05-08-1940

BGA Package
133-Lead (15mm × 15mm × 4.92mm)
(Reference LTC DWG # 05-08-1940 Rev Ø)
3.54
BSC
2.18
BSC
DETAIL A
Z
A
M
A2
aaa Z
SEE NOTES
L
K
J
H
G
F
E
D
C
B
7
A
12
3.29
BSC
11
b
A1
ccc Z
10
9
8.42
BSC
8
b1
MOLD
CAP
7
F
D
SUBSTRATE
6
0.27 – 0.37
5
// bbb Z
3.95 – 4.05
PIN “A1”
CORNER
4
DETAIL B
3
4
2
e
Øb (133 PLACES)
aaa Z
DETAIL B
PACKAGE SIDE VIEW
DETAIL A
6.9850
0.630 ±0.025 Ø 133x
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
SUGGESTED PCB LAYOUT
TOP VIEW
PIN 1
G
3
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
PACKAGE TOP VIEW
e
b
SEE NOTES
Y
E
6.9850
1
ddd M Z X Y
eee M Z
X
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.60
0.60
NOM
4.92
0.60
4.32
0.75
0.63
15.0
15.0
1.27
13.97
13.97
MAX
5.12
0.70
4.42
0.90
0.66
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 133
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 133 0213 REV Ø
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