513AP

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TLLGA12 4x4, 0.5P
CASE 513AP
ISSUE O
1
DATE 14 NOV 2011
SCALE 4:1
A B
D
PIN ONE
REFERENCE
0.10 C
2X
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
ÎÎ
ÎÎ
ÎÎ
DIM
A
A1
b
b1
D
D2
E
E2
e
L
TOP VIEW
0.10 C
GENERIC
MARKING DIAGRAM*
A
0.08 C
NOTE 4
C
A1
SIDE VIEW
SEATING
PLANE
XXXXXX
XXXXXX
ALYWG
G
D2
b1
1
6
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(*Note: Microdot may be in either location)
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
E2
12X
12
L
7
12X
e
e/2
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.50
0.60
0.00
0.05
0.20
0.30
0.35 REF
4.00 BSC
3.65
3.75
4.00 BSC
2.95
3.05
0.50 BSC
0.25
0.35
b
RECOMMENDED
SOLDERING FOOTPRINT*
0.10 C A B
0.05 C NOTE 3
3.80
PACKAGE
OUTLINE
3.06
12X
0.49
4.30
1
0.40
11X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON65540E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
TLLGA12, 4 X 4, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON65540E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY S. RAO
DATE
14 NOV 2011
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. O
Case Outline Number:
513AP