SC8 Package 8-Lead Plastic SC70 (Reference LTC DWG # 05-08-1639 Rev Ø) 0.30 MAX 0.50 REF PIN 8 1.80 – 2.20 (NOTE 4) 1.00 REF INDEX AREA (NOTE 6) 1.80 – 2.40 1.15 – 1.35 (NOTE 4) 2.8 BSC 1.8 REF PIN 1 RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 0.10 – 0.40 0.50 BSC 0.15 – 0.27 8 PLCS (NOTE 3) 0.80 – 1.00 0.00 – 0.10 REF 1.00 MAX GAUGE PLANE 0.15 BSC 0.26 – 0.46 0.10 – 0.18 (NOTE 3) NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE INDEX AREA 7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70 AND JEDEC MO-203 VARIATION BA SC8 SC70 0905 REV Ø