Datasheet

Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
3.0SMC Series
RoHS
Pb
e3
Description
Uni-directional
The 3.0SMC series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter
Symbol
Value
Unit
Power Dissipation on Infinite Heat
Sink at TL=50OC
PD
6.5
W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 1)
IFSM
300
A
VF
3.5
V
TJ
-65 to 150
°C
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only
Operating Temperature Range
Storage Temperature Range
TSTG
-65 to 175
°C
Typical Thermal Resistance Junction
to Lead
RθJL
15
°C/W
Typical Thermal Resistance Junction
to Ambient
RθJA
75
°C/W
Notes:
1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
Functional Diagram
Bi-directional
Cathode
• For surface mounted
applications in order to
optimize board space
• Low profile package
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• IPP is specified @ 8/20µS
surge waveform
• Built-in strain relief
• VBR @ TJ= [email protected]°C
x (1+αT x (TJ - 25))
(αT:Temperature
Coefficient, typical value is
0.1%)
• Glass passivated chip
junction
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• High temperature to reflow
soldering guaranteed:
260°C/40sec
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD609A.01)
Anode
Uni-directional
Applications
Additional Infomarion
Datasheet
Resources
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Samples
TVS devices are ideal for the protection of I/O Interfaces,
VCC bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic
applications.
Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
Electrical Characteristics (T =25°C unless otherwise noted)
A
Breakdown
™
Maximum
TVSReverse
Diode Arrays
FamilyTest
of Products)
Voltage(SPA
V
Part
Number
(Uni)
Marking
3.0SMC20A
3.0SMC24A
3.0SMC28A
3.0SMC30A
3.0SMC33A
YLA
YLC
YLE
YLF
YLG
BR
Stand off
Voltage VR
(Volts)
MIN
MAX
Current
IT
(mA)
22.20
26.70
31.10
33.30
36.70
24.50
29.50
34.40
36.80
40.60
1
1
1
1
1
(Volts) @ IT
20.0
24.0
28.0
30.0
33.0
Clamping
Voltage VC
@ 8/20µS
Ipp (V)
42
51
59
62
70
Maximum Peak
Maximum
Pulse Current
Reverse
Ipp @ 8/20µS
Leakage IR @ VR
(A)
(µA)
570
520
470
420
365
1
1
1
1
1
I-V Curve Characteristics
Uni-directional
Vc VBR VR
V
IR VF
IT
Ipp
PPPM
VR
VBR
VC
IR
VF
Peak Pulse Power Dissipation -- Max power dissipation
Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
Reverse Leakage Current -- Current measured at VR
Forward Voltage Drop for Uni-directional
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Figure 2 - Peak Pulse Power Rating
1000
Voltage Transients
PPPM-Peak Pulse Power (KW)
TJ initial = Tamb
Voltage or Current
Voltage Across TVS
Current Through TVS
100
10
1
0.31x0.31" (8.0x8.0mm)
0.1
Copper Pad Area
0.001
Time
0.01
0.1
1
td-Pulse Width (ms)
10
continues on next page.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued)
A
TVS Diode Arrays (SPA™ Family
of Products)
Figure 4 - Pulse Waveform
Figure 3 - Peak Pulse Power Derating Curve
60
40
20
0
25
50
75
100 125 150
TJ - Initial Junction Temperature (ºC)
Uni-direconal V=0V
Uni-direconal V=VR
100
10
1
10
0 tr=8µS
td=20µS
Figure 6 - Typical Transient Thermal Impedance
10000
1
Half Value
t-Time (µS)
100000
Cj(pF)
50
175
Figure 5 - Typical Junction Capacitance
1000
100
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
1000
TP - Pulse Duration (s)
VBR - Reverse Breakdown Voltage(V)
Figure 7 - Maximum Non-Repetitive Peak Forward
Surge Current Uni-Directional only
Figure 8 - Peak Forward Voltage Drop vs Peak Forward
Current (Typical Values)
100.0
350
300
IF - Peak Forward Current(A)
IFSM - Peak Forward Surve Current(A)
tr= rise time to peak value
td= decaytime to half value
Waveform = tr x td
0
0
Peak
Value
100
IPP- Peak Pulse Current, % IPP
80
Transient Thermal Impedance (°C/W)
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage %
100
250
200
150
100
10.0
1.0
50
0
1
10
Number of Cycles at 60 Hz
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
100
0.1
0.0
1.0
2.0
3.0
VF - Peak Forward Voltage(V)
4.0
5.0
Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
Soldering Parameters
TVS Diode
Arrays (SPA™ Family of Products)
Lead–free
Reflow Condition
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus Temp (TA)
to peak
3°C/second max
TS(max) to TA - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TA) (Liquidus)
217°C
- Time (min to max) (ts)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Physical Specifications
tp
TP
Ramp-up
TL
Temperature (T)
Pre Heat
assembly
tL
Critical Zone
TL to TP
Ts(max)
Ramp-down
Ts(min)
ts
Preheat
25˚C
t 25˚C to Peak
Time (t)
Environmental Specifications
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Weight
0.007 ounce, 0.21 grams
Temperature Cycling
JESD22-A104
Case
JEDEC DO214AB. Molded plastic body
over glass passivated junction
MSL
JEDEC-J-STD-020, Level 1
Polarity
Color band denotes positive end
(cathode) except Bidirectional.
H3TRB
JESD22-A101
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102
RSH
JESD22-A111
Dimensions
DO-214AB (SMC J-Bend)
Dimensions
Cathode Band
C
A
B
H
D
F
E
J
G
K
L
I
Inches
Min
Millimeters
Max
Min
Max
A
0.114
0.126
2.900
3.200
B
0.260
0.280
6.600
7.110
C
0.220
0.245
5.590
6.220
D
0.079
0.103
2.060
2.620
E
0.030
0.060
0.760
1.520
F
-
0.008
-
0.203
G
0.305
0.320
7.750
8.130
H
0.006
0.012
0.152
0.305
I
0.129
-
3.300
-
J
0.094
-
2.400
-
K
-
0.165
L
0.094
-
4.200
2.400
-
Solder Pads
(all dimensions in mm)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
Part Numbering System
Part Marking System
3.0SMC XX A
F
Cathode Band
5% VBR VOLTAGE TOLERANCE
XXX
VR VOLTAGE
YMXXX
SERIES
Littelfuse Logo
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
Packaging Options
Part number
Component
Package
3.0SMCxxX
DO-214AB
Packaging
Option
Quantity
3000
Tape & Reel - 16mm tape/13” reel
Packaging
Specification
EIA STD RS-481
Tape and Reel Specification
0.157
(4.0)
0.47
(12.0)
Cathode
0.157
(4.0)
0.059 DIA
(1.5)
Cover tape
13.0 (330)
0.80 (20.2)
Arbor Hole Dia.
0.49
(12.5)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Dimensions are in inches
(and millimeters).
Direction of Feed