English document

No.12102571
Process Guidelines
Laminate R-1755E
Prepreg R-1650E
High Reliability Glass Epoxy Multi-layer Materials
No. 12102571-1
General
Material Storage
R-1755E laminate and R-1650E prepreg is the same as our conventional FR-4 material.
Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the
laminate surface.
When possible store the laminate in the original container.
Prepreg should be stored flat in a cool dry controlled environment, 68 F(20 C) or less and
50% RH or less.
Laminate Surface Preparation
Regular Shiny Copper can be cleaned using industry standard chemical clean or
mechanical clean.
Reverse Treat Copper should be cleaned using industry standard chemical clean.
Inner Layer Bond Treatment
Black or Brown Oxide is not preferred.
Alternative Oxide Treatment using a Peroxide/Sulfuric etch technology can be used.
Drying
Dry finished inner layers completely to remove any absorbed moisture or surface moisture.
A racked bake at 225 F(105 C) for 20-30 minutes is preferred. For conveyorized
alternative oxide processing, some equipment may have sufficient drying capability.
However, a racked bake is suggested.
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No. 12102571-2
Drilling
(1) Drilling parameters in general condition
Drilling parameters should be adjusted depending on hole size, layer count, panel
thickness, stack count and stack height etc.
(1) Drilling parameters in general condition
min
max
diameter
spindle
velocity
infeed
chipload
infeed
chipload
mm
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
rpm
160,000
160,000
160,000
137,000
120,000
107,000
96,000
87,000
80,000
74,000
68,000
64,000
60,000
56,000
53,000
m/min
100
126
151
151
151
151
151
150
151
151
149
151
151
149
150
m/min
1.6
1.8
1.9
1.8
1.8
1.8
1.8
1.8
1.7
1.7
1.7
1.6
1.6
1.6
1.6
μ/rev
10
11
12
13
15
17
19
21
21
23
25
25
27
29
30
m/min
2.4
2.8
3.2
3.0
2.9
2.7
2.7
2.6
2.6
2.6
2.6
2.6
2.5
2.4
2.4
μ/rev
15
18
20
22
24
25
28
30
33
35
38
41
42
43
45
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
bit life
hits
1,000-2,000
1,000-2,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
2,000-3,000
No. 12102571-3
Drilling
(2)Positioning accuracy
(2) Positioning accuracy
Drill size
mm
0.3
Surface speed
m/min
151
Revolution
rpm
Chip load
micron/rev
Hit count
160000
20
5000
0.15 Aluminum
Entry board
(lubricated is preferred)
Panel thickness
mm
Copper thickness
micron
Stack count
1.6 ( #7628 X 8 )
35 / 35
2
Positioning accuracy map of R-1755E and R-1766 as our conventional FR-4
R-1755E
-0.100
-0.050
R-1766
0.100
0.100
0.050
0.050
0.000
0.000
0.050
0.100
-0.100
-0.050
0.000
0.000
-0.050
-0.050
-0.100
-0.100
positioning accuracy : 46.2 micron
0.050
0.100
positioning accuracy : 53.7 micron
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No. 12102571-4
Laminate
Curing temperature time will be determined by the thickness of multilayer package being
laminated.
Laminate parameters should be adjusted depending on board thickness, stack count and
stack thickness etc.
Please Note : below is NOT a press control program. The graph represents the
recommended pressure/temperature profile that the actual panels are subjected to during
the lamination program cycle.
Product temp : over 170C over 50min
200
↑
Product
130
Heat up rate ( 1 – 3C/min )
100
Pressure 2.0 - 2.9MPa
Ramping up of pressure is started
after 80 to 100C of material temp.
20
↑1.0MPa 20 - 30min
30
60
Time (min)
max. 100torr ( 13.3kPa ) Vacuum
: Start - 60min
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
Pressure (kg/cm2)
Temperature ( C )
180
No. 12102571-5
Desmear
The weight loss of R-1755E laminate and R-1650E prepreg is almost same as
that of R-1766 as our conventional FR-4 material.
Desmear parameters should be adjusted depending on board thickness, stack count and
stack thickness etc.
process
reagent type
temp. (C)
time (min)
Swelling
alkaline
65-85
5-10
Etching
permanganate
70-85
10-15
process
reagent type
temp. (C)
time (min)
Swelling
organic solvent
35-40
6-10
Etching
permanganate
70-85
10-15
Part number
Weight loss ratio
R-1755E
0.8 - 1.2
R-1766
1.0
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No. 12102571-6
++Before purchase++
* If delivery specifications have been agreed upon, descriptions in the delivery specifications
take precedence.
* Specifications and appearances are subject to change without prior notice for product
improvement.
* For details of the products contained in this catalog, contact your dealer or our sales
representative.
* ALL data are our actual values and not assured values.
Please Contact us of more
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Panasonic Corporation
Automotive & Industrial Systems Company
Electronic Materials Business Division
Circuit Board Materials Business Unit.
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Panasonic Corporation
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