Plastic Packages for Integrated Circuits Package Outline Drawing L10.1.8x1.4A 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 6, 8/13 1.80 B C0.10 IN #1 ID 6 A 9 X 0.40 1 1 3 10 0.50 6 PIN 1 INDEX AREA 1.40 2 10X 0.20 4 0.10 M C A B 0.05 M C 0.70 8 5 0.10 7 2X 4X 0.30 6 6X 0.40 TOP VIEW BOTTOM VIEW SEE DETAIL "X" 0.10 C MAX. 0.55 2.20 C SEATING PLANE 0.08 C 1 (10X 0.20) 3 (0.70) SIDE VIEW 1.80 10 8 C 5 (9X 0.60) 6 0.127 REF 7 (6X 0.40) PACKAGE OUTLINE 0-0.05 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Lead width dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. JEDEC reference MO-255. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1