567MC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP8, 6.00x2.50 / EFCP6025−8EGJ−021
CASE 567MC
ISSUE O
SCALE 2:1
DATE 22 JUL 2015
D
PIN A1
REFERENCE
ÈÈÈÈ
ÈÈÈÈ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
B
DIM
A
b
b1
D
D1
D2
E
e
e1
L
E
0.05 C
2X
0.05 C
2X
TOP VIEW
A
C
SIDE VIEW
SEATING
PLANE
b
4X
e
e
0.05
D1
1
D2
2
3
4
MILLIMETERS
MIN
MAX
0.19
0.23
0.22
0.28
0.32
0.38
5.95
6.05
0.305 BSC
1.740 BSC
2.45
2.55
1.375 BSC
1.25 BSC
1.97
2.03
M
C A B
e1/2
e1
b1
C A B
4X
0.05
M
8
4X
0.05
M
7
6
RECOMMENDED
SOLDERING FOOTPRINT*
5
PACKAGE
OUTLINE
L
4X
1.375
C A B
1.375
1.74
0.25
BOTTOM VIEW
1.25
4X
0.35
1
4X
2.00
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON00386G
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP8, 6.00X2.50 / EFCP6025−8EGJ−021
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON00386G
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY H. INOTSUME.
DATE
22 JUL 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. O
Case Outline Number:
567MC