HT45B1S IGBT Driver with LDO and Voltage Detector Features General Description • Integrated Low Dropout Voltage Regulator – LDO ♦♦ Output driving capability: 150mA (max) ♦♦ Low quiescent current: 7μA (typ) ♦♦ Low drop voltage This IGBT driver device is specifically designed for applications which require low level logic levels such as those from microcontrollers to interface to power insulated gate bipolar transistors. As the device includes an internal LDO, a level shifter and voltage detector circuits, it integrates into a single package the external components usually required by these applications. This functional integration enables the device to offer the advantages of reduced circuitry and consequently reduced costs in these applications. • Integrated Level Shifter • Voltage detect protection for level shift output enable control ♦♦ Detect V DD ♦♦ Detect V CC2 The device contains all the level shifting circuitry required match the high voltage and high current r e q u i r e m e n t s o f I G B T d e v i c e s . To p r e v e n t malfunctions and possible system damage, an internal voltage detector monitors the system voltage level to determine if the level shifter can be enabled or not. • Package: 8-SOP Applications • Battery powered systems • Communication equipments • Audio/video equipment • Home appliances Block Diagram LDO VCC1 VSS1 VDD VDD VCC2 RDY VDET VSS1 VCC2 VSS2 VSS1 VSS2 VDD VCC2 RDY LS A A AX AX VSS1 VSS2 Rev. 1.10 1 January 06, 2016 HT45B1S Pin Assignment VSS2 1 8 VSS1 2 7 NC AX A 3 6 VCC2 VDD 4 5 VCC1 HT45B1S 8 SOP-A Pin Description Pin Name Type Description A I Level shift input There is a 20kΩ pull-low resistor internally connected to this pin. AX O Level shift output There is a 22kΩ pull-low resistor internally connected to this pin. VCC1 PWR LDO positive power supply pin VCC2 PWR Level shifter positive power supply pin VDD PWR LDO voltage output VSS1 PWR LDO negative power supply pin, ground. VSS2 PWR Level shift and voltage detector negative power supply pin – ground. NC — Not connected, can not be used. Absolute Maximum Ratings Supply Voltage �������������������������������������������������������������������������������������������������������������������������������������� -0.3V to 30.0V Storage Temperature ............................-50°C to 125°C Operating Temperature ..........................-40°C to 85°C Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maximum Ratings" may cause substantial damage to these devices. Functional operation of these devices at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect devices reliability. Rev. 1.10 2 January 06, 2016 HT45B1S Electrical Characteristics LDO Characteristics Output Voltage V5=5V, -40°C≤Ta≤85°C,VIN=VOUT+1.0V, Ta=25°C, unless otherwise specified. Symbol Parameter Test Conditions Min. Typ. Max Unit — 6 — 24 V IO =1mA, Ta=25°C -2% 5 2% V IO =1mA, -40°C≤Ta<85°C -5% 5 5% V — 0.02 0.04 %/mA — 0.03 0.06 %/mA — — 100 mV VIN Input Voltage (VCC1) VOUT Output Voltage ΔVLOAD Load Regulation (Note1) VDROP Drop Out Voltage (Note2) IO =1mA, ∆VO=2% IQS Quiescent Current VIN=12V,IO=0mA, no load — 7 14 μA ΔVLINE Line Regulation 6V≤VIN≤24V, IO =1mA — — 0.2 %/V Temperature Coefficient IO =10mA 0°C<Ta<70°C — ±1.5 ±2 mV/°C ∆VOUT ∆Ta VIN=7V, 1mA≤IO≤150mA, Ta=25°C VIN=6V, 1mA≤IO≤70mA, Ta=25°C Note: 1. Load regulation is measured at a constant junction temperature, using pulse testing with a low ON time and is guaranteed up to the maximum power dissipation. Power dissipation is determined by the input/ output differential voltage and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range. The maximum allowable power dissipation at any ambient temperature is PD=(TJ(MAX)-Ta)/θJA 2. Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at VIN=VOUT+1V. Level Shift/Voltage Detector Electrical Characteristics VDD=5V, VCC2=12V, Ta=25°C, unless otherwise specified. Symbol Parameter Test Conditions Min. Typ. Max Unit — 6 — 24 V VCC2 Level Shift Power Supply IOPR1 VCC1 Operating Current (Note1) VDD=5V, VCC2=12V, A=0, no load — 7 14 μA IOPR2 VCC2 Operating Current (Note1) VCC2=12V, A=0, no load — 10 20 μA 0.6VDD — VDD V Level Shift VIH Input High Voltage VIL Input Low Voltage ISOURCE Output Source Current for AX pin VOH=10.4V, Ta= -40°C~85°C ISINK Output Sink Current for AX pin VOH=1.6V, Ta= -40°C~85°C RPD1 Level Shift Output pull-low resistor — RPD2 Level Shift Input pull-low resistor — -30% — — 0 — 0.3VDD V -105 -150 — mA 105 150 — mA -30% 22 +30% kΩ 20 +30% kΩ Voltage Detector VDET1 VDET2 VDD Detect Level Ta= -40°C~85°C -10% 3.0 +10% V Hysteresis Ta= -40°C~85°C — 250 — mV VCC2 Detect Level Ta= -40°C~85°C -10% 9 +10% V Hysteresis Ta= -40°C~85°C — 750 — mV Note: Operating or Standby current includes the power consumption of level shift circuitry and voltage detector. Rev. 1.10 3 January 06, 2016 HT45B1S Functional Description For voltage detection VDET, RDY=0 means VCC2 or VDD is below the normal operation level, and AX will be forced to a floating state. The device includes an LDO, a Level shifters and a voltage detection circuit. The following is a description of their operation. Note that the system power VCC1 must be powered on earlier that VCC2, or VCC1 and VCC2 are powered on simultaneously, in order to avoid circuit malfunctions. LDO The system is supplied by a higher system voltage – approximately 6V to 24V – on input pin VCC1. An internal LDO reduces this higher voltage to a 5V level which is supplied on output pin VDD. This lower voltage level is used by the internal logic circuits but as it can supply up to 150mA it can also be used by external circuitry. A VDD domain VCC2 domain L.S 20kΩ RDY AX 22kΩ Level Shifter Control Circuit Level Shifter Voltage Detector The internal level shifter input is pin A with input logic levels referenced by V DD. The level shifter output is pin AX, whose levels are referenced by the higher voltage level V CC2. Internal circuits ensure a reliable transfer of voltage levels from the V DD reference level to the VCC2 reference level which can then be used for IGBT driving purposes. Both level shifter pins, A and AX, are connected via pull-low resistors to ground. An internal voltage detector monitors the integrity of the VDD and VCC2 voltage levels. If the voltage levels are normal, then the level shifter will be enabled to operate normally. Abnormal VDD or VCC2 voltage levels will result in the level shifter being disabled to prevent system malfunctions and possible circuit damage. VDET “RDY” Signal AX Output 0 Floating 1 A Rev. 1.10 4 January 06, 2016 HT45B1S Application Circuits 18V VCC1 VCC2 VDD(5V) LDO (150mA) VCC2 P.G (VDET) VDD MCU AX A Level shift To drive IGBT gate VSS1/VSS2 Application Description The system power VCC1 (6V~24V) provides the device power. The LDO output voltage VDD (5V) is provided for the internal logic circuit and external low-voltage components, such as the MCU. The Level Shifters provide high output current for external components, such as IGBT. VDD is the voltage level for the input terminal of the Level shift, A. While VCC2 is the voltage level for the output terminal of the Level shift, AX. Rev. 1.10 5 January 06, 2016 HT45B1S Application Circuits Example 18V 10Ω + 100µF VCC2 0.1µF VSS2 9V 10Ω + 100µF VCC1 High Voltage 0.1µF MCU Cooker Coil HT45B1S 10Ω A PPG 0.1µF VDD 100µF 10kΩ + 0.1µF VDD IGBT AX VSS VSS Notes: 1. The power supply decoupling capacitors and zener diode connected to VDD, VCC1 and VCC2 must all be located close to the ICs power supply pins. 2. The IGBT resistor and zener diode drive circuit must be located close to the IGBT transistor. Rev. 1.10 6 January 06, 2016 HT45B1S Package Information Note that the package information provided here is for consultation purposes only. As this information may be updated at regular intervals users are reminded to consult the Holtek website for the latest version of the package information. Additional supplementary information with regard to packaging is listed below. Click on the relevant section to be transferred to the relevant website page. • Further Package Information (include Outline Dimensions, Product Tape and Reel Specifications) • Packing Meterials Information • Carton information Rev. 1.10 7 January 06, 2016 HT45B1S 8-pin SOP (150mil) Outline Dimensions Symbol Dimensions in inch Min. Nom. Max. A — 0.236 BSC — B — 0.154 BSC — 0.020 C 0.012 — C’ — 0.193 BSC — D — — 0.069 E — 0.050 BSC — F 0.004 — 0.010 G 0.016 — 0.050 H 0.004 — 0.010 α 0° — 8° Symbol Rev. 1.10 Dimensions in mm Min. Nom. Max. A — 6 BSC — B — 3.9 BSC — C 0.31 — 0.51 C’ — 4.9 BSC — D — — 1.75 E — 1.27 BSC — F 0.10 — 0.25 G 0.40 — 1.27 H 0.10 — 0.25 α 0° — 8° 8 January 06, 2016 HT45B1S Copyright© 2016 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.10 9 January 06, 2016