Chip Bead Array Chip Bead Array Type: EXC28B ■ Features ■ Recommended Applications ● ● ● ● ● Small digital equipment such as PCs, printers, HDD, DVD-ROMs, CD-ROMs, LCDs. ● Digital audio and video equipment such as DSC, DVC, CD Players, DVD Players, MD Players. ● Electronic musical instruments, and other digital equipment. Space saving SSOP package (0.5 mm pitch) compatibility Small size and lightweight RoHS compliant Type: EXC28BB ● Suitable for high speed signals (over 50 MHz) ● Excellent cross talk characteristics (100 MHz:<-25 dB) Type: EXC28BA ● Reduces waveform ringing noise ● Excellent cross talk characteristics (100 MHz:<-30 dB) ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 & 9 $ # # 6 Product Code Noise Filter Chip size 1005 mm x4 Array Size Multilayer B Chip bead Type Characteristics Nominal Impedance A Ringing Suppression Type B High Speed Signal Type ■ Construction 12 Form The first two digits are significant figure of impedance value and the third one denotes the number of zeros following Suffix Code Packing U Embossed Carrier Taping ■ Dimensions in mm (not to scale) B Ferrite Core A D C E Inner Conductor Electrode Type (inch size) F Dimensions (mm) A B EXC28B 1.00±0.15 2.0±0.2 (0804) C D E F 0.5±0.1 0.20±0.15 0.5±0.1 0.25±0.10 Mass (Weight) [mg/pc.] 5.2 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 39 Chip Bead Array ■ Ratings Type Part Number BA BB Impedance (Ω) at 100MHz tol.(%) EXC28BA121U 120 EXC28BA221U 220 EXC28BB121U 120 EXC28BB221U 220 Rated Current (mA DC) DC Resistance (Ω) max. 0.5 ±25 0.7 100 0.5 0.7 ● Category Temperature Range –40 °C to +85 °C ■ Impedance Characteristics (Reference Data) Measured by HP4291A ● EXC28BB121U (2010) 400 400 350 350 300 300 | Z | ,R,X(?) |Z | ,R,X(?) ● EXC28BA121U (2010) 250 200 150 Z 100 250 R 150 100 R X 50 50 X 0 1 10 0 100 1000 Frequency(MHz) 1 10000 400 350 350 300 300 |Z| ,R,X(?) 400 Z 250 200 R 150 10 100 1000 Frequency(MHz) 10000 ● EXC28BB221U (2010) ● EXC28BA221U (2010) | Z| ,R,X(?) Z 200 Z R 250 200 150 100 100 X 50 50 X 0 0 1 10 100 1000 Frequency(MHz) 1 10000 훺Z훺 : Impedance R : Resistance 10 100 1000 Frequency(MHz) 10000 X : Reactance Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 40 Chip Bead Array ■ Circuit Configuration(No Polarity) 8 7 6 5 8 7 6 5 1 2 3 4 1 2 3 4 ■ Packaging Methods (Taping) ● Standard Quantity Part Number Kind of Taping Pitch (P1) Quantity EXC28B□□□□U Embossed Carrier Taping 4 mm 5000 pcs./reel ● Embossed Carrier Taping ● Taping Reel T Compartment f D0 fC B F A fB E Sprocket hole W t1 fD E P1 t2 P2 Chip component P0 Tape running direction fA W Embossed Carrier Dimensions (mm) Part Number A B W EXC28B□□□□U 1.20±0.15 2.25±0.15 8.0±0.2 F E P1 P2 P0 3.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1 4.0±0.1 0D0 t1 t2 1.5±0.1 0.25±0.05 0.90±0.15 Standard Reel Dimensions (mm) Part Number EXC28B□□□□U 0A 180 0 –3.0 0B 0C 0D E W T 60.0±1.0 13.0±0.5 21.0±0.8 2.0±0.5 9.0±0.3 11.4±1.5 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 41 Chip Bead Array ■ Recommended Land Pattern Design E F E B F E F E Dimension (mm) 1.4 B 1.75 C 0.4 D A C D A D 0.5 E 0.25 F 0.25 ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. For soldering (Example : Sn-37Pb) Preheating Main heating Peak Temperature Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 10 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/3Ag/0.5Cu) Temperature Time Preheating 150 °C to 170 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Preheating Heating Time ● Flow soldering · We do not recommend flow soldering , because flow soldering may cause bridges between the electrodes. <Repair with hand soldering> ● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. ● Never touch this product with the tip of a soldering iron. Safety Precautions The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression Device shown on this catalog. 1. Use rosin-based flux or halogen-free flux. 2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person in advance. 3. Do not apply shock to Chip Bead Array (hereafter called the bead arrays) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the bead arrays. Handle with care. 4. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 5. Use the bead arrays within half a year after the date of the outgoing inspection indicated on the packages. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 42