INTERSIL HSP43891883

HSP43891/883
TM
Data Sheet
May 1999
FN2451.4
Digital Filter
Features
The HSP43891/883 is a video-speed Digital Filter (DF)
designed to efficiently implement vector operations such as
FIR digital filters. It is comprised of eight filter cells cascaded
internally and a shift and add output stage, all in a single
integrated circuit. Each filter cell contains a 9 x 9 two’s
complement multiplier, three decimation registers and a 26bit accumulator. The output stage contains an additional 26bit accumulator which can add the contents of any filter cell
accumulator to the output stage accumulator shifted right by
8-bits. The HSP43891/883 has a maximum sample rate of
25.6MHz. The effective multiply-accumulate (mac) rate is
204MHz.
• This Circuit is Processed in Accordance to MIL-STD-883
and is Fully Conformant Under the Provisions of
Paragraph 1.2.1.
• 0MHz to 25.6MHz Sample Rate
• Eight Filter Cells
• 9-Bit Coefficients and Signal Data
• Low Power CMOS Operation
- ICCSB = 500µA Maximum
- ICCOP = 160µA Maximum at 20MHz
• 26-Bit Accumulator per Stage
• Filter Lengths Up to 1032 Taps
The HSP43891/883 DF can be configured to process
expanded coefficient and word sizes. Multiple DFs can be
cascaded for larger filter lengths without degrading the
sample rate or a single DF can process larger filter lengths
at less than 25.6MHz with multiple passes. The architecture
permits processing filter lengths of over 1000 taps with the
guarantee of no overflows. In practice, most filter coefficients
are less than 1.0, making even larger filter lengths possible.
The DF provides for 8-bit unsigned or 9-bit two’s
complement arithmetic, independently selectable for
coefficients and signal data.
• Expandable Coefficient Size, Data Size and Filter Length
• Decimation by 2, 3 or 4
Applications
• 1-D and 2-D FIR Filters
• Radar/Sonar
• Digital Video
• Adaptive Filters
• Echo Cancellation
Each DF filter cell contains three re-sampling or decimation
registers which permit output sample rate reduction at rates
of 1/2, 1/3 or 1/4 the input sample rate. These registers also
provide the capability to perform 2-D operations such as
matrix multiplication and N x N spatial
correlations/convolutions for image processing applications.
• Complex Multiply-Add
• Sample Rate Converter
Ordering Information
TEMP.
RANGE (oC)
PART NUMBER
PACKAGE
PKG.
NO.
HSP43891GM-20/883
-55 to 125
85 Ld PGA
G85.A
HSP43891GM-25/883
-55 to 125
85 Ld PGA
G85.A
Block Diagram
VCC
DIENB
CIENB
DCM0 - 1
ERASE
CIN0 - 8
RESET
CLK
ADR0 - 2
VSS
DIN0 - DIN8
9
5
DF
FILTER
CELL 0
9
5
9
DF
FILTER
CELL 1
26
5
26
9
DF
FILTER
CELL 2
9
DF
FILTER
CELL 3
26
9
26
DF
FILTER
CELL 4
26
9
DF
FILTER
CELL 5
26
9
DF
FILTER
CELL 6
26
9
DF
FILTER 9
CELL 7
26
COUT0 - 8
COENB
3
MUX
RESET
CLK
SHADD
SENBL
SENBH
26
ADR0, ADR1, ADR2
2
OUTPUT
STAGE
2
SUM0 - 25
1
26
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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HSP43891/883
Pinouts
HSP43891/883 85 PIN (PGA)
TOP VIEW, PINS DOWN
1
2
3
4
5
6
7
8
9
10
11
A
VSS
COENB
VCC
RESET
DIN7
DIN6
DIN3
DIN0
TCCI
VCC
VSS
B
VCC
COUT7
COUT8
ERASE
TCS
DIN1
DIN2
CIENB
CIN7
CIN6
CIN4
C
COUT5 COUT6
ALIGN
PIN
DIENB
DIN5
DIN4
CIN5
CIN3
D
COUT3 COUT4
CIN2
VCC
E
COUT1
F
VSS
G
COUT2
CIN1
CIN0
SENBL
COUT0 SHADD
SUM0
VCC
VSS
ADR2
DCM0
SUM1
SUM3
SUM2
H
ADR1
ADR0
SUM5
SUM4
J
VCC
SUM25
SUM7
VSS
K
L
VSS
SENBH SUM24
DCM1
2
SUM23
CLK
SUM20
SUM17
SUM16
VSS
VCC
SUM19
VSS
SUM15
SUM12
SUM10
SUM8
SUM6
SUM22
SUM21
SUM18
SUM14
VCC
SUM13
VSS
SUM11
SUM9
HSP43891/883
Pinouts
(Continued)
HSP43891/883, 85 PIN (PGA)
, PINS UP
1
2
3
4
5
6
7
8
9
10
11
DCM1
SUM23
SUM22
SUM21
SUM18
SUM14
VCC
SUM13
VSS
SUM11
SUM9
SENBH
SUM24
VSS
VCC
SUM19
VSS
SUM15
SUM12
SUM10
SUM8
SUM6
VCC
SUM25
SUM20
SUM17
SUM16
SUM7
VSS
ADR1
ADR0
SUM5
SUM4
ADR2
DCM0
CLK
SUM1
SUM3
SUM2
VSS
COUT0
SHADD
SUM0
VCC
VSS
COUT1
VSS
COUT2
CIN1
CIN0
SENBL
CIN2
VCC
CIN5
CIN3
L
K
J
H
G
F
E
D
COUT3
COUT4
C
COUT5 COUT6
ALIGN
PIN
VCC
COUT7
COUT8
VSS
COENB
VCC
DIENB
DIN5
DIN4
ERASE
DIN8
DIN1
DIN2
CIENB
CIN7
CIN6
CIN4
RESET
DIN7
DIN6
DIN3
DIN0
CIN8
VCC
VSS
B
A
3
HSP43891/883
Absolute Maximum Ratings
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0V
Input/Output Voltage . . . . . . . . . . . . . . . . . GND -0.5V to VCC +0.5V
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance (Typical, Note 1)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
θJA (oC/W)
θJC (oC/W)
Ceramic PGA Package . . . . . . . . . . . .
36.0
7.0
Maximum Package Power Dissipation at 125oC
Ceramic PGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.44W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . 175oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
Die Characteristics
Number of Gates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17,762
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
Devices Guaranteed and 100% Tested
PARAMETER
SYMBOL
CONDITIONS
GROUP A
SUBGROUPS
TEMPERATURE
(oC)
MIN
MAX
UNITS
Logical One Input Voltage
VIH
VCC = 5.5V
1, 2, 3
-55 ≤ TA ≤ 125
2.2
-
V
Logical Zero Input Voltage
VIL
VCC = 4.5V
1, 2, 3
-55 ≤ TA ≤ 125
-
0.8
V
Output HIGH Voltage
VOH
IOH = 400µA
VCC = 4.5V (Note 2)
1, 2, 3
-55 ≤ TA ≤ 125
2.6
-
V
Output LOW Voltage
VOL
IOL = +2.0mA
VCC = 4.5V (Note 2)
1, 2, 3
-55 ≤ TA ≤ 125
-
0.4
V
Input Leakage Current
II
VIN = VCC or GND
VCC = 5.5V
1, 2, 3
-55 ≤ TA ≤ 125
-10
+10
µA
Output Leakage Current
IO
VOUT = VCC or GND
VCC = 5.5V
1, 2, 3
-55 ≤ TA ≤ 125
-10
+10
µA
Clock Input High
VIHC
VCC = 5.5V
1, 2, 3
-55 ≤ TA ≤ 125
3.0
-
V
Clock Input Low
VILC
VCC = 4.5V
1, 2, 3
-55 ≤ TA ≤ 125
-
0.8
V
Standby Power Supply
Current
ICCSB
VIN = VCC or GND
VCC = 5.5V,
Outputs Open
1, 2, 3
-55 ≤ TA ≤ 125
-
500
µA
Operating Power Supply
Current
ICCOP
f = 20.0MHz
VCC = 5.5V, (Note 3)
1, 2, 3
-55 ≤ TA ≤ 125
-
160.0
mA
7, 8
-55 ≤ TA ≤ 125
-
-
Functional Test
FT
(Note 4)
NOTES:
2. Interchanging of force and sense conditions is permitted.
3. Operating Supply Current is proportional to frequency, typical rating is 8mA/MHz.
4. Tested as follows: f = 1MHz, VIH = 2.6, VIL = 0.4, VOH ≥ 1.5V, VOL ≤ 1.5V, VIHC = 3.4V, and VILC = 0.4V.
4
HSP43891/883
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Guaranteed and 100% Tested
PARAMETER
SYMBOL
NOTES
-20 (20MHz)
-25 (25.6MHz)
GROUP A
SUBGROUPS
TEMP (oC)
MIN
MAX
MIN
MAX
UNITS
Clock Period
t CP
Note 5
9, 10, 11
-55 ≤ TA ≤ 125
50
-
39
-
ns
Clock Low
t CL
Note 5
9, 10, 11
-55 ≤ TA ≤ 125
20
-
16
ns
ns
Clock High
t CH
Note 5
9, 10, 11
-55 ≤ TA ≤ 125
20
-
16
-
ns
Input Setup
t IS
Note 5
9, 10, 11
-55 ≤ TA ≤ 125
20
-
17
-
ns
Input Hold
t IH
Note 5
9, 10, 11
-55 ≤ TA ≤ 125
0
-
0
-
ns
CLK to Coefficient
Output Delay
t ODC
Note 5
9, 10, 11
-55 ≤ TA ≤ 125
-
24
-
20
ns
Output Enable Delay
t OED
Note 5
9, 10, 11
-55 ≤ TA ≤ 125
-
20
-
15
ns
CLK to SUM Output
Delay
t ODS
Note 5
9, 10, 11
-55 ≤ TA ≤ 125
-
31
-
25
ns
NOTE:
5. AC Testing: VCC = 4.5V and 5.5V. Inputs are driven at 3.0V for a Logic”1” and 0.0V for a Logic “0”. Input and output timing measurements are
made at 1.5V for both a Logic “1” and “0”. CLK is driven at 4.0V and 0V and measured at 2.0V.
TABLE 3. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Input Capacitance
TEST
CONDITIONS
SYMBOL
CIN
VCC = Open, f = 1MHz
All measurements are
referenced to device GND
-20 (20MHz)
-25 (25.6MHz)
NOTES
TEMP (oC)
MIN
MAX
MIN
MAX
UNITS
1
TA = 25oC
-
15
-
15
pF
1
TA = 25oC
-
15
-
15
pF
Output Capacitance
COUT
Output Disable Delay
tODD
1, 2
-55 ≤ TA ≤ 125
-
20
-
15
ns
Output Rise Time
tOR
1, 2
-55 ≤ TA ≤ 125
-
7
-
6
ns
Output Fall Time
t OF
1, 2
-55 ≤ TA ≤ 125
-
7
-
6
ns
NOTES:
6. The parameters listed in Table 3 are controlled via design or process parameters and are not directly tested. These parameters are
characterized upon initial design and after major process and/or design changes.
7. Loading is as specified in the test load circuit, CL = 40pF.
TABLE 4. APPLICABLE SUBGROUPS
CONFORMANCE
GROUPS
METHOD
SUBGROUPS
Initial Test
100%/5004
-
Interim Test
100%/5004
-
PDA
100%
1
Final Test
100%
2, 3, 8A, 8B, 10, 11
-
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Samples/5005
1, 7, 9
Group A
Groups C and D
5
HSP43891/883
Burn-In Circuit
HSP43891/883
BOTTOM VIEW, PINS UP
1
2
3
4
5
6
7
8
9
10
11
DCM1
SUM23
SUM22
SUM21
SUM18
SUM14
VCC
SUM13
VSS
SUM11
SUM9
SENBH
SUM24
VSS
VCC
SUM19
VSS
SUM15
SUM12
SUM10
SUM8
SUM6
VCC
SUM25
SUM20
SUM17
SUM16
SUM7
VSS
ADR1
ADR0
SUM5
SUM4
ADR2
DCM0
CLK
SUM1
SUM3
SUM2
VSS
COUT0
SHADD
SUM0
VCC
VSS
COUT1
VSS
COUT2
CIN1
CIN0
SENBL
CIN2
VCC
CIN5
CIN3
L
K
J
H
G
F
E
D
COUT3
COUT4
C
COUT5 COUT6
ALIGN
PIN
VCC
COUT7
COUT8
VSS
COENB
VCC
DIENB
DIN5
DIN4
ERASE
TCS
DIN1
DIN2
CIENB
CIN7
CIN6
CIN4
RESET
DIN7
DIN6
DIN3
DIN0
CIN8
VCC
VSS
B
A
6
HSP43891/883
S
BURN-IN SIGNALS
PGA
PIN
PIN
NAME
BURN-IN
SIGNAL
PGA
PIN
PIN
NAME
BURN-IN
SIGNAL
PGA
PIN
PIN
NAME
BURN-IN
SIGNAL
PGA
PIN
PIN
NAME
BURN-IN
SIGNAL
A1
VSS
GND
C1
COUT5
VCC/2
F10
VCC
VCC
K4
VCC
VCC
A2
COENB
F10
C2
COUT6
VCC/2
F11
VSS
GND
K5
SUM19
VCC/2
A3
VCC
VCC
C3
ALIGN
NC
G1
ADR2
F2
K6
VSS
GND
A4
RESET
F11
C5
DIENB
F10
G2
DCM0
F5
K7
SUM15
VCC/2
A5
DIN7
F8
C6
DIN5
F5
G3
CLK
F0
K8
SUM12
VCC/2
A6
DIN6
F6
C7
DIN4
F4
G9
SUM1
VCC/2
K9
SUM10
VCC/2
A7
DIN3
F3
C10
CIN5
F5
G10
SUM3
VCC/2
K10
SUM8
VCC/2
A8
DIN0
F0
C11
CIN3
F3
G11
SUM2
VCC/2
K11
SUM6
VCC/2
A9
CIN8/TCCI
F8
D1
COUT3
VCC/2
H1
ADR1
F1
L1
DCM1
F6
A10
VCC
VCC
D2
COUT4
VCC/2
H2
ADR0
F0
L2
SUM23
VCC/2
A11
VSS
GND
D10
CIN2
F2
H10
SUM5
VCC/2
L3
SUM22
VCC/2
B1
VCC
VCC
D11
VCC
VCC
H11
SUM4
VCC/2
L4
SUM21
VCC/2
B2
COUT7
VCC/2
E1
COUT1
VCC/2
J1
VCC
VCC
L5
SUM18
VCC/2
B3
COUT8/TCC0
VCC/2
E2
VSS
GND
J2
SUM25
VCC/2
L6
SUM14
VCC/2
B4
ERASE
F10
E3
COUT2
VCC/2
J5
SUM20
VCC/2
L7
VCC
VCC
B5
DIN8/TCS
F7
E9
CIN1
F1
J6
SUM17
VCC/2
L8
SUM13
VCC/2
B6
DIN1
F1
E10
CIN0
F0
J7
SUM16
VCC/2
L9
VSS
GND
B7
DIN2
F2
E11
SENBL
F10
J10
SUM7
VCC/2
L10
SUM11
VCC/2
B8
CIENB
F10
F1
VSS
GND
J11
VSS
GND
L11
SUM9
VCC/2
B9
CIN7
F7
F2
COUT0
VCC/2
K1
SENBH
F10
B10
CIN6
F6
F3
SHADD
F9
K2
SUM24
VCC/2
B11
CIN4
F4
F9
SUM0
VCC/2
K3
VSS
GND
NOTES:
8. VCC/2 (2.7 ±10%) used for outputs only.
9. 47kΩ (±20%) resistor connected to all pins except VCC and GND.
10. VCC = 5.5V ±0.5V.
11. 0.1µF (minimum) capacitor between VCC and GND per position.
12. F0 = 100kHz ±10%, F1 = F0/2, F2 = F1/2..., F11 = F10/2, 40% - 60% duty cycle.
13. Input voltage limits: VIL = 0.8V maximum, VIH = 4.5V ±10%.
Metallization Topology
DIE DIMENSIONS:
GLASSIVATION
328 mils x 283 mils x ±1 mil
METALLIZATION:
Type: Nitrox
Silox Thickness: 10kÅ
WORST CASE CURRENT DENSITY:
Type: Si - Al or Si-AI-Cu
Thickness: 8kÅ
1.2 x 105A/cm2
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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7