Plastic Packages for Integrated Circuits Package Outline Drawing L20.4x4E 20 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 4/10 4X 2.00 4.00 16X 0.50 A B 16 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA 20 1 4.00 15 2 . 60 11 (4X) 5 0.15 6 10 TOP VIEW 0.10 M C A B 20X 0 . 40 ±0.10 4 0.23 +0.07/- 0.05 BOTTOM VIEW SEE DETAIL "X" 0.10 C 0.75 C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW (3.8 TYP) ( ( 16X 0 . 50 ) 2 . 60 ) C ( 20X 0 . 23 ) ( 20 X 0 . 60 ) 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 7. JEDEC reference drawing: MO-229. either a mold or mark feature. 1