RN52 RN52 Bluetooth® Audio Module Features: • Fully qualified Bluetooth® version 3.0 module, • Fully compatible with Bluetooth version 2.1+EDR, 1.2, and 1.1 • Embedded Bluetooth profiles: A2DP, AVRCP, HFP/HSP and SPP • Audio decoders: SBC, AAC, aptX • Enhanced hands free voice capability narrowband and wideband codecs with cVc DSP • Software configurable through commands over UART console interface • Stereo analog differential audio output and input for highest quality audio • External Audio CODECs Supported via S/PDIF and I2S Interface • Integrated Amplifier for Driving 16Ω Speakers • Dedicated GPIO pins enable MCUs to access control and status functions efficiently • SPP data connection interface over UART • Supports wireless iAP profile advertising which is discoverable by iOS devices (iAP protocol implementation on an external host microcontroller required) • Certifications: FCC, IC, CE, Bluetooth SIG • Postage Stamp sized form factor: 13.5 x 26.0 x 2.7 mm • Castellated SMT pads for easy and reliable PCB mounting • Environmentally Friendly, RoHS Compliant • Bluetooth SIG QDID 58578 RN52 Block Diagram: RN52 2 LEDs PCB Antenna Speaker MIC Bluetooth 3.0 RF Baseband Speaker MIC Applications: • • • • • • • High-quality wireless stereo headsets Automotive hands free audio kits Wireless audio docking station for smartphones High-quality wireless speakers VoIP handsets Remote control for media player Medical data devices 2015 Microchip Technology Inc. Audio DSP 16-Bit Stereo CODEC UART USB I2S 16-Bit RISC MCU 11 GPIO Pins S/PDIF 16-MBit Flash 1 AIO DS70005120A-page 1 RN52 1.0 DEVICE OVERVIEW Microchip’s RN52 Bluetooth audio module provides a highly integrated solution for delivering high-quality stereo audio in a small form factor. It combines a class 2 Bluetooth radio with an embedded DSP processor. The module is programmed and controlled with a simple ASCII command set. The RN52 module complies with Bluetooth specification version 3.0. It integrates an RF radio and a baseband controller making it a complete Bluetooth subsystem. The RN52 supports a variety of profiles including A2DP, AVRCP, HSP/HFP, SPP and iAP. It provides a UART interface, several user programmable I/O pins, stereo speaker outputs, microphone inputs, digital audio interface and a USB port. Standard RN52 and its variants support A2DP, AVRCP, HFP, SPP and TABLE 1-1: iAP in the capacity of Bluetooth Slave role. RN52SRC supports A2DP, AVRCP, HFP in the capacity of Bluetooth Master role. RN52 supports wireless iAP profile advertising which is discoverable by iOS devices. An external host microcontroller is required to implement the iAP protocol and communicate with the authentication coprocessor while using the RN52 as a data pipe only to transfer the iAP protocol data over Bluetooth back and forth with the Apple device. A PIC® microcontroller can be used to implement the iAP protocol using the Microchip MFi Library. Table 1-1 provides the general specifications for the module. Table 1-2 and Table 1-3 provide the module’s weight, dimensions and electrical characteristics. GENERAL SPECIFICATIONS Specification Description Standard Bluetooth® 3.0, class 2 Frequency Band 2.4 ~ 2.48 GHz Modulation Method GFSK, PI/4-DQPSK, 8 DPSK Maximum Data Rate 3 Mbps RF Input Impedance 50 ohms Interface UART, GPIO, AIO, USB, I2S, S/PDIF, speaker, microphone Operation Range 10 meters (33 feet) Sensitivity -85 dBm at 0.1 % BER RF TX Power 4 dBm TABLE 1-2: WEIGHT AND DIMENSIONS Specification Description Dimensions 26.0 mm x 13.5 mm x 2.7 mm Weight 1.2 g TABLE 1-3: ELECTRICAL CHARACTERISTICS Specification Description Supply Voltage 3.0-3.6V DC Working current Depends on profiles, 30 mA typical Standby current (disconnected) < 0.5 mA Temperature -40ºC to +85ºC ESD JESD22-A224 class 0 product Humidity 10% ~ 90% non-condensing Figure 1-1 shows the module’s dimensions and Figure 1-2 shows recommended landing pattern and layout. DS70005120A-page 2 2015 Microchip Technology Inc. RN52 FIGURE 1-1: MODULE DIMENSIONS (Side View) 0.75 12.75 (Top View) 26.00 26.00 21.40 21.20 20.00 18.80 17.60 16.40 15.20 14.00 12.80 11.60 10.40 9.20 8.00 6.80 5.60 4.40 3.20 2.00 Tolerances: PCB Outline: +/- 0.13 mm PCB Thickness: +/- 0.100 mm 21.40 0.00 0.85 2.55 3.75 4.95 6.15 7.35 8.55 9.75 10.95 12.65 13.50 2.70 0.80 0.00 0.70 0.00 0.0 FIGURE 1-2: Dimensions are in millimeters RECOMMENDED PCB FOOTPRINT 3.25 4.65 6.05 7.45 8.85 10.25 (Top View) 0.8mm 1.6mm 26.00 21.40 20.70 21.20 20.00 18.80 17.60 16.40 15.20 14.00 12.80 11.60 10.40 9.20 8.00 6.80 5.60 4.40 3.20 2.00 Host Ground Plane Edge (See Mounting Details) Ground Pads 0.8 x 1.0 mm 0.80mm 0.00 0.85 2.55 3.75 4.95 6.15 7.35 8.55 9.75 10.95 12.65 13.50 0.0 Dimensions are in millimeters Figure 1-3 shows the pinout and Table 1-4 describes the module’s pins. 2015 Microchip Technology Inc. DS70005120A-page 3 RN52 FIGURE 1-3: TABLE 1-4: Pin PIN DIAGRAM PIN DESCRIPTION(1) (SHEET 1 OF 3) Symbol I/O Type Description Directio n Defau lt 1 GND Ground. Ground. 2 GPIO3 Digital Driving this pin high during bootup will put the module in Device Firmware Update (DFU) mode. The device will enter DFU mode in 3 seconds. The pin should only be asserted high before the device enters DFU mode and not after. (USB device powers VBUS. PIO3 requires 47K to ground and 22K to USB VBUS if USB VBUS is supplying power to the main board.) During runtime, if the pin is driven high, the device will reset and reboot. Note: Device will reset within 500 ms after the IO is driven high. A reset pulse of 100 ms is recommended. If IO continues to be driven high after reset, the device will naturally enter DFU mode. The device will enter DFU mode in 3 seconds. Input Low 3 GPIO2 Digital Reserved, event indicator pin. A microcontroller can enter Command mode and poll the state register using the Q action command Output High 4 AIO0 Bidirectional Analog programmable input/output line DS70005120A-page 4 I/O 2015 Microchip Technology Inc. RN52 TABLE 1-4: Pin PIN DESCRIPTION(1) (SHEET 2 OF 3) Symbol I/O Type Description Directio n Defau lt Input Low 5 GPIO4 Digital Factory Reset mode. To reset the module to the factory defaults, GPIO4 should be high on power-up and then toggle low, high, low, high with a 1 second wait between the transitions. During runtime, the module will enter voice command mode if this pin is driven low. Reserved. Not available for reconfiguring as a general purpose IO pin. 6 GPIO5 Bidirectional with programmable strength internal pull-up/down Programmable I/O I/O High 7 GPIO12 Bidirectional with programmable strength internal pull-up/down Programmable I/O I/O High 8 GPIO13 Bidirectional with programmable strength internal pull-up/down Programmable I/O I/O High 9 GPIO11 Bidirectional with programmable strength internal pull-up/down Programmable I/O I/O High 10 GPIO10 Bidirectional with programmable strength internal pull-up/down Programmable I/O I/O High 11 GPIO9 Digital When you drive this signal low, the module’s UART goes into Command mode. If this signal is asserted high, the UART is in Data mode. Reserved Input High 12 USBD- Bidirectional USB data minus I/O 13 USBD+ Bidirectional USB data plus with selectable internal 1.5 Kohm pull-up resistor I/O 14 UART_RTS CMOS output, tri-state, with UART request to send active low weak internal pull-up 15 UART_CTS CMOS input with weak internal pull-down 16 UART_TX CMOS output, tri-state, with UART data output weak internal pull-up 17 UART_RX CMOS input with weak internal pull-down UART data input 18 GND Ground Ground 19 GPIO7 Bidirectional with programmable strength internal pull-up/down Driving this pin low sets the UART baud rate to 9,600. By default, the pin is high with a baud rate of 115,200 I/O High 20 GPIO6 Bidirectional with programmable strength internal pull-up/down Programmable I/O I/O High 21 PWREN Analog Pull high to power up RN52 Input Low 22 VDD 3.3-V power input 3.3V power input 23 PCM_IN CMOS input, with weak internal pull down Synchronous data input, configurable for SPDIF_IN or SD_IN (I2S) 2015 Microchip Technology Inc. UART clear to send active low Output Input Output Input Input DS70005120A-page 5 RN52 TABLE 1-4: Pin PIN DESCRIPTION(1) (SHEET 3 OF 3) Symbol 24 PCM_OUT 25 26 I/O Type Synchronous data output, configurable for SPDIF_OUT or SD_OUT (I2S) Output PCM_SYNC Bidirectional with weak internal pull down Synchronous data sync; WS (I2S) Output PCM_CLK CMOS input, with weak internal pull down Synchronous data clock; SCK (I2S) Output 27 GND Ground Ground 28 SPI_SS CMOS input with weak internal pull-up Chip select for Synchronous Serial Interface active low 29 SPI_MISO CMOS output, tri-state, with Serial Peripheral Interface (SPI) output weak internal pull-down 30 SPI_CLK Input with weak internal pull-down SPI clock Input 31 SPI_MOSI CMOS input, with weak internal pull-down SPI input Input 32 LED1 Open drain output Drives an LED. For the RN-52-EK Board, this signal drives the red LED Output 33 LED0 Open drain output Drives an LED. For the RN-52-EK Board, this signal drives the blue LED Output 34 MIC_BIAS Analog Microphone bias Output 35 MIC_L+ Analog Microphone input positive, left Input 36 MIC_R+ Analog Microphone input positive, right Input 37 MIC_L- Analog Microphone input negative, left Input 38 MIC_R- Analog Microphone input negative, right Input 39 AGND Analog Ground connection for audio 40 SPK_R- Analog Speaker output negative (right side) Output 41 SPK_L- Analog Speaker output negative (left side) Output 42 SPK_R+ Analog Speaker output positive (right side) Output 43 SPK_L+ Analog Speaker output positive (left side) Output 44 GND Ground Ground 45 GND Ground RF ground 46 GND Ground RF ground 47 GND Ground RF ground 48 GND Ground RF ground 49 GND Ground RF ground 50 GND Ground RF ground Note 1: 2: CMOS output, with weak internal pull down Directio n Description Defau lt Input Output All GPIO pins default to input with weak pull-down. Refer to the “Bluetooth Audio Module Command Reference User’s Guide” (DS50002154) and the “RN52SRC Bluetooth Audio Module Command Reference User’s Guide” (DS50002343) for more information about the behavior of the pin and optional features that can be enabled. DS70005120A-page 6 2015 Microchip Technology Inc. RN52 1.1 1.1.1 Audio Interface Circuit Description DIGITAL AUDIO INTERFACE • Analog audio interface with differential audio inputs and outputs • Digital audio interface with configurable S/PDIF and I2S interface (A2DP audio output only) The stereo audio CODEC interface has a digital audio interface. It supports the I2S and S/PDIF interfaces. The RN52 I2S interface is I2S Master and provides the bit clock and phase sync clock. The I2S or S/PDIF interface can be configured through command console. The typical application interface can be seen in Figure 1-4. The audio input circuitry has a dual audio input that can be configured as single-ended or fully differential and programmed for microphone or line input. It has an analog and digital programmable gain stage so that it can be optimized for different microphones. See Figure 1-5. The audio resolution supported is 24-bit and the max channel size is 32-bit. The supported sample rates are 8KHz, 32KHz, 44.1KHz and 48KHz. The audio resolution and the sample rate can be configured using the UART console command. Refer the RN52 command specification for more information. The RN52 audio interface circuit consists of: FIGURE 1-4: I2S AND SPDIF CONNECTIONS DAC/ADC/CODEC/DSP I2S SLAVE RN52 I2S MASTER SDOx SDIx SDIx SDOx SCKx Serial Clock SCKx SSx SSx Frame Sync. Pulse DAC/ADC/CODEC/DSP S/PDIF RN52 S/PDIF GND S/PDIF OUT S/PDIF IN VDD 1.1.2 ANALOG AUDIO INTERFACE The audio input circuitry has a dual audio input that can be configured as single-ended or fully differential and programmed for microphone or line input. It has an analog and digital programmable gain stage so that it can be optimized for different microphones. The microphone inputs MIC_L+, MIC_L-, MIC_R+ and MIC_Rare shown in Figure 1-6. GND S/PDIF IN S/PDIF OUT VDD IN The audio output circuitry consists of a differential speaker output preceded by a gain stage and a class AB amplifier. The speaker outputs SPK_L+, SPK_L-, SPK_R+ and SPK_R- are shown in Figure 1-6. The fully differential architecture in the analog signal path results in low noise sensitivity and good power supply rejection while effectively doubling the signal amplitude. It operates from a 1.5V single power supply and uses a minimum of external components. The typical application interface is shown in Figure 1-5. 2015 Microchip Technology Inc. DS70005120A-page 7 RN52 FIGURE 1-5: RN52 AUDIO INTERFACE BLOCK DIAGRAM System Mainboard RN52 SPK_L+ SPK_L- Audio PA SPK_R+ SPK_RS/PDIF & I2S MIC_L+ MIC_L- MIC & Bias MIC_R+ MIC_RMIC_BIAS FIGURE 1-6: STEREO CODEC AUDIO INPUT/OUTPUT STAGES Input Amplifier MIC_L+ RN52 ΣΔ-ADC MIC_LOutput Amplifier LP Filter SPK_L+ DAC SPK_LDigital Circuitry Input Amplifier MIC_R+ ΣΔ-ADC MIC_ROutput Amplifier SPK_R+ LP Filter DAC SPK_R- DS70005120A-page 8 2015 Microchip Technology Inc. RN52 1.1.3 ANALOG-TO-DIGITAL CONVERTER (ADC) The ADC consists of two second-order sigma delta (SD) converters, resulting in two separate channels with identical functionality. Each ADC supports the following sample rates: • • • • • The ADC analog amplifier is a two-stage amplifier. The first stage selects the correct gain for either microphone or line input. See Figure 1-7. 8 kHz 16 kHz 32 kHz 44.1 kHz 48 kHz FIGURE 1-7: ADC ANALOG AMPLIFIER BLOCK DIAGRAM Bypass or 24-dB Gain -3 to 18 dB Gain P – – P N + + N Line Mode/Microphone Mode 1.1.4 DIGITAL-TO-ANALOG CONVERTER (DAC) The DAC consists of two third-order SD converters, resulting in two separate channels with identical functionality. Each DAC supports the following sample rates: • • • • • 8 kHz 16 kHz 32 kHz 44.1 kHz 48 kHz 1.1.4.1 Speaker Output Gain 0:7 1.1.4.2 Microphone Input The RN52 audio input is intended for use from 1 μA at 94 dB SPL to about 10 μA at 94 dB SPL, which requires microphones with sensitivity between –40 and –60 dBV. The RN52 microphone mode input impedance is typically 6 kohm. The line mode input impedance is typically between 6 kohm and 30 kohm. The overall gain of the microphone input is approximately -3 dB to 42 dB in 1.5 dB steps. MIC_BIAS requires a minimum load to maintain regulation. MIC_BIAS maintains regulation within 0.199 and 1.229 mA. Therefore, if you use a microphone with specifications below these limits, the microphone output must be pre-loaded with a large value resistor to ground. The speaker output is capable of driving a speaker with an impedance of at least 8 ohms directly. The overall gain of the speaker output is approximately -21 dB to 0 dB in 1.5 dB steps. 2015 Microchip Technology Inc. DS70005120A-page 9 RN52 TABLE 1-5: DIGITAL TO ANALOG CONVERTER Parameter Conditions Min Typ Max Unit — — — 16 Bits 8 — 48 kHz — 95 — dB Resolution Ouput Sample Rate, Fsample Signal to Noise Ratio, SNR — fin = 1 kHz B/W = 20 Hz→20 kHz A-Weighted THD+N < 0.01% 0dBFS signal Load = 100 kΩ Analog Gain Fsample 8 kHz — 95 — dB 16 kHz — 95 — dB 32 kHz — 95 — dB 44.1 kHz — 95 — dB 48 kHz — 95 — dB 0 — -21 dB — 750 — mV rms 16(8) — O.C. Ω Analog Gain Resolution = 3 dB Output voltage full-scale swing (differential) Allowed Load Resistive — — 500 pF THD + N 100 kΩ load Capacitive — — 0.01 % THD + N 16 kΩ load — — 0.1 % SNR (Load = 16Ω, 0 dBFS input relative to digital silence) — 95 — dB Conditions Min Typ Max Unit Resolution — — — 16 Bits Input Sample Rate, Fsample — 8 — 44.1 kHz 8 kHz — 79 — dB 16 kHz — 76 — dB 32 kHz — 75 — dB — 75 — dB — — 42 dB TABLE 1-6: ANALOG TO DIGITAL CONVERTER Parameter Signal to Noise Ratio, SNR fin = 1 kHz B/W = 20 Hz→20 kHz A-Weighted THD+N < 1% 150 mVpk-pk input Fsample 44.1 kHz Analog Gain Analog Gain Resolution = 3 dB Input full scale at maximum gain (differential) — 4 — mV rms Input full scale at minimum gain (differential) — 800 — mV rms 3 dB Bandwidth — 20 — kHz Microphone mode input impedance — 6.0 — kΩ THD + N (microphone input) @ 30 mV rms input — 0.04 — % DS70005120A-page 10 2015 Microchip Technology Inc. RN52 1.2 General Purpose IO (GPIO) Ports User programmable bidirectional GPIO ports are provided. The GPIO ports can be used as typical digital IO ports. The directionality of the GPIOs can be configured through console commands. The GPIOs can also be read or asserted using the console commands. The digital input and output voltage levels are provided in Table 1-7. TABLE 1-7: DIGITAL INPUT AND OUTPUT VOLTAGE LEVELS Voltage Information Min Typ Max Unit VIL input logic level low -0.3 — 0.25 x VDD V VIH input logic level high 0.625 x VDD — VDD + 0.3 V 0 — 0.125 V 0.75 x VDD — VDD V Input Voltage Levels Output Voltage Levels VOL output logic level low, Iol = 4.0 mA VOH output logic level high, IOH = -4.0 mA 2015 Microchip Technology Inc. DS70005120A-page 11 RN52 1.3 Power Consumption The power consumption of the RN52 for various connection states are provided in Figure 1-8. TABLE 1-8: POWER CONSUMPTION Role Connection Audio Packet Type Description Current (mA) — Stand-by — Active connection 0.07 — Page Scan — Interval = 1280 ms 0.5 — Inquiry and Page Scan — Inquiry scan = 1280 ms Page scan = 1280 ms 0.88 RN52 A2DP ACL No Traffic 15 RN52 A2DP ACL Audio stream RX 21 RN52 A2DP ACL Sniff = 40 ms 1.7 RN52 A2DP ACL Sniff = 1280 ms 0.26 RN52 HFP eSCO-EV3 — 26 RN52 HFP eSCO-EV3 Setting S1 27 RN52 HFP eSCO-2EV3 Setting S2 28 RN52 HFP eSCO-2EV3 Setting S3 25 RN52 HFP eSCO-EV5 — 22 RN52 HFP SCO-HV1 — 42 RN52 HFP SCO-HV3 — 28 RN52 HFP SCO-HV3 Sniff = 30 ms 22 RN52SRC A2DP ACL No traffic 4.4 RN52SRC A2DP ACL Audio stream TX 9.2 RN52SRC A2DP ACL Sniff = 40 ms 1.9 RN52SRC A2DP ACL Sniff = 1280 ms 0.2 RN52SRC HFP eSCO-EV3 — 24 RN52SRC HFP eSCO-EV3 Setting S1 23 RN52SRC HFP eSCO-2EV3 Setting S2 22 RN52SRC HFP eSCO-2EV3 Setting S3 17 RN52SRC HFP eSCO-EV5 — 17 RN52SRC HFP SCO-HV1 — 42 RN52SRC HFP SCO-HV3 — 23 RN52SRC HFP SCO-HV3 Sniff = 30 ms 22 DS70005120A-page 12 2015 Microchip Technology Inc. RN52 2.0 APPLICATIONS 2.1 The following sections provide information on designing with the RN52 module, including restoring factory defaults, using the LED interface, minimizing radio interference, solder reflow profile, typical application, etc. FIGURE 2-1: Minimizing Radio Interference When laying out the host PCB for the RN52 module, the areas under the antenna and shielding connections should not have surface traces, ground planes or exposed via (see Figure 2-1). For optimal radio performance, the RN52 module’s antenna end should protrude at least 31 mm beyond any metal enclosure. Figure 2-2 shows examples of good, bad, and acceptable positioning of the RN52 on the host PCB. MINIMIZING RADIO INTERFERENCE (Top View) 31 mm Keep area around antenna (approximately 31 mm) clear of metallic structures for best performance 31 mm Edge of Ground Plain 4.6 mm 21.4 mm Dimensions are in millimeters FIGURE 2-2: PCB EXAMPLE LAYOUT RN52 Good RN52 Bad 2015 Microchip Technology Inc. RN52 RN52 Acceptable Acceptable DS70005120A-page 13 RN52 2.2 FIGURE 2-4: LED Interface The RN52 includes two pads dedicated to driving the LED indicators. The firmware can control both terminals, and the battery charger can set LED0. The terminals are open-drain outputs; therefore, the LED must be connected from a positive supply rail to the pad in series with a current limiting resistor. You should operate the LED pad (LED0 or LED1 pins) with a pad voltage below 0.5V. In this case, the pad can be thought of as a resistor, RON. The resistance, together with the external series resistor, sets the current, ILED, in the LED. The current is also dependent on the external voltage, VDD, as shown in Figure 2-3. FIGURE 2-3: USB DFU PORT AND GPIO3 SCHEMATIC C4 GPIO3 R1 10nF 22k USBDUSBD+ MBR120 J2 1 VBUS 2 D3 D+ 5 R2 47k VBUS (3.3V) D1 MTAB 6 GND USB Mini B Connector (JAE DX2R005HN2E700) LED INTERFACE VDD 2.4 LED Forward Voltage, VF |LED RLED LED0 or LED1 Resistor Voltage Drop, VR Pad Voltage, VPAD RON = 20 Ω The LEDs can be used to indicate the module’s connection status. Table 2-1 describes the LED functions. TABLE 2-1: STATUS LED FUNCTIONS Blue LED Red LED Description Flashing Flashing The RN52 module is discoverable. Off Flashing The module is connected. Flashing 2.3 Off The module is connectable. Device Firmware Updates The module has a Device Firmware Update (DFU) mode in which you use the USB interface to update the firmware. Implementing the DFU feature is highly recommended because firmware updates offer new features and enhance the module’s functionality. Follow the reference design shown in Figure 2-7 to support this mode. Note: Restore Factory Defaults with GPIO4 The GPIO4 pin should be connected to a switch, jumper or resistor so it can be accessed. This pin is used to reset the module to its factory default settings, which is critical in situations where the module has been misconfigured. To reset the module to the factory defaults, GPIO4 should be high on power-up and then toggle low, high, low, high with a 1 second wait between the transitions. 2.5 Power Control and Regulation The VDD pin controls the power to the RN52 module. The VDD pin should be used to turn the RN52 module on and off, if the hardware power cycle feature is desired. The PWREN pin provides the power enable functionality. This pin is internally connected as an enable pin to the voltage regulator and can only be used to turn on the voltage regulator after VDD power is provided to the RN52 module. The PWREN pin cannot be used to turn the voltage regulator off. On later versions of the firmware, the RN52 also provides a module reset GPIO pin, which resets the RN52 module when asserted high, and also provides a console command which can be used to perform a module reset. A 47 K pull-down resistor (R2 in Figure 2-4) is required on GPIO3 even if you do not use the USB for DFU. DS70005120A-page 14 2015 Microchip Technology Inc. RN52 2.6 Solder Reflow Profile The lead-free solder reflow temperature and times are: • Temperature – 230° C, 60 seconds maximum, peak 245° C maximum • Preheat temperature – 165° ± 15° C, 90 to 120 seconds • Time – Single pass, one time TABLE 2-2: To reflow solder the module onto a PCB, use an RoHScompliant solder paste equivalent to NIHON ALMIT paste or OMNIX OM-310 solder paste from Alpha metals. See Table 2-2. Note: Use no-clean flux and DO NOT water wash. PASTE SOLDER RECOMMENDATIONS Manufacturer Part Number Metal Composition Liquidus Temperature Alpha Metals OMNIX OM-310 http://www.alphametals.com SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) ~220°C NIHON ALMIT Co. LTD http://almit.co.jp 88% Sn, 3.5% Ag, 0.5% Bi, 8% In ~215°C LFM-70W INP Figure 2-5 and Figure 2-6 show the solder reflow temperature profiles. FIGURE 2-5: SOLDER REFLOW TEMPERATURE PROFILE 2015 Microchip Technology Inc. DS70005120A-page 15 RN52 FIGURE 2-6: DS70005120A-page 16 SOLDER REFLOW CURVE 2015 Microchip Technology Inc. 29 30 31 32 33 34 35 36 37 38 SPI _MI SO SPI _SCK SPI _MOSI L ED1 L ED0 MI C_BI AS MI C_L + MI C_R+ MI C_L - MI C_R- 41 42 43 SPKR_L - SPKR_R+ SPKR_L + 44 40 SPKR_R- 39 28 SPI _SS PCM_CL K PCM_SYNC PCM_OUT PCM_IN 27 GND SPKR_L + SPKR_R+ SPKR_L- SPKR_R- AGND MIC_R- MIC_L- MIC_R+ MIC_L+ MIC_BIAS L ED0 L ED1 SPI_MOSI SPI_SCK SPI_MISO SPI _SS GND 26 PCM_CL K 25 L ED1 L ED0 PCM_SY NC 45 GND 23 PCM_OUT 24 PCM_IN GND 47 GND 46 3.3V 22 21 D3 GND GPIO3 GPIO2 AIO0 GPIO4 GPIO5 GPIO12 GPIO13 GPIO11 GPIO10 GPIO9 USBD- USBD+ UART_RTS UART_CTS UART_TX PI O3 UART_TX UART_CTS UART_RTS USBD+ USBDPI O9 BTN_VOL DOWN BTN_PREVI OUS BTN_PLAY BTN_NEXT BTN_VOL UP PI O4 AI O0 PI O2 PI O3 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 UART_RX UART_TX UART_RX PI O9 S5 Wake Device Firmware Update USBDUSBD+ 22k 10nF C4 Vol Up MI C_R- MI C_L - 2 4 6 8 10 12 14 16 S1 Prev S3 Play / Pause S4 GND AI O0 47nF C10 C8 47nF C9 47nF C12 1uF S6 Next S2 Vol Down 47nF C11 MI C_BI AS 3.3V PCM_I N PCM_OUT PCM_SYNC PCM_CL K VBUS USB Mini B / RSVD USB 5 J3 EXT Connector 1 3 5 7 9 11 13 15 MI C_L + MI C_R+ 3.3V VBUS MBR120 J2 1 VBUS 2 D3 6 D+ MTAB D1 MI C_R MI C_L R7 2k2 BTN_PREVI OUS BTN_NEXT BTN_PL AY BTN_VOL DOWN BTN_VOL UP R6 2k2 MI C_R MI C_L SPKR_RSPKR_L SPKR_R+ SPKR_L + VBUS J6 1 2 J8 MI CR 1 2 MI CL J7 1 3 5 7 9 Battery 1 2 J11 VBUS 2 4 6 8 10 C6 1uF Mic 1 Vin TC1262- 3.3V 4J5 3 5 2 1 3.3V PI O2 PI O4 BTN_VOLUP BTN_NEXT BTN_PLAY BTN_PREVI OUS BTN_VOLDOWN PI O7 PI O6 PWREN MI C_L + MI C_R+ MI C_L MI C_RMI C_BI AS Vout 3 U2 3.3V UART_RX UART_TX J10 1 2 3 4 5 6 7 8 9 10 11 12 3.3V 1uF C13 1uF SPI _MI SO SPI _MOSI SPI _SCK SPI _SS C7 1uF 1uF C21 C18 2k2 1uF C14 1uF C22 UART_CTS UART_RTS R70 SPKR_R- SPKR_R+ SPKR_L + SPKR_L - 22 CBUS0 21 CBUS1 10 CBUS2 11 CBUS3 9 CBUS4 30 TXD 2 RXD 32 RTS 8 CTS 31 DTR 6 DSR 7 DCD 3 RI SPI MASTER 1 2 3 4 5 6 J4 VBUS 100nF C2 22k R12 22k R13 47k R11 47k R16 22k R17 22k R15 8 7 4 3 IN2- IN2+ BYPASS IN1+ IN1- C15 10uF 2 VBUS 47k R14 10 Vo1 47k R10 OSCO OSCI RESET USBDP USBDM 28 27 18 14 15 U1 FT232RQ 100nF 100nF C1 C3 9 U4 TPA6112 Vo2 6 1 C16 100nF SHUTDOWN V DD R1 17 PI O7 PI O6 R2 47k M1 RN52 Module Red LED D2 PWREN R9 470 UART_RX Blue LED R8 47R V DD GND 48 19 GPIO7 18 GND 20 GPIO6 PWR E N GND 49 GND 50 GND 2 T ab 4 19 V CC 1 V CCIO 20 GND 17 GND 4 GND 24 A GND 33 T HPA D PA D 11 GND 5 16 2015 Microchip Technology Inc. 3V 3OUT VBUS GND MTAB 6 Headphones 1J9 2 5 3 4 USB Mini B / CSR UART 5 J1 1 VBUS 2 D3 D+ 100uF 100uF C19 C17 100uF 100uF C23 C20 FIGURE 2-7: T E ST 2.7 26 3.3V RN52 Typical Application Schematic Figure 2-7 shows a typical application circuit with LDO, stereo audio/microphone PA, USB/UART, AVRCP switches and LED0/LED1. TYPICAL APPLICATION CIRCUIT FOR A2DP AUDIO STREAMING AND AVRCP REMOTE CONTROL DS70005120A-page 17 RN52 3.0 BLUETOOTH SIG CERTIFICATION The RN52 Bluetooth Audio Module has been certified by Bluetooth SIG and the Qualified Design ID is 58578 and the Declaration ID is D023391. The Qualified Design Listing certificate can be accessed on www.microchip.com/rn52 or at the Bluetooth SIG listings website. 4.0 REGULATORY APPROVAL This section outlines the regulatory information for the RN52 module for the following countries: • • • • • United States Canada Europe Australia New Zealand 4.1 United States The RN52 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the RN52 module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. 4.1.1 LABELING AND USER INFORMATION REQUIREMENTS The RN52 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is DS70005120A-page 18 installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: Contains Transmitter Module FCC ID: T9J-RN52 or Contains FCC ID: T9J-RN52 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A user’s manual for the product should include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/ kdb/index.cfm. 4.1.2 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. OET Bulletin 65, Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency 2015 Microchip Technology Inc. RN52 (RF) fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF exposure compliance: To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the RN52 module is used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091. 4.1.3 HELPFUL WEB SITES Federal Communications Commission (FCC): http://www.fcc.gov FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm 4.2 Canada The RN52 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSSGen. Modular approval permits the installation of a module in a host device without the need to recertify the device. 4.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of 2015 Microchip Technology Inc. the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC: 6514A-RN52 User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December 2010): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device complies with Industry Canada licenseexempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals for transmitters shall display the following notice in a conspicuous location: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. The above notice may be affixed to the device instead of displayed in the user manual. 4.2.2 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ DS70005120A-page 19 RN52 4.3 4.3.2 Europe From R&TTE Compliance Association document Technical Guidance Note 01: The RN52 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer’s installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4] The RN52 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table 3-1: European Compliance Testing. A Notified Body Opinion has also been issued. All test reports are available on the RN52 product web page at http://www.microchip.com. 4.3.3 To maintain conformance to the testing listed in Table 4-1, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. Additional helpful web sites are: • Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm • European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org • European Telecommunications Standards Institute (ETSI): http://www.etsi.org • European Radio Communications Office (ERO): http://www.ero.dk • The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/ When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. 4.3.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the RN52 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. TABLE 4-1: EUROPEAN COMPLIANCE TESTING Certification Safety Health EMC Radio HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/ html/download_area.htm. Note: ANTENNA REQUIREMENTS Standards Article Laboratory EN 60950-1:2006+A11:2009+A1:2010 (3.1(a)) Worldwide Testing Services EN 301 489-1 V1.8.1 (2008-04) (3.1(b)) (Taiwan) EN 301 489-17 V2.1.1 (2009-05) Co., Ltd. EN 300 328 V1.7.1 (2006-10) (3.2) EN 50371:2002-03 Notified Body Opinion DS70005120A-page 20 — Eurofins Product Service GmbH Report Number Date W6M21301-13004-L 2/23/2013 W6M21301-13004-50371 5/31/2013 W6M21301-13004-E-16 2/7/2013 W6M21301-13004-T-45 5/31/2013 U9M-1304-2756-C-V01 6/13/2013 2015 Microchip Technology Inc. RN52 4.4 Australia The Australia radio regulations do not provide a modular approval policy similar to the United States (FCC) and Canada (IC). However, RN52 module RF transmitter test reports can be used in part to demonstrate compliance in accordance with ACMA Radio communications “Short Range Devices” Standard 2004 (The Short Range Devices standard calls up the AS/NZS 4268:2008 industry standard). The RN52 module test reports can be used as part of the product certification and compliance folder. For more information on the RF transmitter test reports, contact Microchip Technology Australia sales office. To meet overall Australian final product compliance, the developer must construct a compliance folder containing all relevant compliance test reports, e.g. RF, EMC, electrical safety and DoC (Declaration of Conformity), etc. It is the responsibility of the integrator to know what is required in the compliance folder for ACMA compliance. All test reports are available on the RN52 product web page at http://www.microchip.com. For more information on Australia compliance, refer to the Australian Communications and Media Authority web site: http://www.acma.gov.au/. 4.4.1 HELPFUL WEB SITES The Australian Communications and Media Authority: www.acma.gov.au/. 4.5 New Zealand The New Zealand radio regulations do not provide a modular approval policy similar to the United States (FCC) and Canada (IC). However, RN52 module RF transmitter test reports can be used in part to demonstrate compliance against the New Zealand “General User Radio License for Short Range Devices”. New Zealand Radio communications (Radio Standards) Notice 2010 calls up the AS / NZS 4268:2008 industry standard. The RN52 module test reports can be used as part of the product certification and compliance folder. All test reports are available on the RN52 product web page at http://www.microchip.com. For more information on the RF transmitter test reports, contact Microchip Technology sales office. Information on the New Zealand short range devices license can be found in the following web links: http://www.rsm.govt.nz/cms/licensees/types-oflicence/ general-user-licences/short-range-devices and http://www.rsm.govt.nz/cms/policy-and-planning/spectrum-policy-overview/legislation/gazette-notices/product-compliance/radiocommunications-radiostandardsnotice-2010. To meet overall New Zealand final product compliance, the developer must construct a compliance folder containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of Conformity) etc. It is the responsibility of the developer to know what is required in the compliance folder for New Zealand Radio communications. For more information on New Zealand compliance, refer to the web site: http://www.rsm.govt.nz/. 4.5.1 HELPFUL WEB SITES Radio Spectrum Ministry of Economic Development: http://www.rsm.govt.nz/. 2015 Microchip Technology Inc. DS70005120A-page 21 RN52 5.0 ORDERING INFORMATION Table 5-1 provides ordering information for the RN52 module. TABLE 5-1: ORDERING INFORMATION(1) Part Number RN52-I/RM Note 1: Description Standard application firmware (A2DP/AVRCP/SPP) (master). For other configurations, contact Microchip directly. Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products. DS70005120A-page 22 2015 Microchip Technology Inc. RN52 6.0 REVISION HISTORY Revision A (September 2015) • This replaces Roving Networks document “RN52 Bluetooth Audio Module Data Sheet”, version 1.1r 3/20/13. 2015 Microchip Technology Inc. DS70005120A-page 23 RN52 NOTES: DS70005120A-page 24 2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-794-2 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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