Nomenclature Guide HX Types H A 1 - 5134 A -2 96 Z PREFIX PART NUMBER FAMILY A: Analog C: Communications D: Digital I: Interface M: Memory V: Analog High Voltage SUFFIX 96: Tape and Reel Option for SOIC, PLCC X96: Tape and Reel Option for SOIC, PLCC EVAL: Evaluation Platform PERFORMANCE GRADE A, B: High Performance C: Relaxed Specification S: Very High Speed NOTE: Applies to HA, HD and HM products only. PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal (CERDIP) 1B: Ceramic Dual-In-Line Metal-Seal (SBDIP) 2: Can 3: Dual-In-Line Plastic (PDIP) 4: Ceramic Leadless Chip Carriers (CLCC) 4P: Plastic Leaded Chip Carrier (PLCC) 6: Narrow Dual-In-Line Plastic (PDIP) or Ceramic Dual-In-Line Frit-Seal (CERDIP) 7: 8 Lead Ceramic Dual-In-Line Frit-Seal (CERDIP) 9P: Small Outline Plastic (SOIC) 0: Chip NOTE: If the package designator is 2 characters the hyphen is omitted from the part number. PB-FREE OPTION Z: Pb-Free Product ZA: Pb-Free with Anneal TEMPERATURE RANGE -2: -55°C to +125°C -4: -25°C to +85°C -5: 0°C to +75°C -6: +25°C Chip Probe -7: Dash-7 High Reliability Commercial Product 0°C to +75°C, Includes 96 hour Burn-In -8: -55°C to +125°C Intersil Class B Equivalent Devices for use in Military and Flight Systems -9: -40°C to +85°C /883: Fully Compliant to MIL-STD-883, Class B/QML BXXXX: Customer Specific Screening RXXXX: Customer Specific Screening SXXXX: Customer Specific Screening HX, HXX Types H A PREFIX 4314B PART NUMBER FAMILY A: Analog C: Communications FA: Ultra-High Frequency Analog I: Data Acquisition, DSP Function-Specific V: Analog High Voltage 17 C B TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR A: Shrink Small Outline Plastic (SSOP) B: Small Outline Plastic (SOIC) D: Ceramic Dual-In-Line Metal-Seal (SBDIP) H: Plastic Small Outline Transistor (SOT) J: Ceramic Dual-In-Line Frit-Seal (CERDIP) L: Ceramic Leadless Chip Carrier (CLCC) M: Plastic Leaded Chip Carrier (PLCC) N: Thin Quad Flatpack (TQFP), or Metric Quad Flatpack (MQFP) Q: Metric Plastic Quad Flatpack (MQFP), or Plastic Quad Flatpack (PQFP) P: Dual-In-Line Plastic (PDIP) T: Can Y: Chip (Commercial Visual) W: Wafer Z 96 SUFFIX /883: Fully Compliant to MIL-STD-883 Class B/QML 96: Tape and Reel -T: Tape and Reel EVAL: Evaluation Platforms PB-FREE OPTION Z: Pb-Free Product ZA: Pb-Free with Anneal www.intersil.com 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners