UHE Package 42-Lead Plastic QFN (5mm × 6mm) (Reference LTC DWG # 05-08-1875 Rev Ø) 0.70 ± 0.05 4.70 ± 0.05 5.50 ± 0.05 4.10 ± 0.05 3.20 REF 3.70 ± 0.05 PACKAGE OUTLINE 0.20 ± 0.05 0.40 BSC 4.40 REF 5.10 ± 0.05 6.50 ± 0.05 PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ± 0.10 0.00 – 0.05 0.200 REF R = 0.10 TYP 3.20 REF 34 42 0.40 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 33 6.00 ± 0.10 1 4.40 REF 4.70 ± 0.10 3.70 ± 0.10 12 22 21 0.75 ± 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 13 (UHE42) QFN 0410 REV Ø 0.20 ± 0.05 R = 0.10 TYP 0.40 BSC BOTTOM VIEW—EXPOSED PAD 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE