2FAI-M16R

PL
IA
NT
Features
CO
M
■
*R
oH
S
■
■
■
■
Applications
Lead free as standard
RoHS compliant*
ESD protection
Protects up to eight data lines
Low insertion loss
■
■
■
Cell Phones
PDAs and Notebooks
GPS and SMART Cards
2FAI-M16R – Integrated Passive & Active Device using MLP
General Information
The 2FAI-M16R device, manufactured using Thin Film on
Silicon technology, provides ESD protection for the external
ports of portable electronic devices such as cell phones,
modems and PDAs.
I/O PADS
GROUND
PAD
The ESD protection provided by the component enables a
data port to withstand a minimum ±8 KV Contact /±15 KV Air
Discharge per the ESD test method specified in IEC 61000-4-2.
The device measures 3 mm x 3 mm and is intended to be
mounted directly onto an FR4 printed circuit board. The MLP
device meets typical thermal cycle and bend test specifications.
MLP
PACKAGE
E
T
E
L
O
S
B
O
Electrical & Thermal Characteristics
Electrical Characteristics
(T = 25 °C unless otherwise noted)
A
Resistance
Capacitance @ 2.5 V 1 MHz
Rated Standoff Voltage
Breakdown Voltage @ 1 mA
Forward Voltage @ 10 mA
Leakage Current @ 3 V
ESD Protection: IEC 61000-4-2
Contact Discharge
Air Discharge
Thermal Characteristics
Symbol
Minimum
Nominal
Maximum
Unit
R
180
200
220
Ω
C
16
20
24
pF
V
WM
V
BR
5.0
V
0.8
V
6.0
V
F
I
0.1
D
±8
±15
V
µA
kV
kV
(T = 25 °C unless otherwise noted)
A
DC Power Rating
P
Operating Temperature Range
T
Storage Temperature Range
T
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
100
mW
J
-40
25
+85
°C
STG
-55
25
+150
°C
2FAI-M16R – Integrated Passive & Active Device using MLP
Product Dimensions
Recommended Pad Layout
This silicon-based device is packaged using micro leadframe
packaging technology. The MLPs have an exposed die attach
pad that provides the interconnect medium from die to PCB.
The pads are arranged for easy PCB routing. The pitch is
0.5 mm and the dimensions for the packaged device are
shown below.
3.000
(0.1181)
FAI
B0412
0.700
(0.0276)
4.000
(0.1575)
0.750 ± 0.05
(0.0295 ± 0.0020)
E
T
E
L
O
S
B
O
3.000
(0.1181)
0.300
(0.0118)
1.000
(0.0394)
0.500
(0.0197)
How to Order
1.50
(0.059)
0.203 ± 0.025
(0.0079 ± 0.0010)
BSC
0.500
(0.0197)
0.230 ± 0.05
(0.009 ± 0.0020)
0.400 ± 0.05
(0.009 ± 0.0020)
2 FAI – M 16 R
Thin Film
Model
MLP Package
3.000
(0.1181)
No. of Solder Pads
Packaging Option
R = Tape and Reel
Packaged 3000 pcs. / 13 ˝ reel
1.55 ± 0.050
(0.061 ± 0.0020)
SQ.
(100 % Sn Termination)
0.300
X 45 °
(0.0118)
CHAMFER
3.000
(0.1181)
DIMENSIONS =
MILLIMETERS
(INCHES)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
2FAI-M16R – Integrated Passive & Active Device using MLP
Block Diagram
The MLP Device block diagram below includes the pin names and basic electrical connections associated with each channel.
EXT1
R1
INT1
EXT8
R8
GND
GND
EXT2
INT2
EXT7
INT7
E
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E
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B
O
R2
EXT3
R3
R7
INT3
EXT6
R6
GND
INT6
GND
EXT4
INT5
R4
GND
Frequency Response
INT8
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
EXT5
INT5
R5
2FAI-M16R – Integrated Passive & Active Device using MLP
Device Pin Out
The Pin-Out for the device is shown below. Note also that the device is shown with bottom side pads facing up.
EXT7 EXT8 INT8
INT7
12 11 10 9
EXT6
EXT5
EXT4
EXT3
13
14
15
16
8 INT6
7 INT5
6 INT4
5 INT3
1 2 3 4
EXT2 EXT1
Packaging
INT1 INT2
Pin Out Function Pin Out Function Pin Out Function
Pin1
EXT2
Pin5
INT3
Pin9
INT7
Pin2
EXT1
Pin6
INT4
Pin10
INT8
Pin3
INT1
Pin7
INT5
Pin11
EXT8
Pin4
INT2
Pin8
INT6
Pin12
EXT7
E
T
E
L
O
S
B
O
Pin Out Function
Pin13
EXT6
Pin14
EXT5
Pin15
EXT4
Pin16
EXT3
The surface mount product is packaged in a 12 mm x 8 mm Tape and Reel format per EIA-481 standard.
TOP SIDE VIEW
(INTO COMPONENT POCKET)
DIMENSIONS =
0.3 ± 0.05
(.01 ± .002)
(INCHES)
4.0 ± 0.1
(.16 ± .004)
1.5 ± 0.1/-0
(.06 ± .004/-0)
DIA.
2.0 ± 0.05
(.08 ± .002)
R
MILLIMETERS
1.75 ± 0.1
(.07 ± .004)
0.3
MAX.
(0.01)
0.9 ± 0.1
(.035 ± .004)
12.0 ± 0.3
(.47 ± .01)
3.4 ± 0.1
(.134 ± .004)
5.5 ± 0.3
(.22 ± .01)
3.4 ± 0.1
(.134 ± .004)
8.0 ± 0.3
(.31 ± .01)
ORIENTATION
OF COMPONENT
IN POCKET
R 0.25 TYP.
(0.010)
BACKSIDE FACING UP
Reliable Electronic Solutions
Asia-Pacific:
TEL +886- (0)2 25624117 • FAX +886- (0)2 25624116
Europe:
TEL +41-41 768 5555 • FAX +41-41 768 5510
The Americas: TEL +1-951 781-5492 • FAX +1-951 781-5700
www.bourns.com
2FAI-M16R REV. C 06/07
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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