MATERIAL DECLARATION SHEET Material Number CHF8838CNF500L Product Line RF Power Resistors Compliance Date RoHS Compliant No. 1 2 June 01 2005 Yes Construction Element(subpart) Flange Chip MSL Homogeneous Material Carrier Ceramic Level 1 Material weight [g] 2.69 0.26 Homogeneous Material\ Substances Copper 24304-00-5 99.2 Material Mass % of total unit wt. 86.92 7440-02-0 0.8 0.70 2430400-5 96.6 8.18 7440-22-4 1.9 0.16 12036-10-1 0.7 0.06 1314-13-2 0.4 0.03 Epoxy 25068-38-2 0.4 0.03 7440-31-5 7440-22-4 7440-22-4 96.0 4.0 100 0.94 0.04 1.95 25068-38-2 100 0.98 Nickel Aluminum nitride Platinum Silver Ruthenium oxide Zinc oxide 3 Solder Solder 0.03 4 Tab Tab 0.06 Tin Silver Silver 5 Tab Protection Epoxy 0.03 Epoxy Total weight (g) CASRN if applicable Materials Mass % Subpart mass of total wt. (%) 87.62 8.47 0.98 1.95 0.98 3.07 This Document was updated on: November 5, 2008 Important remarks: Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2