05-08-1639

SC8 Package
8-Lead Plastic SC70
(Reference LTC DWG # 05-08-1639 Rev Ø)
0.30
MAX
0.50
REF
PIN 8
1.80 – 2.20
(NOTE 4)
1.00 REF
INDEX AREA
(NOTE 6)
1.80 – 2.40 1.15 – 1.35
(NOTE 4)
2.8 BSC 1.8 REF
PIN 1
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.10 – 0.40
0.50 BSC
0.15 – 0.27
8 PLCS (NOTE 3)
0.80 – 1.00
0.00 – 0.10
REF
1.00 MAX
GAUGE PLANE
0.15 BSC
0.26 – 0.46
0.10 – 0.18
(NOTE 3)
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE INDEX AREA
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70 AND JEDEC MO-203 VARIATION BA
SC8 SC70 0905 REV Ø
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