Industrial Solutions Brochure

ON Semiconductor has a complete portfolio of rugged, reliable products
that meet the needs of industrial grade applications.
HVAC
Control
AC
Drive
CCTV Control
Smoke
Detection
Fire Detection
& Alarm
•Power Management
•Temperature Monitoring
& Control
•Motion & Speed Control
•Electro-Mechanical Break
Control
•Switching & Valve Control
•Local Communications
•Image Sensing
•Sensor Interface
•Electrical Protection
•Oscillator Startup
•Capacitance Discharge
Lighting
Control
Security &
Access Control
Ventilation
Building Systems
Integration (Networking)
HVAC
Control
Security
System
Kitchen
Appliances
White
Goods
Lighting
Control
Energy Management
Page 2
Energy
Management
Sprinkler &
Irrigation Systems
Industrial Solutions
Mixed-Signal ASIC Development Services
Value Proposition
• Experienced resources and assets to bring customers’ design objectives successfully to market
• Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP
• Flexible cost models to reduce customers’ total cost
High Voltage (40 to 80 V)
Low Voltage (<3.3 V)
Low or
High
Voltage
Power/
Battery
Management
Wired
Communications
Analog
Signals
Filtering
Example:
Sensor:
• Magnetic Flux
• Temperature
• Light
• Sound
• Pressure
• Acceleration
• Angular Rate
Amplification
Analog/
Digital
Conversion
• RF
Wireless
Radio
Signal
Processing
Actuator
• Coil Driver
• Class-D Amp
• DAC
• Display Driver
Supporting
Logic
Memory
• EEPROM
• OTP
• SRAM
• ROM
IP & Fab Processes
• ≥55 nm, analog-focused CMOS/BCDMOS process technologies
utilizing internal fabs and external foundry partners
• Low, medium, high voltages — ≤1 V to 90 V
• Low current optimization — active & standby
• Low noise design — “count the electrons”
• High temperature — ≤200°C (profile, for selected technologies)
• Integrated low power wireless
• Non-Volatile Memory (EEPROM, OTP), RAM & ROM
• Embedded digital IP
• Robust ESD protection
• Extensive building block ‘starting points’ consisting of amplifiers,
references, DACs, ADCs, linear & switching regulators, power
management, etc.
ON Semiconductor
Low or
High
Voltage
• Microcontroller
• DSP
Sensor Interface
ASIC
Design Engineering
• CAN, LIN
• I2C-bus
• USB
• KNX
• M-BUS
Example:
Mechanical or
Electrical System:
• Stepper Motors
• Transducers
• MOSFETs & BJTs
• Relays
• Speakers
• Lamps
• LCD/LED Displays
• Approximately 200 expert mixed-signal
designers with extensive SoC and SiP
experience
• Robust custom development process
• Dedicated project managers track & report
development progress
• Flexible customer development engagement,
from full turnkey to subcontractor
production services
• Design expertise in:
» Sensor interface
» Wireless systems
» Energy management
» Building & home control
Category
Mixed Signal Intellectual Property (IP)
Serial Interfaces
USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART
Microprocessors
ARM, RCore DSP, R8051, AMBA/AHB/APB Peripherals
Memory
SRAM, DPRAM, ROM, EEPROM, OTP, FLASH
Clocking
Oscillators, PLLs, DLLs
Communication
Wireless (Proprietary & Standards), Wired (KNX, PLC
and others)
Encryption
ECC, AES, 3-DES, DES, RSA
Data Converters
DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS)
Wireless IP
PGA, LNA, PLLs, Correlators, DSP
Power Management
Efficient Switching Regulators, LDOs, Charge Pumps,
Thermal Protection
References
Precision Bandgaps, Current References, Temperature
Sensors
Analog and High Voltage
Interfaces
High-Voltage Drivers, Display and LCD Drivers, Class D
Amplifiers
Signal Conditioning
PGA, Instrumentation Amps, Digital and Analog Filters
Page 3
PLC Modems/Power Line Driver
R6
3V3_A
C16
R7
12 V
C9
12 V
R10
MAINS
R8
C6
3V3_D
C7
3V3_D
C17
VDD
VDDA
R12
VCC
D1
R5
NCS5651
D2
VEE
C4
Vwarn
Vcom
R4
GNDuC
T_REQ
TXD
C3
BR0
3V3_D
C5
R3
C2
R2
RX_OUT
C1
RX_IN
BR1
NCN49597
R14
TX_ENB
C11
Application
&
Metering
μC
RXD
Rlim
R9
C10
TX_OUT
RESB
VDD1V8
R1
D5
CDREF
R11
REF_OUT
ZC_IN
C15
SEN
VSS
Tr
1:2
3 V 3_A
VSSA
D4
XTAL_OUT
D3
XTAL_IN
COMMUNICATION
C8
EXT_CLK_E
C12
C13
Device
Smart
Grid
Modem
Function
Features
Package(s)
NCN49599
PLC S-FSK Modem;
A - D Band
• ARM Cortex M0
• Baud rate: 4800 Bauds
• S-FSK modulation
• Hardware embedded MAC + PHY
• Embedded 1.2 A, 2-stage power amplifier
with current limitation and thermal
protection
QFN-56
NCN49597
PLC S-FSK Modem;
A - D Band
• ARM Cortex M0
• Baud rate: 4800 Bauds
• S-FSK modulation
• Hardware embedded MAC + PHY
QFN-52
• ARM7TDMi, 24 MHz core
• Baud rate: 2400 Bauds
• S-FSK modulation
• Hardware embedded MAC + PHY
• Low distortion power line driver with
optimized interface for PLC modems
• Capability to drive 2.0 A peak into
reactive loads
• Current shutdown minimizes power
consumption during power down state
• Rail-to-Rail Drop of Only ±1 V with
Iout = 1.5 A
Smart
Metering AMIS49587
Modem
PLC S-FSK Modem;
A & B Band
Power
NCS5651
Amplifier
Power Line Driver;
Class AB
Page 4
C14
QFN-52
QFN-20 EP
Industrial Solutions
COMMUNICATION
Modems
AMIS-49200 & AMIS-49250 Fieldbus Physical Layer Medium Access Units
•Compatible to both FOUNDATION Fieldbus H1 (Type 111 and Type
112 per FF-816) and PROFIBUS PA standards
•Enables Fieldbus to completely power field devices using the
integrated power supply block
•Data rate: 31.25 kbps voltage mode
•Low current consumption 500 μA typ
•LQFP-44 and NQFP-44 packages
Process
Sensor
Microprocessor
with RAM and ROM
Industrial HART Protocol Modems
Link
Controller
Fieldbus
Segment
Fieldbus
MAU
VDDA
1.8 V − 3.5 V
•Single-chip, half-duplex 1200 bps FSK modem
•Bell 202 shift frequencies of 1200 Hz and 2200 Hz
•Transmit-signal wave shaping
•Receive band-pass filter
VDD
VDDA
RxAFI
RxAF
RxAP
RESET
VPOR
HART IN
RxAN
KICK
RxD
Device
NCN5193
TxD
Input
Frequency
DAC
460.8 kHz,
920 kHz,or
1.8 MHz
Integrated
16-bit
Sigma-Delta
Temp Range
(°C)
Package
μC
RTS
AREF
NCN5193
CDREF
CS
DATA
–40 to +85
QFN-32
CLK1
DAC
CLK2
JUMP
NCN5192
–40 to +85
QFN-32
A5191HRT
460.8 kHz
External
–40 to +85
QFN-32,
LQFP-32,
PLCC-28
3.6864 MHz
VDDA
DACREF
XOUT
Integrated
16-bit
Sigma-Delta
HART &
4 – 20 mA OUT
TxA
SCLK
460.8 kHz,
920 kHz,or
1.8 MHz
ON Semiconductor
VDDA
CD
HART Modems
TEST2
TEST1
XIN
CBIAS
VSS
MODE
Page 5
CAN Transceivers for Long Networks, >500 m
COMMUNICATION
CAN
BUS 1
VBAT
5 V−reg
CD
100 nF
VCC
EN1
EN2
Rx0
Tx0
Text
Rint
Features
•ISO 11898-2 compliant
•Up to 1 Mb/s communication speed
•Delivers low transmit data rate in networks
exceeding 1 km
•Functional in 12 V and 24 V systems
10
Vref
8 13 CANH1
12
2
7
4
14
AMIS–42770
19
3
9
CAN
BUS 2
5
18
6 15 16 17
CANL1
RLT
60
CANH2
CANL2
RLT
60
GND
CAN Transceivers
Page 6
Device
Type
Description
Package
AMIS42770
Dual
High-Speed CAN Repeater
SOIC-20
AMIS42670
Single
High-Speed CAN Transceiver for Long Networks
SOIC-8
AMIS42671
Single
High-Speed CAN Transceiver for Long Networks
SOIC-8
AMIS42673
Single
High-Speed CAN Transceiver for Long Networks
SOIC-8
AMIS42675
Single
High-Speed CAN Transceiver for Long Networks
SOIC-8
Industrial Solutions
KNX is a standardized (EN 50090, ISO/IEC 14543), OSI-based
network communications protocol for intelligent buildings. KNX is
the successor to, and convergence of, three previous standards:
KNX Open Standards
Applications
•EN 50090: European Standard
•ISO/IEC 14543-3: International Standard
•GB/Z 20965: Chinese Standard
•ANSI/ASHRAE 135: US Standard
DC=DC Converters
Device
NCN5120
the European Home Systems Protocol (EHS), BatiBUS, and the
European Installation Bus (EIB or Instabus).
•Connects appliances and sensors, especially for climate
and light control to the 9600 Baud KNX twisted pair (TP)
bus inside a building
•TP bus provides data communication and power supply
KNX Host Interface
Fixed 3.3 V
Adj 3.3 to 21 V
20 V
Regulator
Embedded
MAC + LLC1
Digital SPI/UART
Analog UART
Package
4
4
4
4
4
4
QFN-40
Note 1: LLC = Logical Link Control layer of the OSI-based communications network.
Wired M-BUS Transceiver
Features
•Satisfies physical requirements for M-BUS, described in EN 13757-2 and EN 1434-3
•UART communication speeds up to 38400 baud
•Integrated 3.3 V VDD LDO regulator (extended peak current of 15 mA)
•Supports powering slave device from the bus or from external power supply
•SOIC-16 and QFN-20 packages
CVDD
μC
VS
VIO
VDD
TXI
TX
RX
RXI
PFb
RIS
RIS
NCN5150
BUSL2
VB
BUSL1
SC
GND RIDD
CSC
RBUS1
TVS1
MBUS
RBUS2
STC
RIDD
CSTC
General Application Diagram
ON Semiconductor
Page 7
COMMUNICATION
KNX Transceiver
Stepper Motor Drivers for Motion Control
VBAT
C7
100 F
C5
CPN
AMIS–30624
2
16 MOTXN
M
8
15
2,7 nF
5
4
7
14
17
Simple Motor Control System
TST1
•
•
•
•
GND
AMIS-30624 Application Diagram
100 Ω
SGND
0.1 Ω
48
SFT1342
SFT1342
SFT1446
SFT1446
0.1 Ω
27
26
25
VCC
28
NC
16
NC
47
STB
SDATA
SCLK
ST
12
46
GB1
NC
GU2
GU1
NC
45
11
44
100 Ω
10
43
LV8726TA
23
NC
NC
42
24
MO
SDO
VREF
FR
OE
RST
STEP
9
41
0Ω
PGND
100 Ω
0.1 uF
PGND
Page 8
22
48 V
LV8726TA Application Diagram
47 kΩ
47 kΩ
21
20
19
18
Logic
Input
17
15
14
Serial
Input
13
LV8726TA Features
PGND
100 uF
100 uF
SGND
EMO
RF1
NC
VM
VREG2
39
29
36
GB3
NC
GU4
GU3
NC
NC
GB2
40
0Ω
NC
NC
OUT4
OUT3
GB4
38
5
100 Ω
37
NC
NC
OUT2
OUT1
0Ω
5V
0.1 uF
PGND
35
SFT1446
SFT1446
2
SFT1342
SFT1342
Sensorless stall detection
Micro-stepping
Position controller
Programmable velocity
and acceleration
1
* Optional diodes and damping resistors for each gate are connected
to control turn OFF time of P-N channel MOSFETS, if needed.
0Ω
MOTYN
NC
NC
CONTROL & DRIVE
13
6
MOTYP
30
TST2
MOTXP
8
C1
HW
18
Connect
to VBAT
or GND
2,7 nF
31
1k
1
1k
SWI C
2
7
SCK
19
20
32
Connect
to VBAT
or GND
I2C Bus
VBB
12
6
Serial
Interface
VBB
11
33
SDA
CPP VCP
10
100 nF
100 nF
RF2
NC
GND
VREG1
Embedded LDO
9
3
C4
C3
220 nF
34
VDD
C6
220 nF
4
100 nF
3
C8
0.1 uF
•High operating voltage (Vmmax = 60 V) for
Safe design and high tolerance
•Low standby current and low operation
current for low power consumption
•16 selectable step modes
Applications
•Textile machine
•Knitting machine
•Sewing machine
•Packing machine
•Engraving machine
•Large printer
Industrial Solutions
Features
25
23
22
21
20
19
CONTROL & DRIVE
26
27
28
29
30
31
32
33
34
35
Logic
Input
24
18
17
16
15
14
13
12
1
48
11
47
9
46
8
45
1.5 kΩ
44
NC
PGND4
NC
OUT4A
NC
OUT4B
OUT3B
NC
OUT3A
NC
PGND3
NC
LV8714TA
7
43
6
•Scanner
•Point-of-sale printer
•Thermal printer
Logic Input
•Security camera
•CCTV
•Network camera
42
5
41
4
Applications
1.5 kΩ
40
3
39
NC
PGND2
NC
OUT2A
NC
OUT2B
OUT1B
NC
OUT1A
NC
PGND1
NC
VM1
ENA1
IN1
VREF1
RCS1
PS
VREG3
RCS3
VREF3
IN3
ENA3
VM3
38
2
37
Logic
Input
VM2
ENA2
IN2
VREF2
RCS2
GND
NC
RCS4
VREF4
IN4
ENA4
VM4
36
Logic
Input
10
•Free microstep drive (full, half, 1/4, … 1/256, over
1/256) enabled by controlling VREF voltage; low
vibration and high convenience
•Constant current control without RF high power
resistor results in simpler design and lower cost
•No charge pump results in fewer external parts and
small package
1.5 kΩ
1.5 kΩ
Stepper Motor Drivers for Motion Control
Logic
Input
LV8714TA Application Diagram
Device
Type
AMIS-30422
AMIS-30543
AMIS-30624
LV8414CS
LV8702V
LV8711T
LV8712T
LV8713T
LV8714TA
LV8716QA
LV8726TA
LV8727
LV8729V
LV8731V
LV8732V
LV8734V
LV8735V
LV8736V
LV8740V
LV8760T
LV8762T
LV8774Q
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper/Brush DC
Stepper
Stepper
Stepper
Stepper/Brush DC
Stepper
Stepper
Stepper
Stepper/Brush DC
Stepper/Brush DC
Stepper/Brush DC
Stepper/Brush DC
Stepper/Brush DC
Stepper/Brush DC
Brush DC
Brush DC
Stepper/Brush DC
VM Max VCC Max
(V)
(V)
30
30
30
6
36
18
18
18
18
12.6
50
50
36
36
36
36
36
36
38
38
36
36
40
40
40
6
—
6
6
6
6
—
6
—
—
—
—
—
—
—
—
6
—
—
IO Max
(A)
IO Peak Max
(A)
Step
Resolution
Control Type
Current Sense
Protection
Package
Note 1
3.2
0.8
0.4
2.5
0.8
0.8
0.8
1.5
1
Note 1
4
1.8
2
2
1.5
1
1
2.5
3
1
2
Note 1
6
0.8
0.6
3
1
1
1
1.75
1.5
Note 1
4.6
—
2.5
2.5
1.75
1.5
1.5
3
4
1.5
2.5
1/128
1/128
1/16
1/64
1/4
1/2
1/8
1/32
Over 1/256
1/2
1/128
1/128
1/128
1/16
1/8
1/8
1/16
1/8
1/4
—
—
1/16
Clock
Clock
I2C
CLK; I2C
Clock
Parallel
Clock
Clock
Parallel
Parallel
Clock; SPI
CLK
CLK
Clock; Parallel
Clock; Parallel
Clock; Parallel
Clock; Parallel
Clock; Parallel
Clock; Parallel
Parallel
Parallel
Clock; Parallel
Fully Integrated
Fully Integrated
Fully Integrated
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
RF Resistor less
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
External Resistor
Note 2
Note 2
Note 2
TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
OCP, TSD, UVLO
NQFP-48
NQFP-32
NQFP-32, SOIC-20W
WLP-32J
SSOP-44J
TSSOP-24
TSSOP-24
TSSOP-24
TQFP-48 EP
QFN-16
TQFP-48 EP
HZIP-25
SSOP-44K
SSOP-44K
SSOP-44K
SSOP-44K
SSOP-44K
SSOP-44K
SSOP-44J
TSSOP-20J
TSSOP-24
VQFN-44L
NOTE 1: Function of external MOSFETs.
NOTE 2: Integrated active flyback, under-voltage, over-voltage, over-current, over-temperature, under-temperature, safe position upon loss of communication, BEMF output for stall or step loss detection.
ON Semiconductor
Page 9
Stepper Motor Drivers for Motion Control
Key Features
•For Unipolar Stepper Motor Drive by
IPM (Intelligent Power Module)
•Current Sense, Fault Detections are
Fully integrated
•Pin-compatible line up
CONTROL & DRIVE
SIP-19
SIP-19S
Device
STK672-430AN-E
STK672-432AN-E
STK672-432BN-E
STK672-440AN-E
STK672-440BN-E
STK672-442AN-E
STK672-442BN-E
STK672-630AN-E
STK672-632AN-E
STK672-640AN-E
STK672-642AN-E
STK672-732AN-E
STK672-740AN-E
Page 10
Type
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper
Stepper
VM Max VCC Max
(V)
(V)
52
52
52
52
50
52
50
52
52
52
52
52
52
5.25
5.25
5.25
5.25
5.25
5.25
5.25
5.25
5.25
5.25
5.25
5.25
5.25
Block Diagram for STK672-440BN-E
Fault Detection
IO Max
(A)
IO Peak Max
(A)
Step
Resolution
Control Type
Current Sense
Overcurrent
Thermal
UVLO
Package
2.5
2.5
2.5
3.5
3.5
3.5
3.5
2.65
2.65
4
4
2.65
4
10
10
10
20
20
20
20
10
10
20
20
10
20
1/16
1/16
1/16
1/16
1/16
1/16
1/16
1/2
1/2
1/2
1/2
1/2
1/2
Clock
Clock
Clock
Clock
Clock
Clock
Clock
Clock
Clock
Clock
Clock
Parallel
Parallel
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Fully Integrated
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
SIP-19
SIP-19S
SIP-19S
SIP-19
SIP-19
SIP-19S
SIP-19S
SIP-19
SIP-19S
SIP-19
SIP-19S
SIP-19S
SIP-19
Industrial Solutions
Brush DC Motor Control
Key Features
CONTROL & DRIVE
•No need for dead time design
•Built-in Sensing resistor
STK681-300/-310/-320/-360
•Built-in Protective Functions
STK681-332/-352
•PWM operation
STK681-332/-352/-360
Block Diagram for STK681-332-E
Device
STK681-300
STK681-310
STK681-320
STK681-332-E
STK681-352-E
STK681-360-E
Fault Detection
Type
VM Max
(V)
VCC Max
(V)
IO Max
(A)
IO Peak Max
(A)
Control Type
Current Sense
Overcurrent
Thermal
UVLO
Package
Brush DC
Brush DC
Brush DC
Brush DC
Brush DC
Brush DC
52
52
52
52
38
52
5.25
5.25
5.25
5.25
—
5.25
2.9
4.2
5.2
8.5
6.4
5.8
5
8
8
12
12
8
Parallel
Parallel
Parallel
Parallel PWM
Parallel PWM
Parallel PWM
Fully Integrated
Fully Integrated
Fully Integrated
External Resistor
External Resistor
Fully Integrated
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Yes
Yes
No
SIP-19
SIP-19
SIP-19
SIP-19S
SIP-19S
SIP-19
* It is not necessary Vcc input for STK681-352-E
ON Semiconductor
Page 11
Brushless DC Motor Control
LV8827LFQA Features
F/R input
CONTROL & DRIVE
•VCC max = 36 V, IO max = 1.5 A (built-in
output transistor)
•Speed control and synchronous rectification
using direct PWM input
•1-Hall FG output
•Latch type constraint protection circuit (the
latch is released by S/S and F/R)
•Forward/reverse switching circuit, Hall bias
pin
•Power save circuit (power save in stop mode)
•Integrated current limit, low-voltage
protection, thermal shutdown circuit
•Charge pump circuit; 5 V regulator output
•Start/stop circuit (short brake when motor is
to be stopped)
PWMIN input
F/R
F/R
S/S input
PWMIN
S/S
PWMIN
S/S
VREG
CSD
CSD
OSC
VREG
VCC
LVSD
VCC1
VCC2
MOSC
VG
TSD
CONTROL
CIRCUIT
LDA
CHARGE
PUMP
3FG
FG output
FG
+
CP1
CP2
OUT1
FG
DRIVER
HALL HYS AMP
HB
IN1+ IN1- IN2+ IN2- IN3+ IN3-
CURR
LIM
HB
OUT2
OUT3
RF
SGND PGND
VCC
LV8827LFQA 3-Phase Brushless DC Motor Driver
Description
VCC Min
(V)
LV8121V
Brushless DC 3-Phase Motor Controller
8
LV8824QA
Brushless DC 3-Phase Motor Pre-Driver
7
LB11696V
Brushless DC 3-Phase Motor Controller
4.5
18
1.05
30
SSOP-30
Brushless DC 3-Phase Motor Driver
8
36
1.35
1500
VQFN-24N
LV8127T
Brushless DC 3-Phase Motor Controller
121
232
1.1
50
TSSOP-36
MC33033
Brushless DC 3-Phase Motor Controller
10
30
0.619 – 0.867*
100
SOIC-20, PDIP-20
MC33035
Brushless DC 3-Phase Motor Controller
10
30
0.650 – 0.867*
100
SOIC-24, PDIP-24
MC33039
Closed-Loop Brushless Motor Adapter
5.5
9
0.650 – 0.867*
20
SOIC-8, PDIP-8
Device
LV8827LFQA
VCC Max
(V)
PO Max
(W)
IO Max
(mA)
Package
36
1.7
3500
SSOP-44K
34
1.45
50
VQFN-32U
* Dependent upon package. 1. VM Min = 18 V. 2. VM Max = 190 V.
Page 12
Industrial Solutions
Brushless DC Motor Control
LV8824QA Features
CTL
Input
PWM
PWMIN
Input
CTL
CONTROL & DRIVE
•Speed control and synchronous rectification using direct PWM input and
DC voltage
•3-Hall FG output
•Latch type constraint protection
•Forward/reverse switching circuit, Hall bias pin
•Power save circuit
•Integrated current limit; low-voltage protection; thermal shutdown circuit
•Charge pump circuit(external N-Channel/N-Channel), 5 V regulator output
•Start/stop circuit (short brake when motor is to be stopped)
S/B
Input
PWMIN
S/B VREG
VCC
VG
F/R
Input
PWM
F/R
VREG
CTL
PWMIN
Start/
Brake
5VREG
F/R
CHARGE
PUMP
CP2
CP1
VM
STIME
CSD
SYNC TIME
A/D(2bit)
UH
UOUT
CSD
OSC
MOSC
3FG
Output
LVSD
PRE
DRIVER
CONTROL
LOGIC
VH
VOUT
LDA
3FG
GND
UL
VL
M
3FG
WH
VREG
MODE
FG
MODE
SELECT
A/D(2bit)
GND
WOUT
WL
HALL HYS AMP
IN1+ IN1- IN2+ IN2- IN3+ IN3-
CURR
LIM
HB
RF
HB
VCC
Application Diagram for LV8824QA
ON Semiconductor
Page 13
Brushless DC Motor Control
MC33033/5 Features
MC33039 Features
•Rotor position decoder for proper commutation sequencing
•Temperature compensated reference capable of supplying
sensor power
•Frequency programmable sawtooth oscillator
•Three open collector top drivers
•Three high current totem pole bottom drivers
CONTROL & DRIVE
1
8
2
3
•Digital detection of each input transition for improved low
speed motor operation
•Operation down to 5.5 V for direct powering from
MC33035 reference
•Internal shunt regulator allows operation from a nonregulated voltage source
•Inverter output for easy conversion between 60°/300°
and 120°/240° sensor phasing conventions
1.0 M
7
MC33039
4
6
VM (18 to 30 V)
750 pF
5
1.1 k 1.1 k
330
0.1
1.1 k
1000
1.0 k
2
1.0 k
20
4.7 k
19
3
18
4
17
1
F/R
5
6
0.01
Speed
Faster
5.1 k
MC33033
8
13
9
12
10
11
S
S
470
470
470
15
14
N
N
16
7
1.0 M
10 k
1.0 k
Enable
Motor
1N5819
1N4742
100
0.1
0.1
33
0.05/1.0 W
0.1
100 k
Close Loop
Application Diagram for MC33033 and MC33039
Page 14
Industrial Solutions
Inverter Drive – Discrete and Module Designs
Integrated Power Module
PWM1
PWM5
PWM3
PWM5
PWM3
MCU
AC
PWM4
Gate Driver
PWM1
Motor
PWM2
PWM0
PWM2
CONTROL & DRIVE
PWM0
PWM4
Discrete
Intelligent Power Modules (IPM) for Inverter Designs
Insulated Metal Substrate Technology (IMST®) forms electronic circuits on plates of aluminum (metal substrates). IMSTbased hybrid devices use the high thermal conductivity plates of aluminum for their base substrates.
Hybrid devices from ON Semiconductor enable power output circuits, control circuits, and peripheral circuits to be mounted
on the same substrate. IMST succeeds in turning bare chip mounting into an element technology, and will continue to evolve
as an outstanding mounting technology capable of delivery high density, high performance, and high reliability.
Various Active/Passive
Components
Capacitors, Resistors
Oscillator/Connector
Bare Chip
Power Transistors
FETs, IGBTs, Diodes
Integrated Circuits
Aluminum Wire
Ultrasonic Bonding
Copper Foil Wiring Pattern
Crossover Line
Adhesive Resin
Anodized Aluminum Layer
Aluminum Substrate
IMST® Substrate
IMST Substrate
Heat Sink
Mounting Board
Shielding Board
Part of Package itself
Anodized Aluminum Layer
Insulated Metal Substrate Technology
IMST enables assembly of discrete passive components (resistors, capacitors); discrete active components (diodes,
transistors); and more complex devices (gate drivers, DSPs, logic) into highly integrated modules.
ON Semiconductor
Page 15
Intelligent Power Modules (IPM) for Inverter Designs
Motor Drive
Current
Sense
•Intelligent power module (IPM) is a 3-phase
inverter with gate drivers, UVLO, thermal and
current sense
• Optimized layout for EMI & thermal performance
•Insulated Metal Substrate Technology (IMST)
•Available with integrated PFC
Gate
Driver
Microcontroller
(Inverter)
or DSP
M
Gate
Driver
Gate
Driver
CONTROL & DRIVE
SIP1 Package
SIP1A Package
DIP4 Package
SPL Interal Board
Power Modules
Device
Page 16
Type
VDS Max
(V)
Iop Peak Current
(A)
Package
STK551U362A-E
Module
1 Shunt resistor
600
10
SIP1A
STK554U362A-E
Module
3 Shunt resistor
600
10
SIP1A
STK554U362C-E
Module
3 Shunt resistor
600
10
SIP1A
STK544UC62K-E
Module
3 Shunt resistor
600
10
SIP1
STK551U392A-E
Module
1 Shunt resistor
600
15
SIP1A
STK554U392A-E
Module
3 Shunt resistor
600
15
SIP1A
STK551U3A2A-E
Module
1 Shunt resistor
600
20
SIP1A
STK5F1U3C2D-E
Module
1 Shunt resistor
600
30
DIP4
STK5F4U3C2D-E
Module
3 Shunt resistor
600
30
DIP4
STK5F1U3E2D-E
Module
1 Shunt resistor
600
50
DIP4
STK5F4U3E2D-E
Module
3 Shunt resistor
600
50
DIP4
Industrial Solutions
Number of
Drivers
VCC Max
(V)
Drive Source/
Sink Typ (mA)
Rise Time
(ns)
Fall Time
(ns)
tp Max
(ns)
Package
NCP5104
Single Input High and Low Side
Power MOSFET Driver
2
20
250 / 500
85
35
170
SOIC-8; PDIP-8
NCP5106
Dual Input High Voltage High and Low
Side MOSFET or IGBT Drivers
2
23
250 / 500
85
35
170
SOIC-8; PDIP-8
NCP5304
Dual Input High Voltage High and Low
Side MOSFET or IGBT Drivers
2
23
250 / 500
85
35
170
SOIC-8; PDIP-8
NCP5111
Single Input Half-Bridge Power
MOSFET or IGBT Driver
2
23
250 / 500
85
35
170
SOIC-8; PDIP-8
NCP5181
Dual Input High Voltage High and
Low-Side MOSFET or IGBT Drivers
2
20
1400 / 2200
20; 40
20; 40
170
SOIC-8; PDIP-8
Device
Description
Vbulk
VCC
Out+
NCP5181
VCC
MC33025
VBOOT
IN_HI DRV_HI
Out−
IN_LO Bridge
GND DRV_LO
NCP5181 Application Diagram
ON Semiconductor
Page 17
CONTROL & DRIVE
Up to 600 V MOSFET/IGBT Gate Drivers
IGBTs for Inverters, UPS, Solar, and Welding
IGBTs
Device
Circuit
With Built-In Diode
Circuit
Without Built-In Diode
Collector
CONTROL & DRIVE
Gate
Collector
Gate
Emitter
Emitter
IGBT Features
•Low saturation voltage using trench
technology
•Low switching loss
•Rugged short circuit withstand capability
•Soft Fast Reverse Recovery Diode
Page 18
NGTB03N60R2DT4G
NGTB05N60R2DT4G
NGTB10N60FG
NGTB30N60L2WG
NGTB35N60FL2
NGTB40N60FL2
NGTB40N60L2
NGTB50N60FL2
NGTB50N60L2
NGTB50N60S1
NGTB75N60FL2
NGTG35N65FL2
NGTB35N65FL2
NGTB40N65FL2
NGTB50N65FL2
NGTB75N65FL2
NGTB15N120FL2
NGTB25N120FL2
NGTB30N120FL2
NGTB30N120L2
NGTB40N120FL2
NGTB50N120FL2
NGTG15N120FL2
NGTG25N120FL2
NGTG40N120FL2
Current
Voltage @ 100°C VCE(sat) Eoff
(V)
(A)
(V)
(mJ)
600
600
600
600
600
600
600
600
600
600
600
650
650
650
650
650
1200
1200
1200
1200
1200
1200
1200
1200
1200
4.5
8
10
30
35
40
40
50
50
50
75
35
35
40
50
75
15
25
30
30
40
50
15
25
40
1.7
1.65
1.5
1.4
1.7
1.7
2
1.8
1.5
1.8
1.7
1.7
1.7
1.7
1.8
1.7
2
2
2
1.7
2
2.2
2
2
2
0.027
0.06
—
0.31
0.28
0.44
0.28
0.46
0.6
0.46
1
0.28
0.28
0.44
0.46
1
0.37
0.6
0.7
1.4
1.1
1.4
0.37
0.6
1.1
Tsc Co-Packaged
(ms)
Diode
—
—
5
5
5
5
5
5
5
5
5
5
5
5
5
5
10
10
10
10
10
10
10
10
10
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Package
DPAK
DPAK
TO-220F-3FS
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
TO-247
Industrial Solutions
Motor Drive Braking
Braking
Circuit
PFC
Inverter
Voltage
(V)
Current @ 100°C
(A)
Package
NGTG20N60L2TF1G
600
20
TO-3PF-3L
NGTG15N60R2FG
600
14
TO-220F-3FS
NGTG12N60TF1G
600
12
TO-3PF-3L
NGTG10N60R2DT4G
600
10
DPAK
Device
CONTROL & DRIVE
Servo
Motor
Motor Drive Power Factor Correction
Trench
IGBTs
Typically 400 to 600 Vdc
Trench IGBTs
Voltage
(V)
Current
(A)
Package
NGTG50N60F
600
50
TO-247
NGTG30N60F
600
30
TO-247
NGTG20N60L2TF1G
600
20
TO-3PF-3L
NGTG12N60TF1G
600
12
TO-3PF-3L
Device
PFC
ON Semiconductor
Power Converter
Page 19
UL943 Compliant GFCI Controllers
Features
•LED and buzzer options for external indicator
•Optimized solenoid deployment
•Synchronized to AC for higher reliability load separation from
the mains
•Highly integrated solution (including self-test) reduces BOM
•Smart power control works with virtually all supply topologies
CONTROL & DRIVE
NEUTRAL
LINE
PHASE
•Detect all required fault types with 1 single current transformer
(v. industry standard 2)
•Proprietary impedance measurement circuitry
•Fault current density weighted response time provides superior
noise immunity
•Best in class power consumption
•Trip indicator/load monitoring
Solenoid
RMain
NC
RMLD
NC
Supply
TVS
SCRdrv
CSup
MLD
NC
CTresGN
NC
NCS37000
CGN
CTstim
NC
IDF
RD
NC
TE
CTresD
RCT
CTbias
PHASE
NEUTRAL
CCT
RGN
NC
CBIAS
CIDF
LOAD
NCS37000 Application Diagram
Device
External
Trip
Differential Grounded- Mechanical Electronic LED Status Differential Circuit
Fault
Neutral Fault Lockout
Lockout Indication Self Test Self Test
NCS37000
3
3
NCS37010
3
3
NCS37012
3
3
Page 20
3
3
3
3
3
3
3
VCC Min VCC Max
(V)
(V)
IT Max
(mA)
VI Typ
(V)
TA Min
(°C)
TA Max
(°C)
Package
6
12
1.5
1.8
-40
125
QFN-16
6
12
2.2
1.8
-40
85
QFN-16, TSSOP-20
6
12
1
12
-40
85
QFN-16, TSSOP-20
Industrial Solutions
Integrated, Reliable Drive Circuits for Motors and Electro-mechanical Relays
Features
Most relays mounted to a PCB
require a relay driver circuit!
•Integrates diodes, resistors and capacitors into one circuit
•Delivers additional current to the relay coil and protects against ESD
•Meets IEC61000-4-4 Electrical Fast Transient (EFT) test standards
Configuration
Circuit Type *
Voltage
(V)
Current
(mA)
Package
MDC3105
Single
Bipolar-Clamp
5
500
SOT-23
MDC3105D
Dual
Bipolar-Clamp
5
500
SC-74
NUD3105
Single
MOSFET
5
500
SOT-23
NUD3105D
Dual
MOSFET
5
500
SC-74
NUD3112
Single
MOSFET
12
500
SOT-23
NUD3112D
Dual
MOSFET
12
500
SC-74
NUD3124
Single
MOSFET
24
150
SOT-23
NUD3124D
Dual
MOSFET
24
150
SC-74
NUD3160
Single
MOSFET
60
150
SOT-23
NUD3160D
Dual
MOSFET
60
150
SC-74
Device
24 V Relay Driver Socket
*Bipolar: the driver circuit consists of a transistor combined with resistors and diodes.
MOSFET: the driver circuit consists of a MOSFET combined with resistors and diodes.
Low Noise Operational Amplifiers
for I/O Buffering and Signal Conditioning
Low Noise Operational Amplifiers
Device
Channels
VS Min
(V)
VS Max
(V)
IQ/Ch
(mA)
GBW
(MHz)
VOS Max
(mV)
VOS Drift
(mV/°C)
IB
(nA)
CMRR
(dB)
MC33171/2/4
LM7301
MC33071/2/4
MC33178/9
NCS2005
LM833
MC33078/9
MC33272/4
MC33077
NCS20074
NCS325
1, 2, 4
1
1, 2, 4
2, 4
1
2
2, 4
2, 4
2
4
1
3
1.8
3
4
1.8
10
5
3
2.5
2.7
1.8
44
32
44
36
32
36
18
36
18
36
5.5
180
0.6
1.6
0.4
1.4
2
2.1
2.2
1.75
0.41
0.02
1.8
4
4.5
5
8
15
16
24
37
3
0.35
4.5
6
3
3
5
5
2
1
1
3
0.05
10
2
10
2
2
2
2
2
2
2
0.02
20
65
100
100
50
300
300
300
280
0.005
0.05
90
88
97
110
120
100
100
100
107
111
110
ON Semiconductor
eN
(nV/√Hz) Rail-to-Rail
32
30
32
7.5
53
4.5
4.5
18
4.4
20
100
I/O
I/O
Output
I/O
Package
PDIP-8, SO-8, PDIP-14, SOIC-14, TSSOP-14
SOT-23-5
PDIP-8, SOIC-8, WQFN-10, PDIP-14, SOIC-14, TSSOP-14
PDIP-8, SOIC-8, Micro8, PDIP-14, SOIC-14, TSSOP-14
SOT-23-5
PDIP-8, SOIC-8
PDIP-8, SOIC-8, PDIP-14, SOIC-14
PDIP-8, SOIC-8, PDIP-14, SOIC-14, TSSOP-14
PDIP-8, SOIC-8
SOIC-14, TSSOP14
SOT-23-5
Page 21
CONTROL & DRIVE
Relay Drivers
High Value CMOS Image Sensors
ON Semiconductor image sensor, co-processor, and SoC products empower security, machine vision, and other industrial applications
with outstanding low-light performance and high dynamic range. From VGA, 720p, and 1080p to high resolutions of 5 MP and above,
these products combine industry-leading high dynamic range and excellent near-IR performance for the highest quality video.
Frame Rate
Pixel
Size
(mm)
Shutter
Type1
CFA
Operating
Temp
(°C)
60 fps
5.6
ERS
Color
-30 to +70
1/3”
60 fps
6.0
GS
Color, Mono
-30 to +70
1/4”
1.2 45 fps, 720p60
3.0
ERS
Color
-30 to +85
1.2
1/4”
1.2 45 fps, 720p60
3.0
ERS
Color, Mono
-30 to +85
1.2
1/3”
1.2 45 fps, 720p60
3.8
ERS
Color, Mono
-30 to +70
Sensor
1.2
1/3”
1.2 54 fps, 720p60
3.8
GS
Color, Mono
-30 to +70
Sensor
1.2
1/3”
1.2 45 fps, 720p60
3.8
GS
Mono
-30 to +70
Sensor/
SOC
Resolution
(MP)
Optical
Format
ASX340CS
SOC
VGA
1/4”
MT9V034
Sensor
WVGA
AR0140CS
Sensor
1.2
AR0141
Sensor
AR0130
Sensor
AR0134
MT9M021/31
MT9M024/34
Device
IMAGE SENSORS
Sensor
1.2
1/3”
1.2 45 fps, 720p60
3.8
ERS
Color, Mono
-30 to +70
MT9M114
SOC
1.3
1/6”
1.3 30 fps, VGA 75 fps
1.9
ERS
Color
-30 to +70
MT9M001
Sensor
1.3
1/2”
30 fps
5.2
ERS
Mono
0 to +70
MT9D131
SOC
1.9
1/3.2”
1.9 15 fps, SVGA 30 fps
2.8
ERS
Color
-30 to +70
AR0230
Sensor
2.1
1/3.2”
1080p60
3.0
ERS
Color
-30 to +70
AR0261
Sensor
2.1
1/6”
1080p60
1.4
ERS
Color
-30 to +70
AR0331
Sensor
3.1
1/3”
1080p60
2.2
ERS, GRR
Color
-30 to +85
AR0333
Sensor
3.1
1/3”
1080p30
2.2
ERS
Color
-30 to +85
AR0330
Sensor
3.5
1/3”
1080p60
2.2
ERS, GRR
Color
-30 to +70
MT9P004
Sensor
5.0
1/3.2”
5 15 fps, 1080p30
1.8
ERS, GRR
Color
-30 to +70
MT9P006
Sensor
5.0
1/2.5”
5 15 fps, 720p60
2.2
ERS, GRR
Color
-30 to +70
MT9P031
Sensor
5.0
1/2.5”
5 15 fps, 720p60
2.2
ERS, GRR
Color, Mono
-30 to +70
MT9J003
Sensor
10
1/2.3”
10 15 fps, 1080p60
1.7
ERS, GRR
Color, Mono
-30 to +70
AR1011HS
Sensor
10
1”
60 fps
3.4
ERS
Color
-30 to +70
AR1335
Sensor
13
1/3.2”
13 30 FPS, 1080p 60 fps
1.1
ERS
Color
-30 to +70
MT9F002
Sensor
14
1/2.3”
14 13 fps
1.4
ERS, GRR
Color
-30 to +70
AR1820HS
Sensor
18
1/2.3”
18 24 fps, 1080p 120 fps
1.3
ERS, GRR
Color
-30 to +70
1. ERS = Electronic Rolling Shutter, GRR = Global Reset Release, GS = Global Shutter
Page 22
Industrial Solutions
Co-Processors for High Value CMOS Image Sensors
AP0100
AP0101
Home Security,
Surveillance, Automotive
Home Security,
Surveillance, Automotive
MT9M024/34, AR0130, AR0140CS,
AR0132AT, AR0140AT, ARX550AT
MT9M024/34, AR0140CS, AR0132AT,
AR0140AT, ARX550AT
Maximum
Resolution
1.2 MP
1.2 MP
Frame Rate
1.2 MP 45 fps 720p60
1.2 MP 45 fps
Demosaic
Demosaic
Gamma correction
Gamma correction
Auto white balance
Auto white balance
Defect correction
Defect correction
Noise reduction
Noise reduction
Auto exposure
Auto exposure
Flicker detection
Flicker detection
YES
YES
YES
Up to 165 degrees
NO
YES,
Multiple viewing options,
PTZ
NO
YES
NO
Up to 5
Up to 5
Sensor Interfaces
2-lane HiSPi,
12-bit parallel
12-bit parallel
Output Interfaces
NTSC/PAL,
16-bit parallel
16-bit parallel
6-30 MHz
6-30 MHz
27 MHz (NTSC/PAL)
84 MHz parallel
84 MHz parallel
–30 to +70°C (CS Version)
–40 to +105°C (AT Version)
–30 to +70°C (CS Version)
–40 to +105°C (AT Version)
VFBGA-100
VFBGA-81
Applications
Sensors Supported
Color Pipe Features
HDR with ALTM
Dewarp
(Yes or No)
Spatial Transform
Engine Software
Add-on
Overlays
GPIOs
Input Clock
Output Clock
Operating Temp
Package
ON Semiconductor
IMAGE SENSORS
Automotive/Industrial Co-Processors
Page 23
PYTHON CMOS Image Sensors
With resolutions from VGA to 25 megapixels, the PYTHON family of image sensors addresses the needs of general purpose industrial
imaging applications such as machine vision inspection and motion monitoring, security, surveillance, and intelligent transportation
systems (ITS). Combining flexibility in configuration and resolution with high speed and high sensitivity, these devices capture fast
moving scenes without distortion by combining low read noise and high sensitivity with frame rates up to 850 fps.
Features
•CDS global shutter technology with low noise performance
•True HW scalable family concept
•High configurability and fast adaptability
•High frame rates
•Multiple regions of interest
•High dynamic range
•Color, Monochrome, and Enhanced NIR configurations
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(mm)
Diagonal
(mm)
PYTHON 300
0.3
640 x 480
4.8
PYTHON 500
0.5
800 x 600
4.8
Device
FPS Max
Evaluation
Kit
C/M/NIR
820
3
C/M/NIR
580
3
Lens
CFA1
3.8
1/4”
4.8
1/3.6”
IMAGE SENSORS
PYTHON 1300
1.3
1280 x 1024
4.8
7.9
1/2”
C/M/NIR
210
3
PYTHON 2000
2.3
1920 x 1200
4.8
10.9
2/3”
C/M/NIR
215
3
PYTHON 5000
5.3
2592 x 2048
4.8
15.9
1”
C/M/NIR
100
3
PYTHON 10K
11.1
3840 x 2896
4.5
21.6
4/3
C/M/NIR
175
3
PYTHON 12K
12.5
4096 x 3072
4.5
23.0
4/3
C/M/NIR
160
3
PYTHON 16K
16.8
4096 x 4096
4.5
26.1
APS-H
C/M/NIR
120
3
PYTHON 25K
26.2
5120 x 5120
4.5
32.6
APS-H
C/M/NIR
80
3
1. CFA Options – Bayer Color (C), Monochrome (M), Enhanced NIR (NIR).
Page 24
Industrial Solutions
High Performance CMOS Image Sensors
VITA image sensors combine flexibility in configuration and resolution with high speed and high sensitivity, addressing a wide range of
customer requirements. A flexible read-out architecture makes them well suited for machine vision, intelligent transportation systems
and surveillance, and other applications that demand high functionality, while delivering excellent image quality.
Features
•1.3 to 25 Megapixels
•Pipelined and triggered global
shutter with dual readout
•Rolling shutter with CDS
•High frame rates
•Multiple regions of interest
VITA 5000
Device
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
VITA 1300
1.3
1280 x 1024
4.8
7.9
1/2”
C/M
150
3
VITA 2000
2.3
1920 x 1200
4.8
10.9
2/3”
C/M
90
3
VITA 5000
5.3
2592 x 2048
4.8
15.9
1”
C/M
75
3
VITA 12K
12.6
4096 x 3072
4.5
23.0
4/3”
C/M
160
3
VITA 16K
16.8
4096 x 4096
4.5
26.1
APS-H
C/M
125
3
VITA 25K
26.2
5120 x 5120
4.5
32.6
APS-H
C/M
80
3
1. CFA Options – Bayer Color (C), Monochrome (M).
KAC image sensors provide both global shutter and low noise rolling shutter modes, combined with programmable bit depth (8 to 14
bit) with a flexible readout architecture that supports interspersed video streams. These features enable the use of multiple regions of
interest that can simultaneously monitor both wide areas and local regions, making these devices ideal for machine vision, surveillance,
ITS, and analytical microscopy.
Features
•Global shutter, low noise rolling shutter
•Programmable bit depth
•Interspersed video streams
•Multiple regions of interest
•High frame rates
•High NIR sensitivity
KAC-12040
KAC-06040
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
KAC-06040
6
2832 x 2128
4.7
16.7
1”
C/M
160
3
KAC-12040
12
4000 x 3000
4.7
23.5
4/3”
C/M
70
3
Device
1. CFA Options – Bayer Color (C), Monochrome (M).
ON Semiconductor
Page 25
IMAGE SENSORS
VITA 25K
High Speed CMOS Image Sensors
LUPA devices offer resolution as high as 2048 x 2048 and frame rates up to 500 fps. These features, combined with a power consumption
as low as 150 mW with absolutely no blooming or lag, create a perfect foundation for highly reliable, high sensitivity image sensors.
Features
•Frame rates up to 500 fps at
several megapixel resolutions
•Unprecedented sensitivity
•Pipelined global shutter
•Low power dissipation
•High resolution
•No blooming or image lag
•Mono and color variants
LUPA 4000
LUPA 3000
IMAGE SENSORS
Resolution
(MPix)
Pixel Count
(H x V)
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
LUPA 300
0.3
640 x 480
9.9
7.9
1/2”
C/M
250
3
LUPA 1300-2
Device
1.3
1280 x 1024
14
22.9
1”
C/M
500
3
LUPA 3000
3
1696 x 1710
8
19.3
1”
C/M
485
3
LUPA 4000
4
2048 x 2048
12
34.8
35 mm
C/M
15
3
1. CFA Options – Bayer Color (C), Monochrome (M).
Page 26
Industrial Solutions
Interline Transfer CCD Image Sensors
With an integrated electronic shutter, Interline Transfer CCD image sensors provide real time imaging in applications where a mechanical
shutter or strobe illumination is either not required or desired. With progressive scan readouts, they are particularly well suited for
machine vision, microscopy, fluoroscopy, and other applications that demand the highest imaging performance. Most 5.5 mm and
7.4 mm devices share common pin-out and electrical connections, allowing a single camera design to support a full family of products.
Features
•Progressive scan with electronic
shutter and anti-blooming support
•High resolution
•High sensitivity
•Low image lag and smear
5.5 mm Interline Transfer CCD Image Sensors
Pixel Count
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
VGA
648 x 484
9
7.3
1/2”
C/M
120
3
KAI-0340
VGA
640 x 480
7.4
5.9
1/3”
C/M
210
3
KAI-0373
WVGA
768 x 484
11.6 x 13.6
11.1
2/3”
M
30
KAI-0330
KAI-011502
0.9
1280 x 720
5.5
8.1
1/2”
C/M/S
138
3
KAI-1003
1
1024 x 1024
12.8
18.5
4/3”
M
30
3
KAI-1010
1
1008 x 1018
9
12.9
1”
M
30
KAI-1020
1
1000 x 1000
7.4
10.5
2/3”
C/M
50
3
KAI-010502
1
1024 x 1024
5.5
8
1/2”
C/M
120
3
KAI-2001
1.9
1600 x 1200
7.4
14.8
1”
C/M
30
3
KAI-2020
1.9
1600 x 1200
7.4
14.8
1”
C/M
30
3
2
1.9
1600 x 1200
5.5
11.1
2/3”
C/M
68
3
KAI-021702
2.1
1920 x 1080
7.4
16.3
1”
C/M/S
60
3
KAI-02050
2
KAI-02150
2.1
1920 x 1080
5.5
12.1
2/3”
C/M/S
64
3
KAI-040702
4.2
2048 x 2048
7.4
21.4
4/3”
C/M/S
28
3
2
4.1
2336 x 1752
5.5
16.1
1”
C/M/S
32
3
KAI-080512
8.1
3296 x 2472
5.5
22.7
4/3”
C/M/S
16
3
KAI-08670
8.6
3600 x 2400
7.4
32.0
APS-H
C/M/S
12
3
KAI-11002
10.7
4008 x 2672
9
43.4
35 mm
C/M
5
3
KAI-16000
15.8
4872 x 3248
7.4
43.3
35 mm
C/M
3
KAI-04050
KAI-160502
16
4896 x 3264
5.5
32.4
APS-H
C/M/S
8
3
KAI-160702
15.7
4864 x 3232
7.4
43.2
35 mm
C/M/S
8
3
2
KAI-29050
28.8
6576 x 4384
5.5
43.5
35 mm
C/M/S
4
3
KAI-47051*
46.8
8856 x 5280
5.5
56.7
645 1.1x
C/M/S
7
3
IMAGE SENSORS
Resolution
(MPix)
Device
1. CFA Options – Bayer Color (C), Monochrome (M), and Sparse CFA (S). 2. Pin and Electrically Compatible. * Pending 1Q16.
ON Semiconductor
Page 27
Full Frame CCD Image Sensors
From the intricacies of microscopy to the far reaches of astrophotography, Full Frame CCD image sensors deliver high performance
results. With high quantum efficiency across the entire visible spectrum, these sensors are ideal for demanding imaging applications
that can accommodate a mechanical shutter or strobe illumination, such as electronic still photography, medical X-ray, and inspection.
Features
•High resolution
•Support for large sensor formats
•Simple, two-phase clocking
•Very low dark current for long exposures
•Vertical and horizontal binning
Full Frame CCD Image Sensors
Resolution
(MPix)
Pixel Count
Pixel
(mm)
Diagonal
(mm)
Lens
CFA1
FPS Max
Evaluation
Kit
KAF-0261
VGA
512 x 512
20
14.5
1”
M
15
3
KAF-0402
WVGA
768 x 512
9
8.3
1/2"
M
20
3
KAF-1001
1
1024 x 1024
24
34.8
APS-H
M
3
3
KAF-1603
1.6
1536 x 1024
9
16.6
1”
M
2.2
3
KAF-3200
3.3
2184 x 1510
6.8
18
4/3”
M
2.5
3
KAF-4320
4.3
2084 x 2084
24
70.7
645
M
2
3
KAF-6303
6.3
3088 x 2056
9
33.4
APS-H
M
0.6
3
KAF-8300
8.3
3326 x 2504
5.4
22.5
4/3”
C/M
2.9
3
Device
IMAGE SENSORS
KAF-09000
9.3
3056 x 3056
12
51.9
645 1.3x
M
0.4
KAF-16801
16.8
4096 x 4096
9
52.1
645 1.3x
M
0.4
KAF-16803
16.8
4096 x 4096
9
52.1
645 1.3x
M
0.2
KAF-40000
40
7304 x 5478
6
54.8
645 1.3x
C
1.3
KAF-50100
50.1
8176 x 6132
6
61.3
645 1.1x
C/M
1
3
1. CFA Options – Bayer Color (C), Monochrome (M).
Page 28
Industrial Solutions
Interline Transfer EMCCD Image Sensors
Combining the high sensitivity of an electron-multiplied output register with the pixel uniformity and resolution scalability available from
Interline Transfer CCDs, KAE devices enable the capture of scenes with widely varying lighting conditions – from sunlight to starlight – in
a single image and from a single camera. This flexibility makes them ideal for light starved applications such as surveillance, scientific
imaging, medical imaging, and intelligent transportation systems.
US export controls currently apply to all shipments of KAE devices designated for
destinations outside of the US and Canada, requiring ON Semiconductor to obtain
an export license from the US Department of Commerce before image sensors or
evaluation kits can be exported.
Features
•86 dB dynamic range with 1 electron read noise
•Progressive scan readout
•High sensitivity, low noise architecture
•Excellent smear performance
KAE-02150
Resolution
(MPix)
Pixel Count
Pixel
(mm)
Diagonal
(mm)
Lens
CFA
FPS Max
Evaluation
Kit
2.1
1920 x 1080
5.5
12.1
2/3”
C/M
30
3
Linear CCD Image Sensors
Linear CCD image sensors combine high resolution with high dynamic range, making them ideal for use in applications such as flatbed
scanners, high-speed document scanners and copiers, machine vision cameras, and satellite imaging.
Features
•High dynamic range
•Pinned photodiodes for low lag and low dark current
•Channel independent electronic exposure control
•Single output per color, including multi-readout register
architectures
•High data rates
Device
KLI-2104
Linear CCD Image Sensors
Pixel Count
Pixel
(mm)
Diagonal
(mm)
CFA1
4196 x 1, 2098 x 3
7.0, 14.0
29.4
Luma+C
Evaluation Kit
KLI-2113
2098 x 3
14
29.4
C/M
3
KLI-4104
8160 x 1, 4080 x 3
5.0, 10.0
40.8
Luma+C/M
3
KLI-8023
8002 x 3
9
72
C/M
3
1. CFA Options – Bayer Color (C), Monochrome (M).
ON Semiconductor
Page 29
IMAGE SENSORS
Device
KAE-02150 Image Sensor
Radiation Tolerant Image Sensors
Radiation hardened CMOS images play an important role in high-radiation environments where normal
CMOS or CCD imagers cannot survive, and where CRT image tubes are too expensive, too heavy or too
large. STAR and HAS image sensors are designed using radiation-tolerant design techniques to allow high
tolerance against total dose effects. All devices feature qualified radiation tolerance up to 300 krad, and
include on-chip Fixed Pattern Noise (FPN) correction and a programmable gain amplifier.
Applications
•GNC guidance, navigation, and control applications
•AOCS attitude and orbit control systems
•Nuclear inspection
Device
Resolution
(Mpix)
Pixel Count
Pixel
(mm)
Diagonal
(mm)
ADC
CFA
FPS Max
STAR250
0.3
512 x 512
25
18.1
10-bit
M
30
STAR1000
1.0
1024 x 1024
15
21.7
10-bit
M
11
HAS2
1.0
1024 x 1024
18
26.1
12-bit
M
10
IMAGE SENSORS
Evaluation Support
ON Semiconductor provides supporting hardware and software to qualified engineering teams to accelerate product development.
These kits contain everything necessary to build a working prototype with test functionality.
Page 30
Industrial Solutions
VR12.5/6 Multiphase Controllers for Embedded Applications
VCC
PVCC
VRPM
SDIO
Alert
SCLK
BST
HG
SW
VRHOT
TTSENSE
VCORE
LG
Features
BST
•Dual-edge pulse width modulation
•Fastest initial response to dynamic load
events
•True differential voltage sensing
•Differential inductor DCR current sensing
•Input voltage feed forward
•Adaptive voltage positioning
•Pin-programmable controller configuration
•Integrated OVP, UVP, OCP
•Operating temperature range:
-40°C to +125°C
NCP81143
3PH
HG
VCORE
SW
SCLK
SDA
Alert
LG
NCP81145
BST
PWM2
HG
VCORE
SW
LG
VR_RDY
DIFFOUT
FB
COMP
INTSEL
ILIM
ROSC
IMAX
CSCOMP
CSSUM
IOUT
CSREF
Device
ON Semiconductor
GND
Description
Driver / MOSFETs
Package
NCP81140
4-Phase Controller
—
QFN-32
NCP81141
1-Phase VR12.6 Controller
Integrated 5 V Driver
QFN-28
NCP81142
4-Phase VR12.5 Controller
—
QFN-32
NCP81143
3-Phase VR12.5 Controller
2x Integrated 5 V Drivers
QFN-36
NCP81145
5 V Driver
—
DFN-8
NCP81146
12 V Driver
—
DFN-8
NCP81147
1-Phase Buck 0.8 V / 3.3 V
—
QFN-16
NCP81148
Dual Buck with LDOs
—
QFN-28
NCP81149
1-Phase VR12.6 Controller
Integrated MOSFETs
—
POWER
PGND
CSP1
CSP2
CSP3
Page 31
Compact Power Delivery with Switching Regulators
Features
•Skip-cycle operation
n No acoustic noise
•Low power consumption and frequency foldback
n Allows energy ECO regulations compliance
•Output overload and open loop protection
n Protects your application
•Over-power and brown-out protection
•Ramp Compensation
•Highly integrated solution
n Reduces system size and cost
•Thermistor input can be configured as
n Second remote diode temp; two analog inputs
•Dynamic Self Supply (DSS) capability
n No need for an auxiliary transformer winding
•On-chip 700 V power switch circuit
n Compact and easy system design
•Frequency jittering
n Reduces EMI signature
F1
1.5 A
T1
L1A
1 mH
J1
C1
AC 0.1 μF
Input
“X”
R1
4.7 Ω
3W
D6 MMSD4148A
BAT54
D8
C2
0.1 μF
“X”
L1B
D1-D4
MRA4007
x4
R2A
3.3 M
R2B
3.3 M
C3
22 μF
400 V
R3
68 K
1/2 W
MBRS240
C4
1 nF
1 kV
1N4937
D9
C10
1000 μF
16 V
C9A
C11
0.1 μF
50 V
C9B
D7
D5
C8
0.1 μF
50 V
1500 μF, 6.3 V
MBRS240
VS2
+8.5 V
VS1
+5 V
Com
1 mH
Primary
Ground
Plane
NCP1075
(100 kHz)
R4
C5
22 μF
25 V
NOTES:
1. Crossed schematic lines are not connected.
2. R4 value dependent on VS2 nominal output voltage.
2K
C6
10 nF
Z1
C7
0.1 μF
R6
100
Vtrim
MMSZ5229B
(4.3 V)
Q1
NST45011
R9
10 K
Non-Isolated, 8 W Dual Output Offline Power Supply
R10
10 K
4
4
4
4
5
11
11
11
11
15
15
20
20
20
700
700
700
700
700
700
700
700
700
700
700
700
700
700
100
250
Adj
250
350
Adj
350
250
350
450
450
800
650
800
22
22
34
22
22
11
11
11
11
11
11
5.6
4.7
4.7
30
30
21
30
30
21
30
30
30
30
30
30
30
30
65, 100, 130
65, 100, 130
60, 100
65, 100, 130
65, 100, 130
60, 100
65, 100
65, 100, 130
65, 100, 130
65, 100, 130
65, 100, 130
65, 100
65, 100, 130
65, 100, 130
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Over Power
Compensation
Frequency
Options
(kHz)
Enable
Min
HV
Startup
Brown-in/-out
Typ2
RDS(on)
(Ω)
Freq Foldback
Peak
Current
Limit
(mA)
Soft-Start
POWER
Power
Switch
Voltage
(V)
Freq Jittering
Device
NCP1010
NCP1011
NCP1060
NCP1070
NCP1071
NCP1063
NCP1072
NCP1012
NCP1013
NCP1075
NCP1014/15
NCP1027/28
NCP1076
NCP1077
Max
Output
Power1
(W)
Dynamic Self
Supply
Current Mode Switching Regulators
3
3
3
Package(s)
PDIP-7, SOT-223
PDIP-7, SOT-223
PDIP-7, SOIC-10
PDIP-7, SOT-223
PDIP-7, SOT-223
PDIP-7, SOIC-16
PDIP-7, SOT-223
PDIP-7, SOT-223
PDIP-7, SOT-223
PDIP-7, SOT-223
PDIP-7, SOT-223
PDIP-7
PDIP-7, SOT-223
PDIP-7, SOT-223
1. Maximum Power Output with DSS 2. Typical at 25°C 3. NCP1015 & NCP1028 have no OVP on VCC
Page 32
Industrial Solutions
Rugged Linear Voltage Regulators
Linear Voltage Regulators
IO Typ
Dropout Typ
(V)
Vin Max
(V)
Vout
(V)
Package
LM317M
500 mA
2.2
40
Adj.
TO-220, DPAK, SOT-223
MC78Mxx/A
500 mA
2.0
40
5, 6, 8, 9, 12, 15, 18, 20, 24
TO-220, DPAK
MC79Mxx/A
Device
500 mA
1.1
-35
-5, -8, -12, -15
TO-220, DPAK
NCP78xx
1.0 A
2.0
35
5, 12, 15
TO-220
MC78xx/A/AE
1.0 A
2.0
40
5, 6, 8, 9, 12, 15, 18, 24
TO-220, DPAK, D2PAK
MC79xx/A
1.0 A
1.3
-40
-5, -5.2, -6, -8, -12, -15, -18, -24
TO-220, D2PAK
LM317
1.5 A
2.25
40
Adj.
TO-220, D2PAK
LM337
1.5 A
2.4
-40
Adj.
TO-220, D2PAK
* Visit www.onsemi.com for additional linear voltage regulators at lower output currents and voltages.
Low Dropout Regulators
IO Typ
Dropout
(mV)
Vin Max
(V)
Vout
(V)
Package
NCP4641
150 mA
700 (typ)
50
2.0 - 12.0
SOT-89-5
NCP705
500 mA
250 (typ)
6
0.8, 1.8, 2.8, 3.0, 3.3
SOT-223-6, WDFN-6
NCP3335A
500 mA
340 (max)
16
Adj, 1.5, 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 5.0
Micro8, DFN-10
NCP3337
500 mA
340 (max)
16
Adj, 1.8, 2.5, 3.3, 5.0
DFN-10
NCP59748
1.5 A
165 (max)
6
Adj
QFN-20, DFN-10
NCP59150/1/2
1.5 A
175 (typ)
18
1.8, 2.5, 2.8, 3.0, 3.3, 5.0
D2PAK-5, DFN-8
NCP59744
3.0 A
195 (max)
5.5
Adj
QFN-20
NCP59749
3.0 A
280 (max)
6
Adj
QFN-20
NCP59300/1/2
3.0 A
300 (typ)
18
1.8, 2.5, 2.8, 3.0, 3.3, 5.0
D2PAK-5
NCP4632
3.0 A
510 (typ)
6
0.8, 1.5, 2.8, 3.3
DPAK-5
POWER
Device
ON Semiconductor
Page 33
Energy Efficient TRIACs for High & Low Power Switching & AC Control
TRIACs – High Current
IT(rms)
(A)
Vdrm
(V)
Igt
(mA)
dv/dt
(V/ms)
Package
8 - 16
600 - 800
25 - 50
25 - 400
TO-220 AB
BTB Series, Logic Level
8 - 16
600 - 800
5 - 10
15 - 50
TO-220 AB
BTB Series, Snubberless
8 - 30
600 - 800
35 - 50
500 - 2000
TO-220 AB
BTB Series, High Tj
8 - 16
600
35 - 50
1000
TO-220 AB
BTA Series, Standard
8 - 16
600 - 800
25 - 50
25 - 400
TO-220 II1
BTA Series, Logic Level
8 - 16
600 - 800
5 - 10
15 - 50
TO-220 II1
BTA Series, Snubberless
8 - 30
600 - 800
35 - 50
500 - 2000
TO-220 II1
BTA Series, High Tj
8 - 16
600
35 - 50
1000
TO-220 II1
MAC Series
8 - 16
200 - 800
5 - 50
25 - 750
TO-220 AB
Device
BTB Series, Standard
MAC15 Series
15
400 - 800
50
5 - 250
TO-220 AB
2N63 Series
8 - 12
600 - 800
50
5 - 250
TO-220 AB
BTA/BTB Series Key Features
•Blocking voltage to 800 V
•On-state current ratings to 30 A RMS @ 25°C
•Greater noise immunity achieved with higher
dv/dt up to 2,000 V/ms minimum @ 125°C
•Standard and snubberless
•Logic level
•Uniform gate trigger current in 3 & 4 quadrants
•Highest industry standard isolation voltage of
2,500 Vrms
•Internal ceramic pad provides voltage insulated tab
1. Internally Isolated TO-220
Linear Voltage
General Purpose
Regulation
Rectification Diodes
BTA Series
TRIACs
Voltage
Supervisory
Z01 Series
TRIACs
Vdd
AC Main
Vss
MCU
Zero Voltage
Detect
Cover Switch
Signal Conditioning
Operational Amplifiers
Display
Operating Panel (Key Inputs)
Washing
Motor
Drain Water Softener Heater
Magnet Supply Supply
Valve
Valve
Typical Application Using High and Low Current TRIACs
TRIACs – Low Current
Device
POWER
Current during compressor startup (<200 ms)
is too high; >200 ms, current drops to nominal
value. Thyristor must be selected to sustain startup
current without overheating. See AND8007/D for
details.
Page 34
Z01 Series
MAC08 Series
MAC4D Series
IT(rms)
(A)
Vdrm
(V)
Igt
(mA)
dv/dt
(V/μs)
Package
0.8 - 1
0.8
4
600 - 800
600 - 800
600 - 800
3 - 10
10
3 - 35
25 - 400
10
10
SOT-223
SOT-223
DPAK
Industrial Solutions
High & Low Current SCRs for Half-Wave AC
Z01 & NYC Series Key Features
SCRs – Low Current
•IT(rms) = 1.5 A, 1.0 A and 0.25 A
•Igt = 200 μA to 10 mA
•Off-state voltage of 600 V
•dv/dt up to 200 V/μs minimum, depending on Igt level
•Sensitive gate triggering in four trigger modes; low Igt
levels in quadrants 1, 2 & 3 for good interface with
MPU
•Improved noise immunity
•Peak non-repetitive surge current up to 15 A
Device
IT(rms)
(A)
Vdrm
(V)
Igt
(mA)
dv/dt
(V/μs)
Package
NYC0102
0.25
200
0.2
200
SOT-23
MCR08
0.8
200 - 600
0.2
10
SOT-223
NYC222
1
50 - 600
0.2
25
SOT-223
MCR703
4
100 - 600
0.1
10
DPAK
MCR718
4
400 - 600
0.1
10
DPAK
SCRs – High Current
IT(rms)
(A)
Vdrm
(V)
Igt
(mA)
dv/dt
(V/μs)
MCR8D Series
8
600 - 800
0.2 - 15
10 - 200
DPAK
MCR8 Series
8
400 - 800
0.2 - 15
15 - 250
TO-220 AB
MCR72 Series
8
100 - 600
0.2
10
TO-220 AB
Device
Package
8
50 - 400
25
100
TO-220 AB
MCR12D Series
12
600 - 800
0.2 - 20
10 - 50
DPAK
MCR12 Series
12
400 - 800
8 - 20
100 - 250
TO-220 AB
2N6394 Series
12
50 - 800
30
50
TO-220 AB
MCR16 Series
16
800
20
300
TO-220 AB
16
50 - 800
30
50
TO-220 AB
MCR25 Series
25
400 - 800
30
250
TO-220 AB
2N6504 Series
25
50 - 800
30
50
TO-220 AB
MCR69 Series
25
50 - 100
30
10
TO-220 AB
High
Coil
Sense
Coil
Line
Circuit
Breaker
SCR
NYC22x,
NYC0102
GFCI - Ground Fault Circuit Interrupter
POWER
2N6400 Series
MOV
Controller
MCR218 Series
Gnd/
Neutral
Coil
ON Semiconductor
Page 35
Power MOSFETs for AC Drive
Flyback Power Supply
Vin
Vin
Vout
Vout
•High reliability
•Low power dissipation
•High avalanche resistance
•High-speed switching
~240 Vac
Controller
Controller
Features
Source
Voltage
Half Bridge Power Supply
Controller
Application Diagram
RDS(on) @ 10 V
VDSS
(V)
ID
(A)
Typ (W)
BFL4004
800
6.5
1.9
BFL4026
900
5
BFL4001
900
2SK4177
1500
2SK3748
1500
Device
G-S Protect
Diode
Max (W)
Ciss
(pF)
Qg
(nC)
2.5
710
36
—
TO-220F
2.8
3.6
650
33
—
TO-220F
6.5
2.1
2.7
850
44
—
TO-220F
2
10
13
380
37.5
Built in
TO-263(D2PAK)
4
5
7
790
80
Built in
TO-3PF
Package
NDFPD1N150C
1500
0.1
100
150
80
4.2
—
TO-220F
380 to 480 Vac NDFP03N150C
1500
2.5
8
10.5
650
34
—
TO-220F
NDTL03N150C
1500
2.5
8
10.5
650
34
—
TO-3P
NDUL03N150C
1500
2.5
8
10.5
650
34
—
TO-3PF
NDUL09N150C
1500
9
2.2
3.0
2025
114
—
TO-3PF
1700
3
8.2
10.5
850
48
—
TO-3PF
590 to 690 Vac WPH4003
MOSFETs for Energy Storage Systems
POWER
Device
BMS3004
Page 36
Channel
VDSS
(V)
ID
(A)
RDS(ON)
(mΩ)
QG(TOT)
(nC)
Package
P
-75
-68
8.5
300
TO-220F-3SG (SC-67)
SMP3003
P
-75
-100
8
280
TO-263
NDBA100N10B
N
100
100
6.9
35
TO-263
NDBA180N10B
N
100
180
2.8
95
TO-263
NDPL100N10B
N
100
100
7.2
35
TO-220-3L
NDPL180N10B
N
100
180
3
95
TO-220-3L
Industrial Solutions
Power MOSFETs for Motor Control
Features
•Low RDS(on) to minimize conduction losses
•Low capacitance to minimize driver losses
•Low gate charge to minimize switching losses
•High avalanche resistance
•High current capability
SO-8 Flat Lead Package
ATPAK
Device
BMS3004
BMS3003
NTTFS5116PL
BXL4004
NTD5802N
NTD5805N
NTP5404N
NTMFS5C404NLT
NTMFS5C410NLT
NTMFS5C430NL*
NTMFS5C423NL
NTMFS5C442NLT
NTMFS5C450NL*
NTMFS5C456NL*
NTMFS5C460NL*
NTMFS5C468NL*
NTMFS5830NL
NTMFS5832NL
NTMFS5834NL
NTTFS5811NL
2SK3703
2SK3816
2SK4066
2SK4094
ATP401
ATP404
BBL4001
NTMFS5C604NL
NTMFS5C612NL
NTMFS5C628NL*
NTMFS5C646NL
NTMFS5C670NL
NTMFS5C673NL*
NTMFS5844NL
NTP5864N
NTTFS5820NL
NTTFS5826NL
BMS4007
ATP405
NTD6416ANL
Channel
VDSS
(V)
ID
(A)
RDS(ON)
(mW)
QG(TOT)
(nC)
Package
P
P
P
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
-75
-60
-60
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
75
100
100
-68
-78
-20
100
101
51
167
352
315
200
150
126
110
78
70
50
172
111
74
53
30
40
100
100
100
95
74
287
235
140
93
71
49
60
63
37
20
60
40
19
8.5
6.5
52
3.9
4.4
9.5
4.5
0.75
0.9
1.5
2
2.8
3
4.4
5
11
2.3
4.2
9.3
6.7
26
26
4.7
5
3.7
7.2
6.1
1.2
1.5
2.9
4.7
6.1
10
12
12.4
11.5
24
7.8
33
80
300
285
25
140
75
33
125
81
66
30
23
22
16
12
10
4.4
113
51
24
31
40
40
220
220
300
120
135
52
41
22
15.7
9
6
30
31
28
8.4
160
68
25
TO-220F-3SG (SC-67)
TO-220F-3SG (SC-67)
u8FL
TO-220-3L (SC-46)
DPAK, IPAK
DPAK, IPAK
D2PAK, TO-220
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
u8FL
TO-220F-3SG (SC-67)
TO-262-3L (I2PAK)
TO-262-3L (I2PAK)
TO-220-3L (SC-46)
ATPAK
ATPAK
TO-220F-3SG (SC-67)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
SO-8FL (DFN-5)
TO-220
u8FL
u8FL
TO-220F-3SG (SC-67)
ATPAK
DPAK, IPAK
POWER
Power MOSFETs
* Pending 2H15
ON Semiconductor
Page 37
Timing and Data Distribution Subsystem
CLOCK DISTRIBUTION
Clock Solutions
Data Management
Skew Delay
Receivers
Translator
Crystal
PLL Clock
Generator
PLL Clock
Module
Reference
Clock
PLL Clock
Synthesizer
MUX
Fanout
Crosspoint
Translator
Drivers
Skew Delay
Flip-Flop
Divider/
Counter
Latches
Processor
ASIC
Equalization
Fanout
CMOS/TTL
HCSL
LVDS
PECL/CML
PE/EQ
Pre-Emphasis
ZDB
Processor
Crosspoint
MUX
ASIC
Pre-Emphasis
PLL Clock
Generator
Gates
Translator
Gates
I/O
I/O
Latches
Discrete PLL Blocks
Phase
Detector
Divider/
Prescaler
Loop
Filter
Gates
CMOS/TTL
HCSL
LVDS
PECL/CML
PE/EQ
Data
PLL Clock
Module
VCO
Processor
Latches
ASIC
Flip-Flop
ZDB
I/O
Backplane
ON Semiconductor provides a complete portfolio of timing and data management solutions for all aspects of the clock tree. System
designers can optimize their clock circuits with industry leading clock distribution devices, demonstrating the industry’s lowest jitter and
skew. A broad product portfolio, with multiple output and interface options, allows system designers to build clock circuits that satisfy
their specific application requirements. ON Semiconductor utilizes CMOS, Bipolar, and SiGe technology to leverage the best performance
for any given application. For further details by device, function, or parametrics, refer to our website at www.onsemi.com.
Expanding on more than 30 years of experience as the world’s leader in high performance ECL-based clock distribution, ON Semiconductor
has extended its expertise into ultra low jitter PLL clock synthesis and generation. The new PureEdge™ PLL devices utilize a fully
differential architecture that enables performance that satisfies the timing requirements for the most demanding applications.
Performance Capabilities
•Differential design for reduced noise
•ECL, PECL, CML, LVDS, HSTL, HCSL, LVTTL/LVCMOS outputs for flexible
interfacing
•Maximum clock rates >10 GHz
•Maximum data rates >12 Gbps
•Typical jitter as low as 30 fs
•Integrated termination resistors for simplified circuit design
•Edge rates as low as 28 ps
•Low phase noise floor ≤ –174 dBc/Hz
•Low skew
Page 38
Industrial Solutions
CLOCK DISTRIBUTION
PLL Clock Synthesizers/Generators
Synthesizer/
Generator
Features
•Based on phase-locked-loop techniques with zero PPM synthesis error
•Low jitter for high accuracy clock signals
•Available in industrial temperature range -40°C to +85°C
•Supports output interfaces: LVPECL, LVDS, HCSL, LVTTL/LVCMOS
•Multiple PLLs and multiple output options
NB3N5573 Typical Phase Noise at Fc = 200 MHz
Input
(MHz)
25
25
5 to 27
2 to 50
2 to 50
5 to 52
27
1 to 50
25
25
25
Device
NB3N3002
NB3N5573
NB3N3020
NB3N501
NB3N502
NB4N507A
NB3N508S
NB3N511
NB3N51034
NB3N51044
NB3N51054
Output
(MHz)
25/125/200
25/100/125/200
5 to 210
13 to 160
14 to 120
50 to 200
216
14 to 200
100/200
100/125
100
Application
CPU/DIMM, PCIe Gen 1,2,3
CPU/DIMM, PCIe Gen 1,2,3
Network GigE
Networking, Consumer, STB
Networking, Consumer, STB
Networking, Consumer, STB
VCXO Set Top Box
Networking, Consumer, STB
CPU/DIMM, PCIe Gen 1,2,3
CPU/DIMM, PCIe Gen 1,2,3
CPU/DIMM, PCIe Gen 1,2,3
XTAL
3
3
3
3
3
3
3
3
3
3
3
CML
3
Input Level
CMOS LVPECL
3
3
3
3
3
3
3
3
3
TTL
3
3
Output
Level
HCSL
HCSL
ECL, LVTTL
CMOS
LVCMOS
ECL
LVDS
CMOS
HCSL
HCSL
HCSL
VCC Typ
(V)
3.3
3.3
3.3
3.3, 5
3.3, 5
3.3, 5
3.3
3.3, 5
3.3
3.3
3.3
Package(s)
TSSOP-16
TSSOP-16
TSSOP-16
SOIC-8
SOIC-8
SOIC-16
TSSOP-16
SOIC-8
TSSOP-20
TSSOP-28
TSSOP-24
PCIe Timing Solutions
•PCIe clock synthesizers with single, dual, and quad outputs
•PCIe buffers with 1:6, 1:8, 1:10, and 1:21 fanouts
•Solutions for one, two, six, eight, ten, and twenty-one channel applications available
•Ultra low skew
•Small propagation delay variation (up to 21 output)
•Jitter compliant with PCIe Gen 1,2, 3 specification
•Direct device interface eliminates external termination components and simplifies BOM
100 MHz HCSL
100 MHz HCSL
NB3N3002/5573
100 MHz HCSL
FPGA 1
FPGA 2
NB3N106K/108K/111K/121K
1:6, 1:8, 1:10 HCSL
100 MHz HCSL
100 MHz HCSL
ASIC 1
ASIC 2
PCIe Gen 1, 2, 3 Clock Generation and Distribution
ON Semiconductor
Jitter Results After Fanout
Page 39
CLOCK DISTRIBUTION
Zero Delay Buffers
Zero Delay
Buffer PLL
FBK
2
PLL
REF
Extra Divider (−3, −4)
Features
CLKA4
S2
SELECT
INPUT
DECODING
S1
Extra
Divider
(–2, –3)
Channels
Package(s)
2
250
SOIC-8
133.3
4
200
SOIC-8
133.3
5
250
SOIC-8, TSSOP-8
3.3
133.3
8
200
SOIC-16, TSSOP-16
3.3
133.3
9
250
SOIC-16, TSSOP-16
Device
VCC Typ
(V)
fMax Typ
(MHz)
NB3N2302
CMOS
CMOS
3.3, 5
133
NB2304A
CMOS
CMOS
3.3
NB2305A
CMOS
CMOS
3.3
NB2308A
CMOS
CMOS
NB2309A
CMOS
CMOS
CLKA2
CLKA3
tSkew O-O
Max (ps)
Output
Level
MUX
Extra Divider
(–5H)
•Industry standard functions and pin-outs
•Zero input-output propagation delay, adjustable by
capacitive load
•Multiple configurations available for maximum flexibility
•Operating frequency to 133 MHz for CPU and PCI
compatibility
Input
Level
CLKA1
2
2
CLKB1
NB2308A
Functional Diagram
CLKB2
CLKB3
CLKB4
PCIe Zero Delay Buffers
Features
•Differential SRC clock support
•NB3N1900K, NB3N1200K: DB1900Z and DB1200Z
compliant with 19 and 12 output pairs respectively
•NB3W1200L, NB3W800L: DB1200ZL and DB800ZL
compliant with 12 and 8 low power NMOS push-pull
output pairs respectively
•NB3W1900L: 19 low power NMOS push-pull output
pairs
•Optimized for 100 MHz and 133 MHz to meet PCIe*
Gen 2/Gen 3 and Intel QPI phase jitter specifications
•Spread spectrum compatible for low EMI
•Pseudo-external fixed-feedback for low input-to-output
delay variation
•Individual OE control pin for each output
•SMBUS programmability for power down mode, PLL BW
modes, PLL/Bypass mode & frequency selection
Page 40
OE_[11:0]#
12
FB_OUT*
FB_OUT#*
SSC Compatible
PLL
CLK_IN
DIF_[11:0]
MUX
DIF_[11:0]#
CLK_IN#
100M_133M#
HBW_BYPASS_LBW#
SA_0
SA_1
PWRGD/PWRDN#
SDA
SCL
Control
Logic
* FB_OUT pins are for NB3N1200K only; they are NC for NB3W1200L
** IREF pin is for NB3N1200K only; it is NC for NB3W1200L
IREF**
RREF
NB3N1200K Simplified Block Diagram
Industrial Solutions
VDD
6
CLK CLK
5
4
Crystal
PLL
Clock
Multiplier
1
VC
2
OE
3
VC
6 PIN CLCC
VDD
6
1
OE
VDD
6
1
OE
CLK
5
2
FSEL
CLK
5
2
NC
CLK
4
3
GND
CLK
4
3
GND
Dual Frequency Pinout
(Bottom View)
Single Frequency Pinout
(Bottom View)
Features
•Broad portfolio of Crystal Oscillators XO and Voltage-Controlled
Crystal Oscillators (VCXO)
•Fully integrated crystal reference and PLL synthesizer in the
ceramic module
•Industry standard 5 mm x 7 mm x 1.9 mm ceramic module
•Footprint compatible replacement to 3rd overtone, and SAW
based XO/VCXO modules
•XOs offer up to two user selectable frequencies
•Lower cost and shorter lead time
•LVPECL and CML outputs
•Output Enable (OE) available
•Total frequency stability of ± 20 PPM or ± 50 PPM
•Industrial temperature range -40°C to +85°C
•Low phase noise floor ≤ -160 dBc/Hz
•Integrated phase RMS jitter (12 kHz – 20 MHz) 0.5 ps (Typ)
•Spurious noise less than -70 dBc
•VCXOs have positive tuning slope
•VCXOs have 10% linearity for specified tuning range
•VCXOs have ±100 PPM pulling range guaranteed
•All standard frequencies available (50 MHz to 700 MHz)
•NBXzzA0xx – XO with total frequency stability of ±50 PPM
•NBXzzB0xxx – XO with total frequency stability of ±20 PPM
•NBVSBA0xx – VCXO with LVPECL output
Typical Phase Noise/Jitter Plot @ 125 MHz
ON Semiconductor
CLOCK DISTRIBUTION
PureEdge™ Clock Oscillator Modules
Page 41
CLOCK DISTRIBUTION
Dividers and Counters
Counters/
Dividers
Features
•Low jitter and skew for highly accurate phase matching
•Multiple outputs and ratios combined for integrated circuit designs
•Supports interface and voltage translation
Input Level
Device
NB4L339
NB7V32M
NB7N017M
NB7L32M
NB6N239S
NB6L239
CML
3
3
3
3
3
3
CMOS LVPECL
3
3
3
3
3
3
3
3
LVDS
3
3
3
3
3
3
Output
Level
ECL
CML
CML
CML
LVDS
ECL
VCC Typ
(V)
2.5, 3.3
1.8, 2.5
3.3
2.5, 3.3
3.3
2.5, 3.3
fMax Typ
(GHz)
0.7
10
3.5
14
3
3
Div Ratios
Package(s)
1 or 2; 2; 4; 8
2
2 to 256
2
1/2/4/8; 2/4/8/16
1/2/4/8; 2/4/8/16
QFN-32
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
DIVSEL
CLKSEL
CLKA
VTA
CLKA
50−
50−
CLKB
VTB
CLKB
50−
50−
EXAMPLE: fin = 622.08 MHz
EN
EN
A
÷1 / ÷2
R
A
QA0
QA0 foutA = 622.08 MHz
QA1
or 311.04 MHz
QA1
B
÷2
R
B
QB0
QB0
QB1
QB1
C
÷4
R
C
QC0
QC0 foutC = 155.52 MHz
QC1
QC1
D
÷8
R
D
QD0
QD0
QD1
QD1
MR
foutB = 311.04 MHz
foutD = 77.76 MHz
NB4L339 Functional Diagram
Page 42
Industrial Solutions
Features
Outputs per
Channel
NB3N106K/08K
NB3N111K/21K
NB3L83948C
NB3V8312C
NB3F8L3010C
NB3M8T3910G
NB7L111M
NB7L1008/M
NB7V585M
NB7V586M
NB7VQ1006M
NB3F8L3005C
NB3L853141
NBSG14
NB3M8302C/04C
NB3N853501E
NB3N853531E
NB6HQ14M
NB6L14/M
NB6L14S/N14S
NB7HQ14M
NB7L14/M
NB4L339
NB4N11M
NB6L11
NB6L11M
NB6L11S
NB6L611
NB7L11M
NB7L72M
NB7L572
NB3L8504S
NB3L8543S
NB3L8533
NB3L208K
NB3U1548C
NB3N4666C*
NB3V1102C/3C
NB3V1104C/6C
NB7VQ572M
NBSG11
NB6L56
Output Level
HCSL
3
12
12
10
10
10
8
6
6
6
5
5
5
2, 4
4
4
4
4
4
4
4
2
2
2
2
2
2
2
2
2
4
4
4
8
4
4
CMOS
CMOS
CMOS
HCSL, CMOS,LVDS, ECL
CML
ECL/CML
CML
CML
CML
CMOS
ECL
ECL
CMOS, TTL
ECL
ECL
CML
ECL/CML
LVDS
CML
ECL/CML
ECL
CML
ECL
CML
LVDS
ECL
CML
CML
CML
LVDS
LVDS
LVPECL
HCSL
LVCMOS, LVTTL
LVCMOS, LVTTL
3
2, 3, 4, 6
LVCMOS
2
2
1
CML
ECL
ECL
3
3
3
TTL
fMax Typ
(GHz)
Package(s)
3.3
100
0.4
3
3
3
3
2.5, 3.3
1.8, 2.5, 3.3
1.5, 1.8, 2.5, 3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
1.8, 2.5
1.8
1.8, 2.5
1.5, 1.8, 2.5, 3.3
2.5,3.3
2.5, 3.3
2.5, 3.3
3.3
3.3
2.5
2.5, 3.3
2.5/3.3
2.5
2.5, 3.3
2.5, 3.3
3.3
2.5, 3.3
2.5, 3.3
3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
2.5, 3.3
1.5, 1.8, 2.5, 3.3
3.3
25
150
55
50
20
20/25
30
30
1
55
30
15
45, 85
30
30
3
20
20
15
15
60
25
15
15
25
15
15
10
15
50
40
30
100
250
50
0.35
0.25
0.2
1.4
5.5
7/8
7
6
7.5
0.2
700
12
0.2
0.266
0.266
5
3
2
7
7/8
0.7
2.5
6
2
2
3
8
8.5
7
0.7
0.65
0.65
0.35
0.16
0.2
1.8, 2.5, 3.3
50
0.25
TSSOP-14,8
1.8, 2.5
2.5, 3.3
2.5, 3.3
15
15
25
5
12
2.5
QFN-32
QFN-16, BGA-16
QFN-32
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
tSkew O-O
(ps)
3
3
3
VCC Typ
(V)
3
3
3
SYNC
3
3
3
Q7
3
3
3
Q6
QFN-52, QFN-32,
QFN-24
LQFP-32
LQFP-32
QFN-32
QFN-48
QFN-52
QFN-32
QFN-32
QFN-32
QFN-24
QFN-32
TSSOP-20
QFN-16, BGA-16
SOIC-8
TSSOP-20
TSSOP-20
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
QFN-32
TSSOP-8
TSSOP-8, SOIC-8
QFN-16
QFN-16
QFN-16
QFN-16
QFN-16
QFN-32
TSSOP-16
TSSOP-20
TSSOP-20
QFN-32
TSSOP-8, SOIC-8
TSSOP-16, QFN-16
3
3
Q5
OSC
NB3F8L3010C
Functional Diagram
3
3
Q4
Q9
3
3
Q3
CLK1
CLK1
VDD
3
3
Q2
Q8
3
3
Q1
CLK0
CLK0
XTAL_IN
XTAL_OUT
Clock and Data
Distribution
Input Level
CML CMOS LVPECL HCSL HSTL LVDS XTAL
6, 8, 10, 21
Q0
SEL0
SEL1
•Complete portfolio of fanout buffers, multiplexers, cross point switches
•Supporting frequencies from DC to 12 GHz/Gbps
•Device noise floor as low as -174 dBc
•Pre-Emphasis and Equalization blocks available
•Offer new direct X-tal interface capabilities
•Industry leading additive jitter as low as 30 fs typical
•Industry leading output-to-output skew as low as 3 ps minimum
•Wide offering of voltage and interface translation:
•ECL, PECL, CML, LVPECL, LVDS, M-LVDS, HSTL, HCSL, LVCMOS/LVTTL
•Power supply 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V
Device
VDD
VDDO
GND
3
3
3
* Pending 3Q15
ON Semiconductor
Page 43
CLOCK DISTRIBUTION
Clock and Data Distribution
Electronic Fuses for Inrush Current Limiting on Power Buses
5 V and 12 V Power Bus Protection
Features
VCC
PROTECTION
•Low RDS(ON), high operating and trip currents
(IOP, ITRIP)
•Overvoltage protection
•Precise ITRIP control
•Slew rate control
•Thermal shut-down
•EN pin for synchronizing multiple eFuses
•Outperforms poly-fuses:
–Tighter spec tolerances
–Lower resistance
–Lower trip-time
–Superior repeatability
Enable/
Fault
Charge
Pump
Enable
Source
Thermal
Shutdown
Current
Limit
UVLO
Voltage
Clamp
ILimit
dV/dt
Control
dV/dt
GND
Typical Feature Set for eFuse
Fan Blade
Aerodynamic Load
Overcurrent / Overheat
conditions
Voltage
(V)
Angular Vel.
(RPM)
Permanent
Magnet
DC motor
Transient
Overshoot
Suppression
Vin
Input Filter
Capacitor
eFuse
NISxxxx
L-C
Low Pass Filter
Nominal
Current
DC Motor’s Noise Filter
Peak
Current
eFuse Prevents
Overcurrent
Typical Application Block Diagram
Current (A) / Torque (ft * lb)
DC Motor I/V Characteristics
Input Voltage
(V)
Output Clamping
Voltage
(V)
ITRIP
Trip Current
(A)
RDS(ON)
(mW)
Auto Recovery
Option
Latching Option
Package
NIS5112
-0.6 to 18
15
2.5 (adjustable)
28
Yes
Yes
SOIC-8
NIS5132
-0.6 to 18
15
3.5 (adjustable)
44
Yes
Yes
DFN-10
NIS5232
-0.6 to 18
15
4.0 (adjustable)
44
No
Yes
DFN-10
NIS5135
-0.6 to 18
6.65
3.5 (adjustable)
68
Yes
Yes
DFN-10
NIS5451*
-0.6 to 14
5.5
2.0 (adjustable)
33
No
Yes
WDFN-10
NIS5452*
-0.6 to 14
5.85
3.5 (adjustable)
33
Yes
Yes
WDFN-10
NIS5431*
-0.6 to 14
3.85
2.0 (adjustable)
40
No
Yes
WDFN-10
Device
* Pending 3Q15
Page 44
Industrial Solutions
ESD and Surge Protection for Industrial Networks
Transient Voltage Suppressors (TVS)
Ppk*
(W)
200
400
600
600
1500
1500
Device
SMF Series
1SMA Series
1SMB Series
P6SMB Series
1SMC Series
1.5SMC Series
Vrwm
(V)
5 – 36
5 – 78
5 – 170
5.8 – 171
5 – 78
5.8 – 77.8
Zener Voltage Regulators
Direction
Unidirectional
Uni-, Bidirectional
Uni-, Bidirectional
Uni-, Bidirectional
Unidirectional
Unidirectional
Package
SOD-123FL
SMA
SMB
SMB
SMC
SMC
* Peal surge power under 10/1000 ms.
Power
(W)
0.225
0.225
0.5
1.5
3
3
5
Device
BZX84 Series
MMBZ Series
MMSZ Series
1SMA59 Series
1SMB59 Series
1N59 Series
1N53 Series
VZ
(V)
2.4 – 75
2.4 – 91
1.8 – 91
3.3 – 68
3.3 – 200
3.3 – 200
3.3 – 200
VZ Tolerance
(%)
2, 5
5
5
5
5
5
5
Package
SOT-23
SOT-23
SOD-123
SMA
SMB
Surmetic 30
Surmetic 40
Network Dataline Protection
Peak Surge
Current**
Max (A)
CAN_H
Device
Application
NUP3105L
HS CAN
32
30
8
SOT-23
NUP2125
HS CAN
24
5
3
SOT-323
NUP2115L
FlexRay
24
5
3
SOT-23
NUP2105L
HS CAN
24
15
8
SOT-23
NUP1105L
LIN, LS CAN
24
30
8
SOT-23
RS-232
12
48
12
SOT-23
NUP4201
USB2.0 FS
5
2.5
25
SO-8
NUP4114
USB2.0 HS
5
0.5
12*
TSOP-6
TVS881x*
10/100/1000BASE-T
Ethernet, Gb Ethernet
3.3
1.5
25
UDFN-10
SM12T
CAN
Transceiver
Package
CAN Bus
CAN_L
CAN or LIN
Transceiver
PROTECTION
Line-to-Line
Vrwm Max Capacitance
(V)
(pF)
NUP1105L
NUP2105L
* Pending 2H15. ** on VP pin (pin 5).
USB3.1 Type-C Port Control
Features
•Current optimized for USB control
•Low capacitance enables high
speed operation
Device
VGDS
(V)
VGS(off)
(V)
IGSS
(nA)
IDSS
(mA)
|ysf|
(mS)
CISS
(pF)
Package
TF412S
-30
-0.18 to -1.5
1
1.2 to 3.0
5.0
4
SOT-883
VCONN1
Impedance
Control
VCONN2
RA
RA
Control
IC
ON Semiconductor
Page 45
Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit
Four Pairs, Low Capacitance Surge and ESD Protection
The 1000BASE-T or Gigabit Ethernet interface operating at higher bitrates is susceptible to ESD strikes, cable-discharge events and
lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.
Features
Typical Application
TPOPA
1000BASE-T
ETHERNET TRANSCEIVER
TPONA
ALC03
TVS8818
C3
TPONC
C6
BLC03
8
TPOPC
B+
VDD
C+
RJ45
TPONB
TRANSFORMER
C2
8
TPOPB
1
VDD
C7
CLC03
TPOPD
C4
TPOND
8
1
•Compatible with Gb Ethernet and beyond
•Enhanced protection for downstream electronics
•Accommodates operating transients above 3.3 V
•Small form-factor allows integration into connectors
A+
VDD
C5
1
D+
VDD
C8
DLC03
Line Side : LC03-6 (optional)
Transformer Side: TVS8818
Protection against metallic (transverse) strikes
1
2
TVS8818
4
5
30
Voltage (V), Current (A)
3
RJ-45 Connector
PROTECTION
Benefits
C1
8
1
•Line-to-line capacitance < 3 pF
•Vclamp (25 A surge) < 11 V
•IEC 61000-4-2 rating > 30 kV
•No latching danger
•Surge rating maintained to 125°C
6
Flow Through
Routing
7
25
8/20 μs
Surge Current
15
ON Semiconductor
Voltage
10
5
0
-10
8
Competitor
Voltage
20
0
10
20
30
Time (μs)
40
50
60
Line-to-Line Surge
Transient Voltage Suppressors
Device
LC03-6
TVS8814*
TVS8818*
SRDA3.3
SRDA05
NUP4114H
VDC Max
(V)
6.7
3.0
3.0
3.3
5.0
5.0
Line
Transient
Max
(V)
7.0
3.2
3.2
5.0
7.0
5.0
Surge IPP,
8/20 ms
(A)
100
35
35
25
23
12**
Typical
Line-Line
Capacitance
(pF)
8.0
1.5
1.5
4.0
5.0
0.4
ESD
Contact
Rating
(kV)
±30
±30
±30
±8
±8
±13
Package
SOIC-8
UDFN-8
UDFN-10
SOIC-8
SOIC-8
TSOP-6
* Pending 3Q15. ** On Pin 5.
Page 46
Industrial Solutions
USB 2.0 Protection
One High Speed Pair, V CC , Low Capacitance ESD Protection
Key Requirement
I/O 1 I/O 2 I/O 3 I/O 4
•Cap < 1.5 pF
Features
GND
•0.5 - 0.8 pF
•4 low speed + 1 VBUS integrated – can
protect up to 2 USB ports
•Industry leading low clamping voltage
Data Lines
NUP4114UCL
NUP4114UPX
NUP4114H
NUP3115
ESD7L5.0
ESD7451
ESD7481
2 Pair + Power
2 Pair + Power
2 Pair + Power
1 Pair + ID + Power (D+, D-, ID, VBUS)
1 Pair (D+, D-)
Single Line 0402
Single Line 0201
0.50
0.80
0.80
0.80
0.50
0.25
0.25
=
DVBUS
Package
Size
(mm)
SC-88
SOT-563
TSOP-6
UDFN-6
SOT-723
XDFN-2
X3DFN-2
2.0 x 2.1
1.6 x 1.6
3.0 x 2.75
1.6 x 1.6
1.2 x 1.2
1.0 x 0.6
0.62 x 0.32
NUP4114
PROTECTION
Device
Capacitance
(pF)
D+
One High Speed Pair, V CC , Common Mode Filter + ESD Protection
Micro USB
Connector
Key Requirement
•Cap < 1.5 pF
•Common Mode Filtering
GND
EMI2121
D+
Features
D-
•0.5 - 0.8 pF
•Integrated EMI suppression with ESD protection
•Industry leading low clamping voltage
Data Lines
Capacitance
@ 2.5 V (pF)
1 Pair + Power (D+, D-, VBUS)
1 Pair + ID + Power (D+, D-, ID, VBUS)
0.9
0.9
Device
EMI2121
EMI2124
ID
VBUS
Top layer
Other layer
CM Attenuation DM Bandwidth
@ 800 MHz (–dB) F3dB (GHz)
Package
–25
–25
2.5
2.5
WQFN
WQFN
Size
(mm)
2.2 x 2.0 x 0.75
2.2 x 2.0 x 0.75
0
-5
-10
dB
-15
-20
-25
-30
USB 2.0 @ 480 Mb/s
ON Semiconductor
-35
1.E+06
Suppresses Common Mode Noise
Deeper than Competing Passive Solution
Common
Mode
Differential
Mode
1.E+07
1.E+08
1.E+09
Frequency
Page 47
General and LCD MCUs
MCU Features
•Pins:
•ROM:
•RAM:
•ADC:
10 – 100
4 – 512 KBytes
256 – 24,576 Bytes
3 – 16 channels
ROM
RAM
(kByte) (Byte)
Device
Type
LC87FBG08A
8-bit General
8
256
LC87FBK08A
8-bit General
8
LC87FBL08A
8-bit General
8
LC87FBH08A
8-bit General
LC87F2R04A
8-bit General
LC87BK08A*
LC87F2416A
•Operation Voltage: 1.8 – 5.5 (V)
•Stand-by IDD: 0.02 µA
•RTC (Clock) IDD: 0.45 µA
(with low power model)
μA
OTHER
I/Os
PWMs
UARTs
ADC
LVD
POR
Features
Package
21
2
1
12/8-bit x 9ch
✔
✔
High accuracy internal OSC (±2.0%); all operation is minimum 1.8 V
SSOP-24, VCT-24
256
21
2
—
12/8-bit x 8ch
✔
✔
High accuracy internal OSC (±3.0%); Support Mask Type
SSOP-24
256
26
2
—
12/8-bit x 11ch
✔
✔
High accuracy internal OSC (±3.0%)
QFP-36
8
256
26
2
1
12/8-bit x 11ch
✔
✔
High accuracy internal OSC (±3.0%)
QFP-36
4
128
21
—
—
12/8-bit x 8ch
✔
✔
Small scale 8bit MCU; Remote Control Receiver Circuit
SSOP-24
8-bit General
8
256
21
2
—
12/8-bit x 8ch
✔
✔
Mask ROM edition of LC87FBK08A
SSOP-24
8-bit General
16
512
26
2
1
12/8-bit x 10ch
—
—
Premium market segment
QFP-36
LC87F2J32A
8-bit General
32
1024
41
2
1
12/8-bit x 14ch
✔
✔
Premium market segment
SQFP-48, QIP-48
LC87F2W48A
8-bit General
50
1536
40
2
1
12/8-bit x 14ch
✔
—
Premium market segment
SQFP-48
LC87F2C64A
8-bit General
64
2048
73
4
2
12/8-bit x 16ch
✔
✔
RTC; low power consumption
QFP-80
LC87FC096A
8-bit General
96
4096
55
6
2
12/8-bit x 11ch
✔
✔
12bit PWM x 6
QIP-64E
LC87F2608A
8-bit General
8
512
7
1
—
12/8-bit x 3ch
✔
✔
High speed 12-bit PWM; Analog Comparator
MFP-10SK
LC87F0808A
8-bit General
8
256
30
6
1
10/8-bit x 10ch
✔
✔
MCPWM; High speed ADC (10-bit); Analog Comparator/Amplifier x 2
QFP-36
LC87F0N04A
8-bit General
4.5
128
12
4
—
10/8-bit x 6ch
✔
✔
MCPWM; High speed ADC (10-bit); Analog Comparator x 2
SSOP-16
LC87F0G08A
8-bit General
8
256
18
3
—
12/8-bit x 7ch
—
—
MCPWM, OP-AMP, Analog comparator
SSOP-24
LC87F0A08A
8-bit General
8
256
30
2
—
12/8-bit x 8ch
✔
✔
OP-AMP, Analog comparator, Constant current output port
QFP-36
LC87F5VP6A
8-bit General
256
10240
89
4
2
8-bit x 15ch
—
—
Large scale memory
QIP-100E
LC88F58B0A
16-bit General
128
6144
54
2
2
12/8-bit x 11ch
—
✔
Motor control signal generator
SQFP-64
LC88F52H0A
16-bit General
512
24576
90
4
4
12/8-bit x 16ch
—
✔
DAC; PWM; RTC; SIO x 5; UART x 4
TQFP-100
LC87F7932B
8-bit LCD
32
2048
49
2
1
12/8-bit x 7ch
—
✔
32 x 4 segment driver; RTC; low power consumption
SQFP-64
LC87F7J32A
8-bit LCD
32
1024
51
2
1
12/8-bit x 12ch
✔
✔
24 x 4 segment driver; support 5 V/3 V for LCD-panel
TQFP-64
LC87F76C8A
8-bit LCD
128
4096
71
2
1
12/8-bit x 12ch
—
—
32 x 4 segment driver
QFP-80
LC87F7DC8A
8-bit LCD
128
4096
91
2
2
12/8-bit x 15ch
—
—
54 x 4 segment driver; many segment drivers
QIP-100E
LC87F7NC8A
8-bit LCD
128
4096
91
2
2
12/8-bit x 15ch
—
—
54 x 4 segment driver; large scale memory
QIP-100E
LC87F7NJ2A
8-bit LCD
192
8192
91
2
2
12/8-bit x 15ch
—
—
54 x 4 segment driver; large scale memory
QIP-100E
LC87F7NP6A
8-bit LCD
256
8192
91
2
2
12/8-bit x 15ch
—
—
54 x 4 segment driver; large scale memory
QIP-100E
* Mask ROM Device; Contact ON Semiconductor for additional information.
MCUs for USB
MCU Features
•USB 2.0 full-speed / low speed functions
•USB device function / USB host function
Device
Type
ROM
RAM
(kByte) (Byte)
I/Os
PWMs
UARTs
•Integrated voltage regulator
•USB D+ line pull-up function
ADC
LVD
POR
Features
Package
LC87F1A32A
8-bit USB
32
2048
39
2
1
12/8-bit x 12ch
—
—
IR reciever
SQFP-48
LC87F1M16A
8-bit USB
16
1024
38
2
1
12/8-bit x 20ch
✔
✔
UART & SCUART; high current driver
SQFP-48
LC87F1K64A
8-bit USB
64
8192
39
2
1
12-bit x 12ch
✔
✔
USB I/F x 2; USB Host; Audio I/F
SQFP-48
LC87F17C8A
8-bit USB
128
8192
39
2
1
12/8-bit x 12ch
SQFP-48
8-bit USB
8-bit USB
8-bit USB
8-bit USB
128
192
192
192
16384
16384
20480
24576
39
39
39
39
2
2
2
2
1
1
1
1
8-bit x 12ch
8-bit x 12ch
8-bit x 12ch
8-bit x 12ch
4
—
—
—
—
USB 2.0 full speed host/device controller x2; audio IF
LC87F1HC8A
LC87F1JJ2A
LC87F1JJ4A
LC87F1JJ8A
4
—
—
—
—
USB Host; Audio I/F
USB Host; Audio I/F
USB Host; Audio I/F
USB Host; Audio I/F
SQFP-48
SQFP-48
SQFP-48
SQFP-48
Page 48
Industrial Solutions
Development Tools for Microcontrollers
Software
Development
Debugging/
Verification
For 8-Bit
Writing
Flash Writing System
On-chip Debugger
TCB87-TYPEC-MDT
• On Board Writer
SKK-DBG-TYPECMDT
(On-chip debugger software included)
C Compiler/Assembler
Software Development
Environment CD
• Inst87 (Information on microcontroller models)
• SU (Options setup program)
Display Panel Emulation
Tool
Panel Design
Supports Both 8- and 16-Bits
• Flash ROM Writer
SKK-TYPEC-MDT
For 16-Bit
C Compiler/Assembler
On-chip Debugger
EOCUIF2-MDT
OTHER
(On-chip debugger software included)
• Flash ROM Writer from
Support Group
Single programmer
AF9709C / AF9711
Software Development
Environment CD
• Inst87 (Information on microcontroller models)
• SU (Options setup program)
Gang programmer
AF9723/23B (main body)
AF9833 (unit)
Onboard Programmer
AF9101/03 (main body)
SIB87-TYPEC-GMDT
(ON Semiconductor)
• On Board Writer
FWSX16DITYPE2MDT
ON Semiconductor
Page 49
Smart Card Interfaces
VDDP
10 uF
VDD
100 nF
100 uF
VDDP
VDD
Microcontroller
R1
VDD
R2
Features
DATAPORT
CONTROL
•ISO & EMV compliance
•ESD protection on card pins up to
+8kV (Human Body Model)
INT
NCN8024R
CRD_PRES
PORADJ
CRD_PRES
CMDVCC
5V/3V
CRD_VCC
CRD_RST
CLKDIV1
CLKIN
CRD_CLK
CRD_AUX1
CRD_AUX2
CRD_IO
RSTIN
CRD_GND
CLKDIV2
I/Ouc
SMART CARD
100
nF
220
GND nF
GND
1
2
3
4
DET
DET
Vcc
RST
CLK
C4
GND
Vpp
I/O
C8
5 GND
6
7
8
GNDP
AUX1uc
AUX2uc
GND
GND
Ports
Control
Interface
Card
Type
VDD mC Interface
(V)
Power
Supply
NCN6001
1
SPI
A, B, C
2.7 – 5.5
NCN8024R
1
Parallel
A, B
1/3
Parallel
NCN8026
(SAM/SIM)
1
NCN4555
1
Device
OTHER
Smart
Card NCN8025/A
(SAM/SIM)
SAM
Sequencer
Card
Detect
Clock
Divider
Standards
Package(s)
Inductive
DC-DC
Yes
Yes
Yes
ISO7816; EMV4.3
TSSOP-20,
TLLGA-20
2.7 – 5.5
LDO
Yes
Yes
Yes
ISO7816; EMV4.3
SOIC-28W
A, B, C
2.7 – 5.5
LDO
Yes
Yes
Yes
ISO7816; EMV4.3;
UICC
QFN-16,
QFN-24
Parallel
A, B, C
1.6 – 5.5
LDO
Yes
Yes
Yes
ISO7816; EMV4.3;
UICC; SIM
QFN-24
Parallel
B, C
1.8 – 5.5
LDO
No
No
No
UICC; SIM
QFN-16
NCN8024R Demo Board
Page 50
Industrial Solutions
Integrated Interface with Configurable DC-DC Controller
for Power-over-Ethernet
PoE Controllers
Device
Power
(W)
Standard
NCP1080
13
IEEE 802.3af
ü
ü
TSSOP-20 EP
NCP1082
13
IEEE 802.3af + Auxiliary
ü
ü
TSSOP-20 EP
NCP1081
40
IEEE 802.3at
ü
ü
TSSOP-20 EP
NCP1083
40
IEEE 802.3at + Auxiliary
ü
ü
TSSOP-20 EP
NCP1090
13
IEEE 802.3af
ü
TSSOP-8, SOIC-8
NCP1091
13
IEEE 802.3af
ü
TSSOP-8, SOIC-8
NCP1092
13
IEEE 802.3af
ü
TSSOP-8, SOIC-8
NCP1093
25
IEEE 802.3at
ü
DFN-10
NCP1094
25
IEEE 802.3at
ü
DFN-10
NCP1030
6
IEEE 802.3af
ü
SOIC-8, DFN-8
NCP1031
3
IEEE 802.3af
ü
Micro8™
Features
Package
•3.0 kV cable ESD robustness
•8.0-15 kV system ESD
robustness
•IEC61000-4-5 surge compliant
without external protection
OTHER
Interface Controller
Temperature Monitors with Series Resistance Cancellation
VDD
0.1 F
VDD
D−
SHIELD
TYP 10 k
NCT72
D+
2N3906
or
CPU THERMAL
DIODE
1.8 V or VDD
SCLK
SMBus/I2C
CONTROLLER
SDATA
ALERT/
THERM2
1.8 V or VDD
THERM
TYP 10 k
GND
•On−chip and remote temperature sensor
•0.25°C resolution/1°C accuracy on remote channel
•1°C resolution/1°C accuracy on local channel
•Series resistance cancellation up to 1.5 kΩ (NCT72)
•E xtended, switchable temperature measurement range
0°C to +127°C (default) or –64°C to +191°C
OVERTEMPERATURE
SHUTDOWN
Interface
Number of
Addresses
Temperature
Sensors
Temperature Sensor
Accuracy
(°C)
Temperature
Range
(°C)
Package
3.0 - 5.5
I2C/SMBus
8
1 Local
±1
-55 to +125
Micro8, SOIC-8, DFN-8
2.8 - 3.6
I2C/SMBus
2
1 Local; 1 Remote
±1
-40 to +125
WDFN-8, DFN-8
Supply Range
(V)
NCT375*
NCT72
Device
Features
* Pending 2H15
ON Semiconductor
Page 51
Serial EEPROMs
Features
•Broad density range: 1 kb to 2 Mb
•Wide operating Vcc range: 1.8/1.7 V to 5.5 V
•High endurance: 1 million program/erase cycles
•Wide temperature range: industrial and extended
EasyPRO™ is a user-friendly, portable programming
tool for ON Semiconductor serial EEPROMs
(I2C, SPI, Microwire)
EEPROMs
Data
Transmission
Standard
I2C
OTHER
SPI
Microwire
Device
Density
Organization*
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz)
Package(s)
CAT24M01
CAT24C512
CAT24C256
CAT24C128
CAT24C64
CAT24C32
CAT24C16
CAT24C08
CAT24C04
CAT24C02
CAT25M02
CAT25M01
CAT25512
CAT25256
CAT25128
CAT25640
CAT25320
CAT25160
CAT25080
CAT25040
CAT25020
CAT25010
CAT93C86
CAT93C86B
CAT93C76
CAT93C76B
CAT93C66
CAT93C56
CAT93C46
CAT93C46B
1 Mb
512 kb
256 kb
128 kb
64 kb
32 kb
16 kb
8 kb
4 kb
2 kb
2 Mb
1 Mb
512 kb
256 kb
128 kb
64 kb
32 kb
16 kb
8 kb
4 kb
2 kb
1 kb
16 kb
16 kb
8 kb
8 kb
4 kb
2 kb
1 kb
1 kb
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
4k x 8
2k x 8
1k x 8
512 x 8
256 x 8
256k x 8
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
4k x 8
2k x 8
1k x 8
512 x 8
256 x 8
128 x 8
2k x 8 / 1k x 16
2k x 8 / 1k x 16
1k x 8 / 512 x 16
1k x 8 / 512 x 16
512 x 8 / 256 x 16
256 x 8 / 128 x 16
128 x 8 / 64 x 16
128 x 8 / 64 x 16
1.8
1.8
1.8
1.8
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8 / 1.65
1.8
1.8 / 1.65
1.8
1.8
1.8
1.8 / 1.65
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
1
1
1
1
1
1
0.4
0.4
0.4
0.4
10
10
20
20
20
20
20
20
20
20
20
20
3
4
3
4
2
2
2
4
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8; WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
* Organization for Microwire devices is selectable.
Page 52
Industrial Solutions
Digital Potentiometers (POTs) for Trimming and Calibration
RH0
Features
•No drift over time or temperature
•No changes due to mechanical stress or shock
•Systems can be calibrated real-time, in the field
•Broad portfolio provides for selection of optimal
number of pots and taps
SCL
SDA
Number of
Taps
Resistance
(kΩ)
CAT5120/1/2
CAT5110
CAT5112
CAT5114
CAT5115
CAT5118/9
CAT5123/4
CAT5125
CAT5126
CAT5127
CAT5128
CAT5129
CAT5111
CAT5113
CAT5116
CAT5132
CAT5133
CAT5137
CAT5138
CAT5140
CAT5171
CAT5172
CAT5221
CAT5411
CAT5419
CAT5261
CAT5269
CAT5271
CAT5273
CAT5241
CAT5401
CAT5409
CAT5251
CAT5259
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
4
4
4
4
4
16
32
32
32
32
32
32
32
32
32
32
32
100
100
100
128
128
128
128
256
256
256
64
64
64
256
256
256
256
64
64
64
256
256
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
10, 50, 100
1, 10, 50, 100
32 (Log Taper)
10, 50, 100
10, 50, 100
50
10
50, 100
50, 100
50
2.5, 10, 50, 100
2.5, 10, 50, 100
2.5, 10, 50, 100
50, 100
50, 100
50, 100
50
2.5, 10, 50, 100
2.5, 10, 50, 100
2.5, 10, 50, 100
50, 100
50, 100
ON Semiconductor
RH3
RW0
RW1
WP
A0
A1
A2
A3
RW2
CONTROL
LOGIC
NONVOLATILE
DATA
REGISTERS
RW3
Buffered
Wiper
3
3
Interface
Volatile
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
UP/DOWN
I²C
UP/DOWN
I2C
I2C
I2C
I2C
SPI
I²C
SPI
I²C
SPI
I²C
I2C
I2C
I²C
SPI
I²C
SPI
I²C
3
3
NonVolatile
3
3
3
3
3
3
OTP
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
RL1
RL2
RL3
Packages
SOT-23–6, SC-70–6
SOT-23–6, SC-70–6
PDIP–8, SOIC–8, MSOP–8, TSSOP–8
PDIP–8, SOIC–8, MSOP–8, TDFN-8, TSSOP–8
PDIP–8, SOIC–8, MSOP–8, TSSOP–8
SOT-23–5, SC-70–5
SOT-23–5
SOT-23–6
MSOP-8, TDFN-8
MSOP-8, TDFN-8
SOT-23–8
TSOT-23–6
PDIP–8, SOIC–8, MSOP–8, TSSOP–8
PDIP–8, SOIC–8, MSOP–8, TSSOP–8
PDIP–8, SOIC–8, MSOP–8, TSSOP–8
MSOP–10
MSOP–10
SC-88-6, SC-70-6
SC-88-6, SC-70-6
MSOP-8
SOT-23-8
SOT-23-8
SOIC–20, TSSOP–20
SOIC–24, TSSOP–24
SOIC–24, TSSOP–24
SOIC–24, TSSOP–24
SOIC–24, TSSOP–24
MSOP-10
MSOP-10
SOIC–20, TSSOP–20
SOIC–24, TSSOP–24
SOIC–24, TSSOP–24
SOIC–24, TSSOP–24
SOIC–24, TSSOP–24
Page 53
OTHER
Number of
Pots
RH2
WIPER
CONTROL
REGISTERS
PC BUS
INTERFACE
RL0
Device
RH1
Cascadable I/O Expanders
Features
3.3 V
12 V
Button
LED
•I2C and SMBus interfaces
•1 MHz SCL clock frequency
•30 mA SDA sink capability
SCL
SDA
SCL
SDA
I/O
I/O
INT
I/O
I/O
μC
GPIO
Vext
LEDs
I/O
I/O
I/O
I/O
I/O
Slot 2 Slot 3
3.3 V
AUXEN
PWRFLT
Hot-Plug
Controller
12 V
MOSFETs
3.3 V
PCA96xxE
PCA95xxE
I/O Expander
I/O
I/O
Backplane
Systems
AUXEN
PWRFLT
Hot-Plug
Controller
12 V
PRSNT2
PRSNT2
I/O
I/O I/O I/O
Keypad
Control
ADM1033
Thermal Sensor
and
Fan Controller
Temperature
Control
OTHER
Device
I/O
Cascadable
VCC Min
(V)
VCC Max
(V)
Interrupt
Output
PCA9535E
16
64 Programmable Slave Addresses
1.65
5.5
4
QFN-24, SOIC-24, TSSOP-24
PCA9655E
16
64 Programmable Slave Addresses
1.65
5.5
4
QFN-24, SOIC-24, TSSOP-24
PCA9654E
8
8 Slave ID Addresses
1.65
5.5
4
Page 54
I/O
LED Blink/
Pullups
PWM
4
Package
SOIC-16, WQFN-16, TSSOP-16
Industrial Solutions
Logic Translators
Dual supply voltage logic translators connect ICs and
PCBs together that operate at different supply voltages.
PCB #1
PCB #2
Translator
Key Features
Translator
μC #1
•Industry’s first devices with independent power
supplies (VL < VCC, VL = VCC, or VL > VCC)
•High 100 pF capacitive drive capability
•Overvoltage tolerant enable and I/O pins
•Non-preferential power-up sequencing
•Power-off protection
μC #2
PCB-to-PCB
Translation
On-board
translations
• SPI
• I2C
• SMBus
Translator
EEPROM
Autosense Bidirectional
Translator
(Push-Pull Output)
P
One−Shot
VL
Bidirectional
Translator
(with Direction Pin)
VCC
R1
VL
VCC
VCCA
1k
VCCA
Block Diagram
N
One−Shot
VCCB
A
B
I/O VL
PU1
I/O VCC
P
One−Shot
OE
R2
RPullup
10 k
One−Shot
Block
Gate
Bias
One−Shot
Block
EN
I/O VL
VCCB
DIR
PU2
RPullup
10 k
A
EN
N
B
I/O VCC
1k
N
One−Shot
Attributes
• High Data Rate
• Low Power Consumption
• High Data Rate
• Low Power Consumption
• High Data Rate
• Low Power Consumption
• Flexible PCB Design
• High Data Rate
• Low Power Consumption
• Flexible PCB Design
Trade-Offs
• Fixed Input & Output Pins
• Modest Output Current
• Modest Bandwidth
• Directional Control Pin Required
•SPI
•GPIO
•SPI
•GPIO
•I2C, SMBus, PMBus
•GPIO
• SDIO Cards
• 1-Wire Bus
•GPIO
• NLSV1T34 (1-Bit, ULLGA-6)
• NLSV1T240/244 (1-Bit, UDFN-6)
• NLSV2T240/244 (2-Bit, UDFN-8)
• NLSV4T240/244 (4-Bit, UDFN-12)
• NLSV4T3234 (4-Bit, CSP-11)
• NLSV8T240/244 (8-Bit, UDFN-20)
• NLSX3012 (2-Bit, UDFN-8)
• NLSX3014 (4-Bit, UQFN-12)
• NLSX3013 (8-Bit, CSP-20)
• NLSX3018 (8-Bit, UDFN-20)
• NLSX4014 (4-Bit, UQFN-12)
• NLSX5011 (1-Bit, UULGA-6, UDFN-6)
• NLSX5012 (2-Bit, UDFN-8)
• NLSX5014 (4-Bit, UDFN-12)
• NLSX3373 (2-Bit, UDFN-8)
• NLSX3378 (4-Bit, CSP-12)
• NLSX4373 (2-Bit, UDFN-8)
• NLSX4378 (4-Bit, CSP-12)
• NLSV1T45 (1-Bit, ULLGA-6)
• NLSV2T245 (2-Bit, UQFN-10)
• NLSV2T3236 (2-Bit, UQFN-10)
• NLA16T245 (16-Bit, TSSOP-48)
Applications
Sample Device
(I/O Channels,
Package)
ON Semiconductor
Page 55
OTHER
Unidirectional Translator
Autosense Bidirectional
Translator
(Open-Drain Output)
Sales and Design Assistance from ON Semiconductor
ON Semiconductor Technical Support
www.onsemi.com/support
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(81) 3 3862 2440
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(81) 45 335 8550
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(82) 2 3218 1511
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www.serialsystem.jp
(81) 3 5795 1635
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www.serialsys.com.hk
(852) 2790 8220
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www.wpi-group.com
(852) 2365 4860
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www.wtmec.com
(852) 2950 0820
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www.yosun.com.tw
(886) 2 2659 8168
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Apr-15
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IMST is a registered trademarks, and EasyPRO and PureEdge are trademarks of Semiconductor Components Industries, LLC or its subsidiaries in the United States and/or other countries. Micro8 is a trademark of International Rectifier.
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