TK Package 76-Lead Plastic TLA QFN (7mm × 7mm) (Reference LTC DWG # 05-08-1989 Rev B) 7.00 REF 0.3 ±0.05 0.45 REF 3.60 ±0.05 0.50 BSC 7.00 REF A* 0.125 0.9 0.6 *A = 3.60 ±0.05 0.25 ±0.05 0.125 0.45 REF 0.25 ±0.05 0.55 ±0.05 0.25 ±0.05 0.45 REF 0.55 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 7.00 ±0.10 (4 SIDES) 0.20 REF 0.78 ±0.05 0.375 REF 0.20 REF PIN 1 TOP MARK 0.45 REF 0.175 REF C0.20 0.50 BSC 3.60 ±0.10 0.45 REF 0.25 ±0.05 3.60 ±0.10 0.45 REF 0.30 ±0.05 0.45 REF NOTE: 1. DRAWING NOT TO SCALE 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6. 4 MIL THICK LASER CUT STENCIL IS RECOMMENDED. STENCIL OPENING 1:1 TO PCB LAND PATTERN. 0.50 BSC 0.25 ±0.05 BOTTOM VIEW—EXPOSED PAD (TK76) QFN 0815 REV B