567LG

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP12, 1.60x1.20
CASE 567LG
ISSUE O
SCALE 4:1
DATE 10 FEB 2015
PIN A1
REFERENCE
ÈÈ
ÈÈ
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
A B
D
DIM
A
A1
b
D
E
e
0.08 C
2X
0.08 C
2X
TOP VIEW
GENERIC
MARKING DIAGRAM*
A
0.10 C
A1
XXXXXX
AYWW
0.05 C
NOTE 3
12X
C
SIDE VIEW
SEATING
PLANE
A
= Assembly Location
Y
= Year
WW = Work Week
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
e
b
e
0.05 C A B
0.03 C
MILLIMETERS
MIN
MAX
0.54
−−−
0.187
0.23
0.23
0.27
1.60 BSC
1.20 BSC
0.40 BSC
D
e/2
C
B
RECOMMENDED
SOLDERING FOOTPRINT*
A
1
2
A1
3
PACKAGE
OUTLINE
BOTTOM VIEW
12X
0.40
PITCH
0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON94952F
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
WLCSP12, 1.60X1.20
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON92747F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. HYLAND.
DATE
10 FEB 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. O
Case Outline Number:
567LG