -1 T2 -2 ICL3244 -3 VCC -4 VOUT - T3 VOUT - -5 -6 Transmitter Outputs when Exiting Powerdown VOUT+ 4 0 1 2 3 4 5 6 7 8 9 10 LOAD CURRENT PER TRANSMITTER (mA) FIGURE 11. TRANSMITTER OUTPUT VOLTAGE vs LOAD CURRENT (PER TRANSMITTER, i.e., DOUBLE CURRENT AXIS FOR TOTAL VOUT+ CURRENT) High Data Rates The ICL32XX maintain the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 12 details a transmitter loopback test circuit, and Figure 13 illustrates the loopback test result at 120kbps. For this test, all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 14 shows the loopback results ICL3224, ICL3226, ICL3238, ICL3244 for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters were also loaded with an RS-232 receiver. 5V/DIV. T1IN VCC 0.1µF + + VCC C1+ V+ C1 C1- + C3 T1OUT ICL32XX + V- C2+ C2 C4 + R1OUT C2TIN RIN ROUT 2µs/DIV. 1000pF FIGURE 14. LOOPBACK TEST AT 250kbps FORCEON VCC VCC = +3.3V C1 - C4 = 0.1µF TOUT 5K FORCEOFF Interconnection with 3V and 5V Logic FIGURE 12. TRANSMITTER LOOPBACK TEST CIRCUIT 5V/DIV. T1IN The ICL32XX directly interface with 5V CMOS and TTL logic families. Nevertheless, with the ICL32XX at 3.3V, and the logic supply at 5V, AC, HC, and CD4000 outputs can drive ICL32XX inputs, but ICL32XX outputs do not reach the minimum VIH for these logic families. See Table 4 for more information. TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES VCC SUPPLY SYSTEM POWER-SUPPLY VOLTAGE (V) VOLTAGE (V) T1OUT R1OUT VCC = +3.3V C1 - C4 = 0.1µF 3.3 3.3 5 5 5 3.3 COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. 5µs/DIV. FIGURE 13. LOOPBACK TEST AT 120kbps 12 Compatible with ACT and HCT CMOS, and with TTL. ICL32XX outputs are incompatible with AC, HC, and CD4000 CMOS inputs. ICL3224, ICL3226, ICL3238, ICL3244 Typical Performance Curves VCC = 3.3V, TA = 25oC 6 VOUT+ TRANSMITTER OUTPUT VOLTAGE (V) TRANSMITTER OUTPUT VOLTAGE (V) 6 4 ICL3224, ICL3226, ICL3244 2 1 TRANSMITTER AT 250kbps OTHER TRANSMITTERS AT 30kbps 0 -2 -4 VOUT - -6 0 1000 2000 3000 4000 VOUT+ 4 ICL3238 2 1 TRANSMITTER AT 250kbps OTHER TRANSMITTERS AT 30kbps 0 -2 -6 5000 VOUT - -4 0 1000 LOAD CAPACITANCE (pF) 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 15. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE FIGURE 16. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE 25 40 ICL3224 SLEW RATE (V/µs) 20 SUPPLY CURRENT (mA) 35 -SLEW 15 +SLEW 10 250kbps 30 25 120kbps 20 15 20kbps 10 5 5 0 1000 2000 3000 4000 5000 0 1000 LOAD CAPACITANCE (pF) FIGURE 17. SLEW RATE vs LOAD CAPACITANCE 3000 4000 5000 FIGURE 18. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA 35 55 ICL3226 ICL3238 30 50 250kbps SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 2000 LOAD CAPACITANCE (pF) 25 20 120kbps 15 10 20kbps 5 45 250kbps 40 120kbps 35 30 25 0 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 19. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA 13 20kbps 20 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 20. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA ICL3224, ICL3226, ICL3238, ICL3244 Typical Performance Curves VCC = 3.3V, TA = 25oC (Continued) 3.5 45 NO LOAD ALL OUTPUTS STATIC ICL3244 3.0 250kbps SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 40 35 30 120kbps 25 20 20kbps 2.5 2.0 1.5 1.0 15 0.5 10 0 2000 1000 3000 4000 5000 LOAD CAPACITANCE (pF) 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) FIGURE 21. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: ICL3224: 937 ICL3226: 825 ICL3238: 1235 ICL3244: 1109 PROCESS: Si Gate CMOS 14 FIGURE 22. SUPPLY CURRENT vs SUPPLY VOLTAGE 6.0 ICL3224, ICL3226, ICL3238, ICL3244 Dual-In-Line Plastic Packages (PDIP) E20.3 (JEDEC MS-001-AD ISSUE D) 20 LEAD DUAL-IN-LINE PLASTIC PACKAGE N E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AE D BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.55 1.77 8 eA C 0.008 0.014 C D 0.980 1.060 24.89 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 eB NOTES: e 0.100 BSC 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. eA 0.300 BSC 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. eB - 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. L 0.115 N 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 15 0.204 20 0.355 26.9 5 2.54 BSC - 7.62 BSC 6 0.430 - 0.150 2.93 20 10.92 7 3.81 4 9 Rev. 0 12/93 ICL3224, ICL3226, ICL3238, ICL3244 Small Outline Plastic Packages (SSOP) M16.209 (JEDEC MO-150-AC ISSUE B) 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA 0.25(0.010) M H B M INCHES E GAUGE PLANE -B1 2 3 L 0.25 0.010 SEATING PLANE -A- A D -C- µα e B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.233 0.255 5.90 6.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 16 0.026 BSC H 0.292 L 0.022 N α NOTES: MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 16 0o - 8.20 - 0.95 6 16 8o 0o 7 8o Rev. 2 3/95 ICL3224, ICL3226, ICL3238, ICL3244 Shrink Small Outline Plastic Packages (SSOP) M20.209 (JEDEC MO-150-AE ISSUE B) 20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA 0.25(0.010) M H B M INCHES E GAUGE PLANE -B1 2 3 L 0.25 0.010 SEATING PLANE -A- A D -C- µα e B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.272 0.295 6.90 7.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 17 0.026 BSC H 0.292 L 0.022 N α NOTES: MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 20 0o - 0.95 6 20 8o 0o - 8.20 7 8o Rev. 2 4/95 ICL3224, ICL3226, ICL3238, ICL3244 Thin Shrink Small Outline Plastic Packages (TSSOP) M28.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE B M 3 L 0.05(0.002) -A- SEATING PLANE A D -C- α e A2 A1 b 0.10(0.004) M 0.25 0.010 c 0.10(0.004) C A M B S SYMBOL MIN MAX MIN MAX NOTES A - 0.047 - 1.20 - A1 0.002 0.006 0.05 0.15 - A2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - D 0.378 0.386 9.60 9.80 3 E1 0.169 0.177 4.30 4.50 4 e 0.026 BSC E 0.246 L 0.0177 N α NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AE, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 18 MILLIMETERS 0.65 BSC 0.256 6.25 0.0295 0.45 28 0o - 0.75 6 28 8o 0o - 6.50 7 8o Rev. 0 6/98 ICL3224, ICL3226, ICL3238, ICL3244 Small Outline Exposed Pad Plastic Packages (EPSOIC) M28.3B N INDEX AREA H 0.25(0.010) M 28 LEAD WIDE BODY SMALL OUTLINE EXPOSED PAD PLASTIC PACKAGE B M E INCHES -B- 1 2 SYMBOL 3 TOP VIEW L SEATING PLANE -A- h x 45o A D -C- A1 B 0.25(0.010) M C 0.10(0.004) C A M SIDE VIEW MAX NOTES A 0.091 - 0.099 - 0.001 - 0.005 - B 0.014 - 0.019 9 C 0.0091 - 0.0125 - D 0.701 - 0.711 3 E 0.292 - 0.299 4 0.050 BSC - H 0.400 - 0.410 - h 0.010 - 0.016 5 L 0.024 - 0.040 6 N α B S NOMINAL A1 e α e MIN 28 0° 5° 7 8° - P 0.180 0.214 0.218 11 P1 0.156 0.190 0.194 11 Rev. 0 5/02 1 2 3 NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. P1 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. N P BOTTOM VIEW 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: INCH. 11. Dimensions “P” and “P1” are thermal and/or electrical enhanced variations. Values shown are maximum size of exposed pad within lead count body size. 19 ICL3224, ICL3226, ICL3238, ICL3244 Shrink Small Outline Plastic Packages (SSOP) M28.209 (JEDEC MO-150-AH ISSUE B) 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA 0.25(0.010) M H B M INCHES E GAUGE PLANE -B1 2 3 L 0.25 0.010 SEATING PLANE -A- A D -C- µα e B C 0.10(0.004) 0.25(0.010) M C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.390 0.413 9.90 10.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B S 0.026 BSC H 0.292 L 0.022 N α NOTES: MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 28 0o - 0.95 6 28 8o 0o - 8.20 7 8o 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. Rev. 1 3/95 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 20