Bourns RF Power Resistors Short Form Brochure

Bourns® RF Power Resistors
and Terminations
Short Form Brochure
Bourns® RF Power Resistors and Terminations
P
roducts which are delivered as flange mounted (see How
to Order) should be bolted onto a heat sink, (see
Figure 1) making sure that thermal grease is applied to
the bottom of the flange before installation. Both
the flange and heat sink should be perfectly
dry and clean of any oxidants before the
grease is brushed on. The thermal
Chip
grease will have a high thermal
TF
conductivity and will facilitate
the passage of heat between the
power resistor and the heat sink by
improving the contact between the two surface
Flange
areas.
Bourns recommends a torque of 0.6 Nm on the
Heat Sink
Figure 1
screws to ensure an optimum connection between
the flange and the heat sink.
Chip
The parts are designed to run at full power provided that the
temperature on the flange at the point marked by (TF) does
not exceed 110 °C. The temperature on the surface of the chip
Printed Circuit Board
should not exceed 180 °C as a rule.
Copper Well (4.5 mm) / Solder FIlled Vias
For chips which are delivered without a flange, the part must
Flange
be reflowed either onto a flange or a printed circuit board
(depending on the configuration of the terminals on the
resistor chip).
The circuit board should have either solder filled vias or a
Heat Sink
copper well underneath the pads which help to conduct heat
away from the chip. Bourns mounts its test PCB onto a flange
which in turn is fixed onto a heat sink. Bourns recommends
that the PCB temperature not exceed 100 °C at full load.
Figure 2
Product Selection Guide
Features
• Wide Range of Chip Sizes and Power Ratings
• Excellent Return Loss Over a Wide Range of Frequencies Up to 9 GHz
• Used in Broadcast, GSM, WCDMA, Wimax Transmitters
Resistance Values
Capacitance
Available (Ω±5 %)
(pF)
BeO
50, 100, 200
0.8
Combiner, Filter,
Divider, Coupler
1.2
ALN
50, 100
2.1
Combiner, Filter,
Divider, Coupler
4
1.2
BeO
50, 100
2.1
Combiner, Filter,
Divider, Coupler
20
4
1.2
AL203
50, 100
2.1
Combiner, Filter,
Divider, Coupler
CHF8838CNF500L
150
3
1.2
ALN
50
N/A
Combiner, Filter,
Divider, Coupler
CHF9838CNF
250
2.2
1.1
ALN
50
N/A
Combiner, Filter,
Divider, Coupler
CHF9838CBF
250
3
1.25
BeO
12.5, 25, 50, 100
4.1
Combiner, Filter,
Divider, Coupler
CHF12545CBF
500
1
1.1
BeO
50, 100
4.2
Combiner, Filter,
Divider, Coupler
CHF11050CBF500L
400
1
1.2
BeO
50
N/A
Combiner, Filter,
Divider, Coupler
CHF190104CBF
800
1
1.2
BeO
12.5, 25, 50, 100
14
Combiner, Filter,
Divider, Coupler
CHF1206CNT500LW
20
3
1.25
ALN
50
N/A
Drop In Isolator
CHF2525CNT
40
9
1.2
ALN
50
N/A
Drop In Isolator
CHF3523CNT
150
3
1.1
ALN
50
N/A
Drop In Isolator
CHF3523DNT500LW
100
6
1.2
ALN
50
N/A
Drop In Isolator
CHF2010CNP500L
10
2
1.2
ALN
50
N/A
Isolator, Coupler
CHF2010CNPXXXR
10
2
N/A
ALN
50, 100
0.14
Divider, Attenuator
CHF3725CNP500L
40
4
1.2
ALN
50
N/A
Isolator, Coupler
Flange Mounted
Power
Frequency
RF Power Resistors
(W)
(GHz)
CHF3020
10
CHF5225
VSWR
Substrate
4
1.35
60
4
CHF5225XBF
60
CHF5225XAF
Applications
Model
Surface Mount Chips
With Input Via External Lead
Model
Surface Mount Chips
With PCB Terminals
Model
Available Packages
(Dimensions in mm/inches)
Flange Mounted RF Power Resistors
Model
A
B
C
D
F
G
I
W
L
(Single Hole Style 1)
CHF3020
7.62 / (0.3)
5.08 / (0.20)
3.7 / (0.146)
2.57 / (0.101)
0.1 / (0.004)
2.54 / (0.1)
3.0 / (0.118)
1.0 / (0.039)
6.5 / (0.256)
CHF5225xA
13.1 / (0.52)
6.35 / (0.25)
2.57 / (0.101)
2.57 / (0.101)
0.1 / (0.004)
6.35 / (0.25)
3.0 / (0.118)
1.5 / (0.059)
6.5 / (0.256)
CHF5225xB
13.1 / (0.52)
6.35 / (0.25)
4.0 / (0.157)
2.57 / (0.101)
0.1 / (0.004)
6.35 / (0.25)
3.0 / (0.118)
1.5 / (0.059)
6.5 / (0.256)
CHF8838CNF500L
22.1 / (0.88)
9.53 / (0.38)
2.77 / (0.1089)
2.77 / (0.1089)
0.1 / (0.004)
6.35 / (0.25)
4.0 / (0.16)
1.5 / (0.059)
6.5 / (0.256)
CHF9838CBF
24.77 / (0.98)
9.53 / (0.38)
4.92 / (0.1937)
3.79 / (0.149)
0.1 / (0.004)
9.53 / (0.375)
3.5 / (0.1377)
3.0 / (0.116)
6.5 / (0.256)
CHF9838CNF
24.77 / (0.98)
9.53 / (0.38)
3.79 / (0.149)
3.79 / (0.149)
0.1 / (0.004)
9.53 / (0.375)
3.5 / (0.1377)
3.0 / (0.116)
6.5 / (0.256)
(Two Hole Style 2)
CHF12545
31.75 / (1.25) 12.7 / (0.500)
5.07 / (0.2)
4.2 / (0.165)
0.1 / (0.004)
12.7 / (0.5)
4.2 / (0.165)
1.5 / (0.059)
6.5 / (0.256)
CHF11050
27.94 / (1.1)
12.7 / (0.5)
6.0 / (0.236)
4.2 / (0.165)
0.1 / (0.004)
12.7 / (0.5)
4.31 / (0.17)
3.0 / (0.118)
6.5 / (0.256)
Model
A
B
D
F
G
I
J
0.1 / (0.004)
25.4 / (1.0)
4.2 / (0.165)
12.7 / (0.5)
C
W
L
(Four Hole Style 3)
CHF190104CBF
48.2 / (1.89)
26.4 / (1.039) 8.8 / (0.346) 7.7 / (0.303)
6.35 / (0.25) 9.0 / (0.354)
Surface Mount Chips
Model
B
D
G
M
N1
N2
N3
5.08 / (0.2)
0.9906 / (0.039)
2.54 / (0.1)
3.88 / (0.153)
0.76 / (0.03)
N/A
2.54 / (0.1)
With PCB Terminals
(Style 4)
CHF2010CNP500LX(W)
CHF2010CNPxxxRX(W)
5.08 / (0.2)
1.02 / (0.04)
2.54 / (0.1)
2.4 / (0.09)
0.76 / (0.03)
0.76 / (0.03)
2.3 / (0.09)
CHF3725CNP500LX(W)
9.39 / (0.37)
0.99 / (0.039)
6.35 / (0.25)
6.6 / (0.26)
1.27 / (0.05)
N/A
2.99 / (0.118)
Model
B
D
G
TD
TW
CHF1206CNT500LW
3.048 / (0.12)
0.635 / (0.025)
1.5748 / (0.062)
0.762 / (0.03)
1.5748 / (0.062)
CHF2525CNT500LX
6.35 / (0.25)
0.635 / (0.025)
6.35 / (0.25)
1.0 / (0.039)
1.2 / (0.047)
CHF3523CNT500LW
5.842 / (0.23)
0.9906 / (0.039)
8.89 / (0.35)
1.143 / (0.045)
3.302 / (0.13)
CHF3523DNT500LW
5.842 / (0.23)
0.9906 / (0.039)
8.89 / (0.35)
1.0 / (0.039)
1.8 / (0.071)
With Input Via External
Lead (Style 5)
How To Order
Available Packages
C
D
Tab at 0 ° (Version C)
A
Product Class
RF Power Resistor
G
Package Size
B
Examples:
Tab at 90 ° (Version D)
190104 = 1.9 x 1.04 Inches
I
L
CHF 3725 C N P 500 L X
Tab at 180 ° (Version E)
F
3725 = 0.37 x 0.25 Inches
Side View
2010 = 0.2 x 0.10 Inches
1206 = 0.12 x 0.06 Inches
W
Style 1 Two Hole Flanged Model
C
D
A
B
G
Version
For model CHF5225 please consult
“Available Packages, Style 1”
Substrate Material
A = Alumina (AL203)
F
N = Aluminium Nitride (ALN)
Side View
B = Beryllium Oxide (BeO)
I
L
W
Style 2 Two Hole Flanged Model
C
D
A
G
P = Chip With Terminals Suitable
for Reflow onto PCB
I
L
F
W
Style 3 Four Hole Flanged Model
Side View
G
D
N2
M
B
N3
Side View
Ground Plane
Style 4 Surface Mount Chip for PCB
G
12R5 = 12.5 Ohms
250 = 25 Ohms
500 = 50 Ohms
101 = 100 Ohms
L = Load
R = Resistor
Finish (Only for Chips)
D
TW
TD
Top
Resistance Value (Standard Tolerance ±5 %)
Function
N1
Top
F = Mounted on a Flange
T = Chip With Input Terminal Requiring
an External Lead or Tab
B
J
B
Application
Side View
Style 5 Surface Mount Chip with Input Via External Lead
X = Gold Plating
W = Tin Plating
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Phone
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+1-951-781-5500
Fax
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Non-Listed European
Countries:
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+41 (0)41 768 5510
Technical Assistance
Region
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Europe:
Americas:
Phone
+886 2 25624117
+41 (0)41 768 5555
+1-951-781-5500
Fax
+886 2 25624116
+41 (0)41 768 5510
+1-951-781-5700
www.bourns.com
Bourns® products are available through an extensive global network of representatives and distributors.
To obtain technical applications assistance, a quotation, or to place an order, contact a Bourns representative in your area.
Specifications subject to change without notice. Actual performance in specific customer applications may differ due to the
influence of other variables. Customers should verify actual device performance in their specific applications.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
COPYRIGHT© 2008, BOURNS, INC. • LITHO IN U.S.A. • PJ • 04/08 • 2M/SR0723
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