05-08-1779

FE Package
38-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1779 Rev Ø)
Split Exposed Pad Variation AC
4.75 REF
9.60 – 9.80*
(.378 – .386)
4.75 REF
(.187)
38
20
0.45
6.60 ±0.10
4.50 REF
2.74 REF
2.38
(.094)
0.45
(.018)
REF
SEE NOTE 4
2.70
1.60
0.315 ±0.05
1.05 ±0.10
2.74
(.108)
REF
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.30 – 4.50*
(.169 – .177)
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.25
REF
1
2.70
(.106)
REF
19
1.60
(.063)
1.20
(.047)
MAX
0° – 8°
0.50
(.0196)
BSC
0.17 – 0.27
(.0067 – .0106)
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
0.05 – 0.15
(.002 – .006)
FE38 (AC) TSSOP REV Ø 0311
6.40
(.252)
BSC
Similar pages