Nomenclature Guide TW Types TW aaaa bb - c d e f g# - h j k l PREFIX DEVICE NUMBER AT: Auto Wafer EP: Epi Wafer l - OPTIONS S = SLT B = Burn-in H = High Temp. Testing I = Industrial V = High Volt Testing T = Tape & Reel Packing c - PROCESS This character is included in the marking of legacy products only. PROCESS CODE TSMC, 0.35µm, Polycide, SPQM or SPTM Logic A TSMC, 0.25µm B X-FAB, 0.25µm C TSMC, 0.18µm D k - PACKAGE VARIANT PACKAGE VARIANT CODE This is only used when one product type is offered in 2 different sizes or lead counts of the same package style. The last FG# created will include the lead count. X-FAB, 0.18µm E TSMC, 0.18µm, EPI, Ar Anneal, Hi G Goyatek/Vanguard, 0.25µm H TSMC 0.25µm EPI, Ar Anneal, Hi J TSMC 0.18µm Automotive Process K TSMC 0.13µm M Drop-in heat spreader D TSMC 90nm N Exposed heat spreader E Fujitsu 90nm P Q Regular package without heat spreader R TSMC 0.13µm 12” Wafer TSMC 65nm R TSMC 45nm S 128 (lead count) j - PACKAGE TYPE C PACKAGE TYPE CODE h - PACKAGE TYPE B d - ASSEMBLY VENDOR This character is included in the marking of legacy products only. ASSEMBLY VENDOR ASEK ASECL GAPT i2a/IPAC, Quick Pak SPIL ChipMOS UTAC Fujitsu Amkor Korea CODE A B C D E G J K M PACKAGE TYPE Green (Halogen Free) and Lead Free package CODE G (Note) Normal package N Green (Halogen Free) and Lead Free package with Cu Bond Wires C Flip Chip F NOTE: The following FG’s also use Cu wire: TW6815-LA1-GR TW6816-LA1-GR TW6817-LA1-GR TW6818-LA1-GR TW6932-LA1-GR g# - DIE REVISION It starts from A1. If full layers are changed, the die revision changes like A1→B1→C1, etc. If some layers are changed, the die revision changes like A1→A2→A3, etc. eQ: 12” Wafer f - PACKAGE TYPE A PACKAGE TYPE CODE BGA package B LQFP package L PQFP package P TQFP package T QFN package N PQFP package with Exposed Heat Spreader E 12 www.intersil.com 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2013. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners