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HALOGEN
High Current Power Inductors
HF
Pb
FREE
HCM1305 Series
Applications
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SMD Device
Description
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Halogen free
125°C maximum total operating temperature
13.8x 12.5 x 5.0mm maximum surface mount package
Powder Iron core material
Magnetically shielded, low EMI
High current carrying capacity, low core losses
Inductance range 0.22µH to 2.2µH
Current range from 20 to 110 Amps
Frequency range up to 5MHz
RoHS compliant
Voltage Regulator Module (VRM)
Multi-phase regulators
Desktop and server VRMs and EVRDs
Data networking and storage systems
Notebook regulators
Point-of-load modules
Base station equipment
Battery power systems
Graphics cards
Environmental Data
• Storage temperature range: -55°C to +125°C
• Operating temperature range: -55°C to +125°C
(ambient plus self temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 400 parts per 13” reel
Product Specifications
Part
6
Number
HCM1305-R22-R
HCM1305-R47-R
HCM1305-R56-R
HCM1305-R68-R
HCM1305-R82-R
HCM1305-1R0-R
HCM1305-1R5-R
HCM1305-2R2-R
1.
2.
3.
OCL1
FLL2 Min
Irms3
Isat4
DCR (mΩ)
DCR (mΩ)
± 20% (μH)
0.22
0.47
0.56
0.68
0.82
1.00
1.50
2.20
(μH)
0.14
0.30
0.36
0.44
0.52
0.64
0.96
1.41
(Amps)
51
38
36
34
31
29
23
20
@25°C (Amps)
110
65
55
53
52
50
48
32
@20°C Nominal
0.63
0.80
1.15
1.15
1.40
2.10
2.75
4.60
@20°C Maximum
0.72
0.92
1.33
1.33
1.61
2.42
3.16
5.29
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc @ 25°C.
Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat @ 25°C.
Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
4. Isat: Peak current for approximately 20% rolloff at +25°C.
5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p:
(Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak-to-peak ripple current in Amps).
6. Part Number Definition: HCM1305-xxx-R
- HCM1305 = Product code and size
- xxx= Inductance value in μH, R = decimal point
- “-R” suffix = RoHS compliant
Dimensions - mm
1010
BU-SB101160
Page 1 of 4
K-factor5
367
174
110
110
140
117
120
110
Data Sheet: 4371
Packaging Information - mm
Supplied in tape and reel packaging, 400 parts per 13” diameter reel.
Temperature Rise vs. Total Loss
50
45
40
Temperature Rise( °C)
35
30
25
20
15
10
5
0
0
0. 2
0. 4
0. 6
0. 8
1
1. 2
1. 4
Total Loss (W)
Core Loss
1010
BU-SB101160
Page 2 of 4
Data Sheet: 4371
1. 6
1. 8
2
2. 2
Inductance Characteristics
HCM1305-R22-R
90%
90%
% of OCL
80%
% of OCL
HCM1305-R47-R
100%
100%
70%
80%
70%
60%
60%
50%
50%
40%
40%
0
10
20
30
40
50
60
70
80
0
90 100 110 120 130 140 150
10
20
30
40
90%
90%
80%
80%
% of OCL
100%
% of OCL
100%
70%
60%
50%
50%
0
10
20
30
40
50
60
70
80
90
0
100
10
20
30
40
I
IDC (Amps)
HCM1305-R82-R
90
70
80
100
50
60
90
DC(Amps)
HCM1305-1R0-R
100%
100%
90%
90%
80%
80%
% of OCL
% of OCL
80
40%
40%
70%
70%
60%
60%
50%
50%
40%
40%
0
10
20
30
40
50
60
70
0
80
10
20
30
40
50
60
70
IDC (Amps)
IDC (Amps)
HCM1305-1R5-R
HCM1305-2R2-R
100%
100%
90%
90%
80%
80%
% of OCL
% of OCL
70
70%
60%
70%
70%
60%
60%
50%
50%
40%
40%
0
5
10
15
20
25
30
35
40
45
50
55
60
0
5
IDC (Amps)
BU-SB101160
60
HCM1305-R68-R
HCM1305-R56-R
1010
50
IDC (Amps)
IDC (Amps)
10
15
20
25
30
IDC (Amps)
Page 3 of 4
Data Sheet: 4371
35
40
45
50
55
Solder Reflow Profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Package
Thickness
<2.5mm
_2.5mm
>
TL
Preheat
A
Temperature
T smax
Table 1 - Standard SnPb Solder (Tc)
t
Volume
mm3
<350
235°C
220°C
Volume
mm3
_
>350
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
25°C
ts
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time 25°C to Peak
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
• Temperature max. (Tsmax)
150°C
200°C
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
© 2010 Cooper Bussmann
w w w. c o o p e r bu s s m a n n . c o m
1010
BU-SB101160
Page 4 of 4
Data Sheet: 4371
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