English document

No.13070161
Process Guidelines
Laminate R-5775
Prepreg R-5670
High Speed, Low Loss Multi-layer Materials
No.13070161-1
General
Material Storage
Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the
laminate surface.
When possible store the laminate in the original container.
Prepreg should be stored flat in a cool dry controlled environment, 73 F(23 C) or less and
50% RH or less.
Extended storage of prepreg should be at a reduced temperature of 41 F(5 C). Open bags
of prepreg must be resealed. Prepreg should not be exposed to open environments for
more than 8 hours total cumulatively under the above conditions or as agreed upon
between user and supplier.
Laminate Surface Preparation
Regular Shiny Copper can be cleaned using industry standard chemical clean or
mechanical clean.
Reverse Treat Copper should be cleaned using industry standard chemical clean.
Inner Layer Bond Treatment
Black or Brown Oxide can be used. In the case of using Black Oxide, please check
whether peel strength is acceptable for the usage.
Alternative Oxide Treatment with organic coating using a Peroxide/Sulfuric etch technology
is preferred.
Drying
Dry finished inner layers completely to remove any absorbed moisture or surface moisture.
A racked bake at 225 F(105 C) for 20-30 minutes is preferred. For conveyorized
alternative oxide processing, some equipment may have sufficient drying capability.
However, a racked bake is suggested.
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No.13070161-2
Drilling
(1) Drilling parameters in general condition
Drilling parameters should be adjusted depending on hole size, layer count, panel
thickness, stack count and stack height etc.
min
Diameter
mm
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
Spindle
speed
k rpm
160
160
160
137
120
107
96
87
80
74
68
64
60
56
53
max
velocity
infeed
chipload
infeed
chipload
bit life
m/min
100
126
151
151
151
151
151
150
151
151
149
151
151
149
150
m/min
1.6
1.8
1.9
1.8
1.8
1.8
1.8
1.8
1.7
1.7
1.7
1.6
1.6
1.6
1.6
μ/rev
10
11
12
13
15
17
19
21
21
23
25
25
27
29
30
m/min
2.4
2.8
3.2
3.0
2.9
2.7
2.7
2.6
2.6
2.6
2.6
2.6
2.5
2.4
2.4
μ/rev
15
18
20
22
24
25
28
30
33
35
38
41
42
43
45
hits
700-1,000
700-1,000
700-1,000
700-1,000
700-1,000
700-1,000
1,400-2,000
1,400-2,000
1,400-2,000
1,400-2,000
1,400-2,000
1,400-2,000
1,400-2,000
1,400-2,000
1,400-2,000
Note:
1) Spindle speed should be adjusted to make velocity 100 – 150 m/min.
2) To use lubricant sheets like LE sheets as entry sheets is recommendable.
3) To use drilling bits with high helix angle is recommendable.
4) Peck drilling is recommendable for thin drilling bits.
5) Please adjust drilling parameters after checking qualities of through holes.
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No.13070161-3
Drilling
(2) Positioning accuracy
Drill size
mm
Velocity
m/min
151
Spindle Speed
krpm
160
Chip load
micron/rev
20
φ0.30
Hit count
3000
0.15 Aluminum
Entry board
(lubricated is preferred)
Panel thickness
mm
0.8 ( #7628 X 4 )
Copper thickness
micron
Stack count
35 / 35
4
* No peck drilling
Positioning accuracy map of R-5775 and R-1766 as our conventional FR-4
R-5775
R-1766
0.1
0.1
0.05
0.05
0
0
-0.1
-0.05
0
0.05
0.1
-0.1
-0.05
0
0.05
0.1
-0.05
-0.05
-0.1
-0.1
positioning accuracy : 46.8 micron
positioning accuracy : 47.2 micron
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No.13070161-4
Laminate
Curing temperature time will be determined by the thickness of multilayer package being
laminated.
Laminate parameters should be adjusted depending on board thickness, stack count and
stack thickness etc.
Please Note : below is NOT a press control program. The graph represents the
recommended pressure/temperature profile of actual panels subjected to during the
lamination program cycle.
Points
1. Product temperature
-Product temperature should be kept at higher 185C for more than 75 minutes.
195C for 120 minutes is prefered
2. Press pressure
-It’s a guide line that Ramping up of pressure is started after 90C of material temp.
at the platen side and finished before 110C of material temp. at the platen side.
-3.0MPa in the case that ROR of material is 4.0C/min, 3.5MPa in the case of
3.0C/min and 4.0MPa in the case of 2.0C/min are guide lines.
* Pressure is optimized according to Circuit Pattern by our customers.
3. Vacuum
-Stop at 30minute from start (at 90-130C of material temp. at the platen side).
4. Cushion
-Cushion for Pressure evenness is needed. (Sheets of kraft paper etc.)
* It’s recommendable that Tg of PCBs by DSC is above 180C.
Product temp : over 185C 75min
↑
Product
Heat up rate 2.0 - 4.0C/min
110
100
90
Pressure (MPa)
Temperature ( C )
200
Pressure 3.0 – 4.0MPa
20
↑0.5MPa 20min
30
60
Time (min)
)
max. 100torr (13.3kPa) Vacuum : STOP at 30min from start (at 90 – 130C )
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No.13070161-5
Desmear
1) Permanganate Desmear
The weight loss of R-5775 laminate and R-5670 prepreg is less than that of R-1766 as our
conventional FR-4 material. Twice of FR-4 condition is recommendable.
Desmear parameters should be adjusted depending on board thickness, stack count and
stack thickness etc.
process
reagent type
temp. (C)
time (min)
Swelling
alkaline
65-85
5-10
Etching
permanganate
70-85
10-15
process
reagent type
temp. (C)
time (min)
Swelling
organic solvent
35-40
6-10
Etching
permanganate
70-85
10-15
Part number
Weight loss ratio
R-5775
0.2 - 0.4
R-1766
1.0
2) Plasma Desmear
Half time of FR-4 conditions is recommendable.
3) Combined Desmear for Hybrid construction with FR-4 materials
First, Plasma Desmear for the half time of FR-4 condition is done and Permanganate
Desmear without swelling process for the half time of FR-4 condition is done continuously.
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No.13070161-6
Finishing
•- Ag plating, Sn plating, Direct gold plating and OSP are good for R-5775.
-- If you use Ni plating like ENIG, baking or long time holding at room temperature
- (E.g. 5H at 150℃, 1week at room temperature) is needed before Ni plating.
- It depends on circuit pattern and conditions (circulation, bubbling etc.) of equipment, though.
++Before purchase++
* If delivery specifications have been agreed upon, descriptions in the delivery specifications
take precedence.
* Specifications and appearances are subject to change without prior notice for product
improvement.
* For details of the products contained in this catalog, contact your dealer or our sales
representative.
* ALL data are our actual values and not assured values.
Please Contact us of more
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Panasonic Corporation
Automotive & Industrial Systems Company
Electronic Materials Business Division
Circuit Board Materials Business Unit.
Head Office :1006 Kadoma. Kadoma. Osaka 571-8506
TEL: 81-6-6908-1101
http://industrial.panasonic.com/
Panasonic Corporation
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