567MW

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP12, 1.376x1.025
CASE 567MW
ISSUE O
SCALE 4:1
DATE 20 NOV 2015
È
È
PIN A1
REFERENCE
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
A B
D
DIM
A
A1
A2
b
D
E
e
0.03 C
2X
0.03 C
2X
TOP VIEW
A2
0.05 C
A1
SIDE VIEW
NOTE 3
12X
GENERIC
MARKING DIAGRAM*
A
0.10 C
b
e
C
D
0.03 C
XXXX
ALYWG
G
SEATING
PLANE
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
e
0.05 C A B
e/2
C
B
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
A
1
2
MILLIMETERS
MIN
MAX
0.65
−−−
0.13
0.19
0.38 REF
0.17
0.23
1.376 BSC
1.025 BSC
0.35 BSC
3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
12X
0.35
PITCH
0.17
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON06764G
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
WLCSP12, 1.376X1.025
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON06764G
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. BLAUER.
DATE
20 NOV 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. O
Case Outline Number:
567MW
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