DFN-10 Package

MATERIAL DECLARATION SHEET
Product Line
ESD Suppressing Device
CDDFN10-0524P
Semiconductor Products
Compliance Date
2013/8/2
Material Number
RoHS Compliant
Yes
MSL
3
No.
Construction
Element(subpart)
Homogeneou
s Material
Material
weight [g]
Homogeneou
s Material\
Substances
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit
wt.
Subpart
mass of
total wt. (%)
1
Wafer
Silicon
0.00035
Silicon
7440-21-3
100.00%
7.99%
7.99%
0.00180
Copper
7440-50-8
95.445%
41.19%
0.00005
Iron
7439-89-6
2.40%
1.04%
0.000002
Phosphorus
7723-14-0
0.10%
0.04%
0.000003
0.0000001
0.00004
Zinc
Lead
Silver
Acrylic
Copolymer
7440-66-6
7439-92-1
7440-22-4
0.15%
0.005%
1.90%
0.06%
0.00%
0.82%
Trade Secret
60.00%
1.51%
2
Lead Frame
Copper alloy
0.00007
3
4
Epoxy
Wire
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Polymer
Noble metal
0.00002
Epoxy Resin
Trade Secret
15.00%
0.38%
0.00001
Hardener
Trade Secret
12.50%
0.31%
0.00001
Amorphous
Silica
68583-49-3
12.50%
0.31%
0.000069
Gold
7440-57-5
99.99%
1.57%
43.15%
2.51%
1.60%
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MATERIAL DECLARATION SHEET
5
6
Mold Compound
Plating
Polymer
plating
Total weight
0.000000007
Misc., not to
declare
N/A
0.01%
0.03%
0.000092
Epoxy Resin
Trade Secret
5.00%
2.10%
0.000092
Phenol Resin
Trade Secret
5.00%
2.10%
0.001362
Silica(Amorphous) A
60676-86-0
74.00%
31.09%
0.000276
Silica(Amorphous) B
7631-86-9
15.00%
6.30%
0.000018
Carbon Black
1333-86-4
1.00%
0.42%
0.000120
Tin
7440-31-5
99.9%
2.74%
0.0000001
Misc., not to
declare
N/A
0.1%
0.0027%
42.0073%
2.7427%
0.0043799 g
This Document was updated on: 2013/8/2
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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