Data Sheet

74LVC2G07-Q100
Buffers with open-drain outputs
Rev. 1 — 15 November 2013
Product data sheet
1. General description
The 74LVC2G07-Q100 provides two non-inverting buffers.
The output of this device is an open drain and can be connected to other open-drain
outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall
time.
This device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing the damaging backflow current through the device
when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Wide supply voltage range from 1.65 V to 5.5 V
 5 V tolerant input/output for interfacing with 5 V logic
 High noise immunity
 Complies with JEDEC standard:
 JESD8-7 (1.65 V to 1.95 V)
 JESD8-5 (2.3 V to 2.7 V)
 JESD8-B/JESD36 (2.7 V to 3.6 V)
 24 mA output drive (VCC = 3.0 V)
 CMOS low power consumption
 Latch-up performance exceeds 250 mA
 Direct interface with TTL levels
 Inputs accept voltages up to 5 V
 Multiple package options
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pf, R = 0 )
74LVC2G07-Q100
NXP Semiconductors
Buffers with open-drain outputs
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
74LVC2G07GW-Q100 40 C to +125 C
74LVC2G07GV-Q100
40 C to +125 C
Description
Version
SC-88
plastic surface-mounted package; 6 leads
SOT363
TSOP6
plastic surface-mounted package (TSOP6); 6 leads
SOT457
4. Marking
Table 2.
Marking
Type number
Marking code[1]
74LVC2G07GW-Q100
V7
74LVC2G07GV-Q100
V07
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
1
1A
1Y
1
1A
6
6
1Y
Y
3
2A
2Y
4
3
2A
mnb092
Fig 1.
Logic symbol
4
2Y
A
GND
mnb093
Fig 2.
IEC logic symbol
Fig 3.
mna591
Logic diagram (one driver)
6. Pinning information
6.1 Pinning
/9&*4
$
<
*1'
9&&
$
<
DDD
Fig 4.
Pin configuration SOT363 and SOT457
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6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
1A
1
data input
GND
2
ground (0 V)
2A
3
data input
2Y
4
data output
VCC
5
supply voltage
1Y
6
data output
7. Functional description
Table 4.
Function table[1]
Input nA
Output nY
L
L
H
Z
[1]
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
output voltage
VO
Conditions
VI < 0 V
[1]
VO < 0 V
[1]
Active mode
Min
Max
Unit
0.5
+6.5
V
50
-
mA
0.5
+6.5
V
50
-
mA
0.5
+6.5
V
0.5
+6.5
V
-
50
mA
supply current
-
100
mA
IGND
ground current
100
-
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
250
mW
Power-down mode
IO
output current
ICC
[1][2]
VO = 0 V to 6.5 V
Tamb = 40 C to +125 C
[3]
[1]
The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3]
For SC-88 and TSOP6 packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
74LVC2G07_Q100
Product data sheet
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9. Recommended operating conditions
Table 6.
Recommended operating conditions
Symbol
Parameter
VCC
Conditions
Min
Typ
Max
Unit
supply voltage
1.65
-
5.5
V
VI
input voltage
0
-
5.5
V
VO
output voltage
Active mode
0
-
5.5
V
Power-down mode; VCC = 0 V
0
-
5.5
V
Tamb
ambient temperature
40
-
+125
C
t/V
input transition rise and VCC = 1.65 V to 2.7 V
fall rate
VCC = 2.7 V to 5.5 V
-
-
20
ns/V
-
-
10
ns/V
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Tamb = 40 C to +85
VIH
VIL
VOL
Conditions
Min
VCC = 1.65 V to 1.95 V
Typ
Max
Unit
0.65  VCC -
-
V
C[1]
HIGH-level input
voltage
LOW-level input
voltage
LOW-level output
voltage
VCC = 2.3 V to 2.7 V
1.7
-
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
V
VCC = 4.5 V to 5.5 V
0.7  VCC
-
-
V
VCC = 1.65 V to 1.95 V
-
-
0.35  VCC V
VCC = 2.3 V to 2.7 V
-
-
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
V
VCC = 4.5 V to 5.5 V
-
-
0.3  VCC
V
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
0.10
V
IO = 4 mA; VCC = 1.65 V
-
-
0.45
V
IO = 8 mA; VCC = 2.3 V
-
-
0.30
V
IO = 12 mA; VCC = 2.7 V
-
-
0.40
V
IO = 24 mA; VCC = 3.0 V
-
-
0.55
V
IO = 32 mA; VCC = 4.5 V
-
-
0.55
V
-
0.1
5
A
VI = VIH or VIL
[2]
II
input leakage current VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
IOZ
OFF-state output
current
VI = VIH or VIL; VO = VCC or GND;
VCC = 5.5 V
-
0.1
10
A
IOFF
power-off leakage
current
VI or VO = 5.5 V; VCC = 0 V
-
0.1
10
A
ICC
supply current
VI = 5.5 V or GND; IO = 0 A;
VCC = 1.65 V to 5.5 V
-
0.1
10
A
ICC
additional supply
current
per pin; VI = VCC  0.6 V; IO = 0 A;
VCC = 2.3 V to 5.5 V
-
5
500
A
CI
input capacitance
-
2.5
-
pF
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Product data sheet
[2]
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Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
VCC = 1.65 V to 1.95 V
Typ
Max
Unit
0.65  VCC -
-
V
Tamb = 40 C to +125 C
HIGH-level input
voltage
VIH
LOW-level input
voltage
VIL
LOW-level output
voltage
VOL
VCC = 2.3 V to 2.7 V
1.7
-
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
V
VCC = 4.5 V to 5.5 V
0.7  VCC
-
-
V
VCC = 1.65 V to 1.95 V
-
-
0.35  VCC V
VCC = 2.3 V to 2.7 V
-
-
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
V
VCC = 4.5 V to 5.5 V
-
-
0.3  VCC
V
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
0.10
V
IO = 4 mA; VCC = 1.65 V
-
-
0.70
V
IO = 8 mA; VCC = 2.3 V
-
-
0.45
V
IO = 12 mA; VCC = 2.7 V
-
-
0.60
V
IO = 24 mA; VCC = 3.0 V
-
-
0.80
V
IO = 32 mA; VCC = 4.5 V
-
-
0.80
V
VI = VIH or VIL
II
input leakage current VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
-
-
20
A
IOZ
OFF-state output
current
VI = VIH or VIL; VO = VCC or GND;
VCC = 5.5 V
-
-
10
A
IOFF
power-off leakage
current
VI or VO = 5.5 V; VCC = 0 V
-
-
20
A
ICC
supply current
VI = 5.5 V or GND; IO = 0 A;
VCC = 1.65 V to 5.5 V
-
-
40
A
ICC
additional supply
current
per pin; VI = VCC  0.6 V; IO = 0 A;
VCC = 2.3 V to 5.5 V
-
-
5000
A
[1]
All typical values are measured at Tamb = 25 C.
[2]
These typical values are measured at VCC = 3.3 V.
74LVC2G07_Q100
Product data sheet
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11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 6.
Symbol Parameter
40 C to +85 C
Conditions
power dissipation
capacitance
CPD
Unit
Min
Max
Min
Max
VCC = 1.65 V to 1.95 V
1.0
3.5
6.7
1.0
8.4
ns
VCC = 2.3 V to 2.7 V
0.5
2.4
4.3
0.5
5.5
ns
VCC = 2.7 V
1.0
2.3
4.2
1.0
5.3
ns
VCC = 3.0 V to 3.6 V
0.5
2.6
3.7
0.5
4.7
ns
VCC = 4.5 V to 5.5 V
0.5
1.5
2.9
0.5
3.7
ns
-
6.5
-
-
-
pF
[2]
propagation delay nA to nY; see Figure 5
tpd
40 C to +125 C
Typ[1]
[3]
VI = GND to VCC; VCC = 3.3 V
[1]
Typical values are measured at Tamb = 25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.
[2]
tpd is the same as tPLZ and tPZL.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC2  fo) = sum of outputs.
12. Waveforms
VI
VM
nA input
VM
GND
t PLZ
t PZL
VCC
nY output
VM
VOL
VX
mna528
Measurement points are given in Table 9.
VOL is the typical output voltage level that occurs with the output load.
Fig 5.
The input (nA) to output (nY) propagation delays
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Table 9.
Measurement points
Supply voltage
Input
Output
VCC
VM
VM
VX
1.65 V to 1.95 V
0.5  VCC
0.5  VCC
VOL + 0.15 V
2.3 V to 2.7 V
0.5  VCC
0.5  VCC
VOL + 0.15 V
2.7 V
1.5 V
1.5 V
VOL + 0.3 V
3.0 V to 3.6 V
1.5 V
1.5 V
VOL + 0.3 V
4.5 V to 5.5 V
0.5  VCC
0.5  VCC
VOL + 0.3 V
VEXT
VCC
VI
RL
VO
G
DUT
RT
CL
RL
mna616
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 6.
Test circuit for measuring switching times
Table 10.
Test data
Supply voltage
Input
VCC
VI
tr, tf
CL
RL
tPZL, tPLZ
1.65 V to 1.95 V
VCC
 2.0 ns
30 pF
1 k
2  VCC
2.3 V to 2.7 V
VCC
 2.0 ns
30 pF
500 
2  VCC
2.7 V
2.7 V
 2.5 ns
50 pF
500 
6V
3.0 V to 3.6 V
2.7 V
 2.5 ns
50 pF
500 
6V
4.5 V to 5.5 V
VCC
 2.5 ns
50 pF
500 
2  VCC
74LVC2G07_Q100
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13. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT363
Fig 7.
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Package outline SOT363 (SC-88)
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Plastic surface-mounted package (TSOP6); 6 leads
D
SOT457
E
B
y
A
HE
6
5
X
v M A
4
Q
pin 1
index
A
A1
c
1
2
3
Lp
bp
e
w M B
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.1
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT457
Fig 8.
JEITA
SC-74
EUROPEAN
PROJECTION
ISSUE DATE
05-11-07
06-03-16
Package outline SOT457 (TSOP6)
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14. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MIL
Military
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC2G07_Q100 v.1
20131115
Product data sheet
-
-
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
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customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
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Limited warranty and liability — Information in this document is believed to
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Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVC2G07_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
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inclusion and/or use of NXP Semiconductors products in such equipment or
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Applications — Applications that are described herein for any of these
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representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 November 2013
© NXP B.V. 2013. All rights reserved.
11 of 13
74LVC2G07-Q100
NXP Semiconductors
Buffers with open-drain outputs
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74LVC2G07_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 November 2013
© NXP B.V. 2013. All rights reserved.
12 of 13
74LVC2G07-Q100
NXP Semiconductors
Buffers with open-drain outputs
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 November 2013
Document identifier: 74LVC2G07_Q100