846B

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
Micro10
CASE 846B−03
ISSUE D
DATE 07 DEC 2004
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B−01 OBSOLETE. NEW STANDARD
846B−02
−A−
−B−
K
D 8 PL
0.08 (0.003)
PIN 1 ID
G
0.038 (0.0015)
−T−
M
T B
S
A
C
SEATING
PLANE
H
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.95
1.10
0.20
0.30
0.50 BSC
0.05
0.15
0.10
0.21
4.75
5.05
0.40
0.70
DIM
A
B
C
D
G
H
J
K
L
S
L
J
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
10X
1.04
0.041
0.32
0.0126
3.20
0.126
8X
xxxx
AYW
10X
4.24
0.167
0.50
0.0196
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.037
0.043
0.008
0.012
0.020 BSC
0.002
0.006
0.004
0.008
0.187
0.199
0.016
0.028
SCALE 8:1
5.28
0.208
xxxx
A
Y
W
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ ”,
may or may not be present.
mm inches
Micro10
DOCUMENT NUMBER:
98AON03799D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
 Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
Micro10
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON03799D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ BY J. HOSKINS.
09 NOV 2000
A
DIM “D” WAS 0.25−0.4MM/0.10−0.016IN. ADDED NOTE 5.
USED ON: WAS 10 LEAD TSSOP, PITCH 0.65 REQ BY J. HOSKINS.
13 NOV 2000
B
CHANGED “USED ON” WAS: 10 LEAD TSSOP, PITCH 0.50MM. REQ BY A. HAMID.
11 JUL 2001
C
CHANGED “D” DIMENSION MAX FROM 0.35 TO 0.30MM AND 0.014 TO 0.012IN.
REQ BY D. TRUHITTE.
31 JUL 2003
D
ADDED FOOTPRINT INFORMATION. REQ. BY K. OPPEN.
07 DEC 2004
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
 Semiconductor Components Industries, LLC, 2004
December, 2004 − Rev. 03D
Case Outline Number:
846B
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