TOLL – TO Leadless Infineon’s latest PowerMOS Package for High Current Automotive Electronics IFX ATV HP TOLL - Infineon’s latest PowerMOS Package for High Current Automotive Electronics Highest Current Capability - up to 300A Lowest Package Resistance for lowest RDSon Minimized Footprint Area and Height Reduced Package Inductances & Package Parasitics Improved Electro Migration / Solder Contact Area 01.10.2013 Copyright © Infineon Technologies 2013. All rights reserved. Page 2 TOLL - Infineon’s latest PowerMOS Package 40V Lead Product: IPLU300N04S4-R8 IPLU300N04S4-R8 Features: VBRDSS = 40V RDSon (max) = 0.77mOhm ID = 300A RthJC = 0.35K/W Package Footprint Area = 115mm² AOI capability included 100% lead-free AEC qualified TOLL Package = JEDEC registered 01.10.2013 Copyright © Infineon Technologies 2013. All rights reserved. Page 3 TOLL - Infineon’s latest PowerMOS Package Comparison of TOLL versus D²PAK 01.10.2013 IPLU300N04S4-R8 IPB180N04S4-00 Package TOLL D²PAK-7 pin Chip SFET4 40V SFET4 40V same chip size RDSon 0.77mOhm 0.98mOhm ID 300A 180A RthJC 0.35K/W 0.5K/W Footprint 115mm² 150mm² Copyright © Infineon Technologies 2013. All rights reserved. Page 4 TOLL - Infineon’s latest PowerMOS Package TOLL Replacing D²PAK 7Pin 01.10.2013 Footprint: 150mm² Footprint: 115 mm² Hight: 4.4mm Hight: 2.3mm 30% 50% 60% Footprint Height Space Reduction Reduction reduction Copyright © Infineon Technologies 2013. All rights reserved. Page 5 TOLL - Infineon’s latest PowerMOS Package Improved Reliability in High Current Applications D2PAK 7Pin Contact/Solder area D²PAK 7Pin: =2.65mm*0.6mm*5 = 7.95mm2 TO -Leadless Contact/Solder area TOLL: ~1.9mm*0.8mm*7+0.7mm*0.4mm*6 = 14mm2 Larger Contact Area Results in Lower Current Density, Thus Reducing Electro-Migration at High Current and Higher Temperature 01.10.2013 Copyright © Infineon Technologies 2013. All rights reserved. Page 6 TOLL - Infineon’s latest PowerMOS Package for Advanced Automotive Electronic Designs 60% Package Outline Reduction Up to 300A Current Capability Up to 30% Lower RDS(on) Automated Optical Inspection (AOI) Capability Improved EMI Behavior due to less parasitic Highest Reliability due to improved solder contact area Reduced System Costs and BOM due to less PCB area, less #Drivers, less #MOSFETs 01.10.2013 Copyright © Infineon Technologies 2013. All rights reserved. Page 7 TOLL - Infineon’s latest PowerMOS Package Technical Performance Advantages TO-Leadless D²PAK 7pin D²PAK Power Density Current Capability Thermal Performance Height Reliability 01.10.2013 Copyright © Infineon Technologies 2013. All rights reserved. Page 8 TOLL - Infineon’s latest PowerMOS Package 40V TOLL Product Portfolio Product Name max RDSon [mOhm] ID [A] LL/NL RthJC [K/W] Status IPLU300N04S4-R8 0.77 300 NL 0.35 Released IPLU300N04S4-1R1 1.1 300 NL 0.8 QS-available IPLU250N04S4-1R7 1.7 250 NL 0.5 QS-available 01.10.2013 Copyright © Infineon Technologies 2013. All rights reserved. Page 9 For internal use only