CRM1206

MATERIAL DECLARATION SHEET
Material Number
CRM1206
Product Line
High power chip resistors
Compliance Date
7-27-2007
RoHS Compliant
Yes (Lead
Exemption)
No.
1
Construction
Element(subpart)
Ceramic
MSL
Homogeneous
Material
Substrate
1
Material
weight
[mg]
8.5880
Homogeneous
Material\
Substances
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Aluminum oxide
1344-28-1
96
81.946
Silicon dioxide
7631-86-9
4
3.414
CASRN
Magnesium oxide
1309-48-4
Subpart
mass of total
wt. (%)
85.36
2
Top conductor
Silver
0.1620
Silver
7440-22-4
100
1.610
1.610
3
Bottom conductor
Silver
0.0543
Silver
7440-22-4
100
0.540
0.540
Silver
7440-22-4
40
0.432
Ruthenium
dioxide
12036-10-1
20
0.216
Palladium
7440-05-3
15
0.162
Lead oxide glass
1317-36-8
25
0.270
4
Resistor
Headquarters Riverside CA
Ruthenium Oxide
0.1087
1.080
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MATERIAL DECLARATION
5
First encapsulating
Resin
Bismuth trioxide
1304-76-3
50
0.516
Resin
25036-25-3
30
0.31
Aluminum oxide
1344-28-1
10
0.103
Boron oxide
1303-86-2
10
0.103
Resin
25036-25-3
100
2.313
Silver
7440-22-4
85
1.978
Resin
9003-36-5
15
0.349
0.1038
6
Overcoat
Resin
0.2327
7
Side conductor
Silver
0.2341
1.032
2.313
2.327
8
Plating (Middle)
Nickel
0.1985
Nickel
7440-02-0
100
1.973
1.973
9
Plating (Outer)
Tin
0.3573
Tin
7440-31-5
100
3.551
3.551
Resin
25068-38-6
70
0.150
10
Marking
Resin
0.0215
Titanium dioxide
1317-80-2
30
0.064
Total weight
0.214
10.0609
This Document was updated on: 10/29/2010
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemption – 5 Lead in glass of ..., electronic components ...of Directive 2002/95/EC RoHS.
Headquarters Riverside CA
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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