Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L10.4x4
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 4/15
A
3.2 REF
4.00
PIN #1 INDEX AREA
8X 0.80 BSC
6
B
5
1
10X 0 . 40
6
PIN 1
INDEX AREA
4.00
2.60
0.15
(4X)
10
6
TOP VIEW
0.10 M C A B
0.05 M C
4 10 X 0.30
3.00
BOTTOM VIEW
( 3.00 )
SEE DETAIL "X"
0 .75
(10 X 0.60)
0.10 C
BASE PLANE C
SIDE VIEW
(3.80)
SEATING PLANE
0.08 C
(2.60)
0 . 2 REF
C
(8X 0.8)
0 . 00 MIN.
0 . 05 MAX.
(10X 0.30)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.