Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L20.4x4H
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 12/11
4.00
A
1.975
0.725
B
1
20
6
PIN 1
INDEX AREA
20x 0.25
4.00
3.10
0.10 M C A B
14
(4X)
6
PIN #1
INDEX AREA
0.625
7
20x 0.40
0.15
13
TOP VIEW
16x 0.50
2.00
BOTTOM VIEW
SEE DETAIL "X"
0.90±0.10
C
0.10 C
C
BASE PLANE
SIDE VIEW
DETAIL "X"
3.525
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
(16x 0.50)
3.775
5
0 . 00 MIN.
0 . 05 MAX.
SEATING PLANE
0.08 C
0.20
0 . 2 REF
(3.10)
4
(20x 0.25)
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
TYPICAL RECOMMENDED LAND PATTERN
7.
1
JEDEC reference drawing: MO-229.