CAY17-J

MATERIAL DECLARATION SHEET
Material Number
Product Line
Compliance Date
CAY17-JA (LF)
Chip Resistor Array
2012/07/18
RoHS Compliant
Yes
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
Material
weight [g]
1
Ceramic Substrate
Ceramic
0.0069790704
2
3
Conductor Layer
Resistive Element
Other
Other
0.0002059056
0.0000973056
Homogeneou
s Material\
Substances
CASRN
if applicable
Materials
Mass %
Material Mass %
of total unit wt.
1344-28-1
96%
77.12%
14808-60-7
7440-22-4
65997-18-4
4%
95%
5%
3.21%
2.25%
0.12%
12036-10-1
25%
0.28%
7440-22-4
40%
0.45%
Palladium
7440-05-3
15%
0.17%
Lead oxide
1317-36-8
20%
0.22%
Aluminum
oxide
Silicon dioxide
Silver
Glass
Ruthenium
dioxide
Silver
Subpart
mass of
total wt.
(%)
80.33%
2.37%
1.12%
4
Over-Coating
Paint
0.0001251072
Epoxy
25068-38-6
100%
1.44%
1.44%
5
Marking
Ink
0.0000034752
Epoxy
25068-38-6
100%
0.04%
0.04%
6
End Terminal
Metal
0.0002571648
7
Ni Plating
Metal
0.000560376
Nickel
Chromium
Nickel
7440-02-0
7440-47-3
7440-02-0
80%
20%
100%
2.37%
0.59%
6.45%
8
Sn Plating
Metal
0.0004595952
Tin
7440-31-5
100%
5.29%
Total weight
This Document was updated on:
2.96%
6.45%
5.29%
0.008688
2012/7/23
Important remarks: Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I
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