English document

No.15111373
Process Guidelines
Laminate R-5735
Prepreg R-5630
High Speed, Low Loss Multi-layer Materials
No.15111373 -1
General
Material Storage
R-5735 laminate and R-5630 prepreg is the same as our conventional FR-4 material.
Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the
laminate surface.
When possible store the laminate in the original container.
Prepreg should be stored flat in a cool dry controlled environment, 73 F(23 C) or less and
50% RH or less.
Laminate Surface Preparation
Regular Shiny Copper can be cleaned using industry standard chemical clean or
mechanical clean.
Reverse Treat Copper should be cleaned using industry standard chemical clean.
Inner Layer Bond Treatment
Black or Brown Oxide can be used.
Alternative Oxide Treatment using a Peroxide/Sulfuric etch technology can be also used.
Drying
Dry finished inner layers completely to remove any absorbed moisture or surface moisture.
A racked bake at 300 F(150 C) for 1-2 hours is preferred. For conveyorized alternative
oxide processing, some equipment may have sufficient drying capability. However, a
racked bake is suggested.
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No.15111373 -2
Drilling
(1) Drilling parameters in general condition
Drilling parameters should be adjusted depending on hole size, layer count, panel
thickness, stack count and stack height etc.
(1) Drilling parameters in general condition
min
max
diameter
spindle
velocity
infeed
chipload
infeed
chipload
mm
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
rpm
160,000
160,000
160,000
137,000
120,000
107,000
96,000
87,000
80,000
74,000
68,000
64,000
60,000
56,000
53,000
m/min
100
126
151
151
151
151
151
150
151
151
149
151
151
149
150
m/min
1.6
1.8
1.9
1.8
1.8
1.8
1.8
1.8
1.7
1.7
1.7
1.6
1.6
1.6
1.6
μ/rev
10
11
12
13
15
17
19
21
21
23
25
25
27
29
30
m/min
2.4
2.8
3.2
3.0
2.9
2.7
2.7
2.6
2.6
2.6
2.6
2.6
2.5
2.4
2.4
μ/rev
15
18
20
22
24
25
28
30
33
35
38
41
42
43
45
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
bit life
hits
750-2,000
750-2,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
1,500-3,000
No.15111373 -3
Drilling
(2) Positioning accuracy
(2) Positioning accuracy
Drill size
mm
0.3
Surface speed
m/min
151
Revolution
rpm
160000
Chip load
micron/rev
20
Hit count
3000
0.15 Aluminum
(lubricated is preferred)
Entry board
Panel thickness
mm
0.76 ( #2116x2 + #2116x2 1oz/1oz + #2116x2 )
Copper thickness
oz
1/1
Stack count
4
Positioning accuracy map of R-5735 and R-5725.
R-5735
R-5725
positioning accuracy : 50.2 micron
positioning accuracy : 45.1 micron
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No.15111373 -4
Laminate
Curing temperature time will be determined by the thickness of multilayer package being
laminated.
Laminate parameters should be adjusted depending on board thickness, stack count and
stack thickness etc.
Please Note : below is NOT a press control program. The graph represents the
recommended pressure/temperature profile that the actual panels are subjected to during
the lamination program cycle.
above 200 C for over 80 min
Platen
temperature
↑
Product temperature
Heat up rate 3 ~ 4 C/min (100 C ~ 140 C)
◆ Heat up rate (100 C ~ 140 C)
<Recommended> 3 ~ 4 C/min
<Proper range>
2 ~ 4 C/min
110
80
Pressure 2.0 ~ 3.5 MPa
(Ramp up pressure during 80 C ~ 110 C)
20
0.5 MPa
30
60
90
Time (min)
)
Vacuum : 100 Torr (13.3 kPa) or less,
from start to over 60 min
( ~ around 160 C)
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
Pressure (MPa)
Temperature ( C )
200
No.15111373 -5
Desmear
The weight loss of R-5735 laminate and R-5630 prepreg is less than that of R-1766 as
our conventional FR-4 material and nearly same as R-5725.
Desmear parameters should be adjusted depending on board thickness, stack count and
stack thickness etc.
process
reagent type
temp. (C)
time (min)
Swelling
alkaline
65-85
5-10
Etching
permanganate
70-85
10-15
process
reagent type
temp. (C)
time (min)
Swelling
organic solvent
35-40
6-10
Etching
permanganate
70-85
10-15
Part number
Weight loss ratio
R-5735
0.3 - 0.7
R-5725
0.3 - 0.7
R-1766
1.0
The following guidelines are provided as general recommendations.
Process optimization may be necessary.
No.15111373 -6
++Before purchase++
* If delivery specifications have been agreed upon, descriptions in the delivery specifications
take precedence.
* Specifications and appearances are subject to change without prior notice for product
improvement.
* For details of the products contained in this catalog, contact your dealer or our sales
representative.
* ALL data are our actual values and not assured values.
Please Contact us of more
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Panasonic Corporation
Automotive & Industrial Systems Company
Electronic Materials Business Division
Circuit Board Materials Business Unit.
Head Office :1006 Kadoma. Kadoma. Osaka 571-8506
TEL: 81-6-6908-1101
http://industrial.panasonic.com/
Panasonic Corporation
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