AWF0000CE3

Chip Bead Array
Chip Bead Array
Type:
EXC28B
Discontinued
■ Features
■ Recommended Applications
●
●
●
●
● Small digital equipment such as PCs, printers, HDD,
DVD-ROMs, CD-ROMs, LCDs.
● Digital audio and video equipment such as DSC,
DVC, CD Players, DVD Players, MD Players.
● Electronic musical instruments, and other digital
equipment.
Space saving
SSOP package (0.5 mm pitch) compatibility
Small size and lightweight
RoHS compliant
Type: EXC28BB
● Suitable for high speed signals (over 50 MHz)
● Excellent cross talk characteristics (100 MHz:<-25 dB)
Type: EXC28BA
● Reduces waveform ringing noise
● Excellent cross talk characteristics (100 MHz:<-30 dB)
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
&
9
$
#
#
6
Product Code
Noise Filter
Chip size 1005 mm
x4 Array
Size
Multilayer
B Chip bead
Type Characteristics
Nominal Impedance
A Ringing Suppression Type
B High Speed Signal Type
■ Construction
12
Form
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Suffix
Code
Packing
U
Embossed Carrier Taping
■ Dimensions in mm (not to scale)
B
Ferrite Core
A
D
C
E
Inner Conductor
Electrode
Type
(inch size)
F
Dimensions (mm)
A
B
EXC28B
1.00±0.15 2.0±0.2
(0804)
C
D
E
F
0.5±0.1 0.20±0.15 0.5±0.1 0.25±0.10
Mass
(Weight)
[mg/pc.]
5.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Array
■ Ratings
Discontinued
Type
Part Number
BA
BB
Impedance
(Ω) at 100MHz
tol.(%)
EXC28BA121U
120
EXC28BA221U
220
EXC28BB121U
120
EXC28BB221U
220
Rated Current
(mA DC)
DC Resistance
(Ω) max.
0.5
±25
0.7
100
0.5
0.7
● Category Temperature Range –40 °C to +85 °C
■ Impedance Characteristics (Reference Data) Measured by HP4291A
● EXC28BB121U (2010)
400
400
350
350
300
300
| Z | ,R,X(?)
|Z | ,R,X(?)
● EXC28BA121U (2010)
250
200
150
Z
100
250
R
150
100
R
X
50
50
X
0
1
10
0
100
1000
Frequency(MHz)
1
10000
400
350
350
300
300
|Z| ,R,X(?)
400
Z
250
200
R
150
10
100
1000
Frequency(MHz)
10000
● EXC28BB221U (2010)
● EXC28BA221U (2010)
| Z| ,R,X(?)
Z
200
Z
R
250
200
150
100
100
X
50
50
X
0
0
1
10
100
1000
Frequency(MHz)
1
10000
훺Z훺 : Impedance
R : Resistance
10
100
1000
Frequency(MHz)
10000
X : Reactance
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Array
Discontinued
■ Circuit Configuration(No Polarity)
8
7
6
5
8
7
6
5
1
2
3
4
1
2
3
4
■ Packaging Methods (Taping)
● Standard Quantity
Part Number
Kind of Taping
Pitch (P1)
Quantity
EXC28B□□□□U
Embossed Carrier Taping
4 mm
5000 pcs./reel
● Embossed Carrier Taping
● Taping Reel
T
Compartment
f D0
fC
B
F
A
fB
E
Sprocket hole
W
t1
fD
E
P1
t2
P2
Chip component
P0
Tape running direction
fA
W
Embossed Carrier Dimensions (mm)
Part Number
A
B
W
EXC28B□□□□U 1.20±0.15 2.25±0.15 8.0±0.2
F
E
P1
P2
P0
3.5±0.1
1.75±0.10
4.0±0.1
2.0±0.1
4.0±0.1
0D0
t1
t2
1.5±0.1 0.25±0.05 0.90±0.15
Standard Reel Dimensions (mm)
Part Number
EXC28B□□□□U
0A
180
0
–3.0
0B
0C
0D
E
W
T
60.0±1.0
13.0±0.5
21.0±0.8
2.0±0.5
9.0±0.3
11.4±1.5
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
Chip Bead Array
Discontinued
■ Recommended Land Pattern Design
E
F
E
B
F
E
F
E
Dimension (mm)
1.4
B
1.75
C
0.4
D
A
C
D
A
D
0.5
E
0.25
F
0.25
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn-37Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 10 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temperature
Time
Preheating
150 °C to 170 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
● Flow soldering
· We do not recommend flow soldering , because flow soldering may cause bridges between the electrodes.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression
Device shown on this catalog.
1. Use rosin-based flux or halogen-free flux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to Chip Bead Array (hereafter called the bead arrays) or pinch them with a hard tool (e.g. pliers
and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress
may damage the bead arrays. Handle with care.
4. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to
60 %, where there are no rapid changes in temperature or humidity.
5. Use the bead arrays within half a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Nov. 2012
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