Data Sheet

KMA199E
Programmable angle sensor
Rev. 2 — 7 December 2011
Product data sheet
1. Product profile
1.1 General description
The KMA199E is a magnetic angle sensor system. The MagnetoResistive (MR) sensor
bridges and the mixed signal Integrated Circuit (IC) are integrated into a single package.
This angular measurement system KMA199E is pre-programmed, pre-calibrated and
therefore, ready to use.
The KMA199E allows user specific adjustments of angular range, zero angle and
clamping voltages. The settings are stored permanently in an Electrically Erasable
Programmable Read-Only Memory (EEPROM).
1.2 Features and benefits
 High precision sensor for magnetic
 Ratiometric output voltage
angular measurement
 Programmable user adjustments,
 Independent from the magnetic field
including zero angle and angular range
strength above 35 kA/m
 Single package sensor system
 Programming via One-Wire Interface
(OWI)
 Magnet-lost and power-lost detection
 Fail-safe EEPROM
 Built-in transient protection
 High temperature range
 User-programmable 32-bit identifier
 Factory calibrated
 Ready to use
KMA199E
NXP Semiconductors
Programmable angle sensor
2. Pinning information
Table 1.
Pinning
Pin
Symbol
Description
1
VDD
supply voltage
2
GND
ground
3
OUT/DIGINT
analog output voltage or digital
interface
Simplified outline
1
2
3
3. Ordering information
Table 2.
KMA199E
Product data sheet
Ordering information
Type number
Package
Name
Description
Version
KMA199E
-
plastic single-ended multi-chip package;
6 interconnections; 3 in-line leads
SOT880
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VDDS
VDDS
REGULATOR
VDDA
REGULATOR
VDDD
REGULATOR
LOGIC
VDD
POWER-ON
RESET
NXP Semiconductors
Vref
Iref
4. Functional diagram
KMA199E
Product data sheet
VDDE
VSSE
VSSE
Rev. 2 — 7 December 2011
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POWER
LOST
Cblock
VSINP
MUX
AMPLIFIER
VSINN
2
2
A
VCOSP
D
D
A
OUTPUT
BUFFER
VO
OUT/
DIGINT
VCOSN
VSSS
TP0
TP1
TEST CONTROL
Q_PUMP
POWER
LOST
TP2
ARRAY
DIGITAL FILTER
OFFSET
AND
CORRECTION
AVERAGING
EEPROM
CORDIC
ALGORITHM
OFFSET
CALCULATION
ANGULAR
RANGE
ADJUSTMENT
ONE-WIRE
INTERFACE
CL
OSC
DIGITAL BLOCKS (LOGIC)
VSSE
magnetoresistive
sensor bridges
internal
protection
diodes
001aag809
KMA199E
Programmable angle sensor
3 of 32
© NXP B.V. 2011. All rights reserved.
Fig 1. Functional diagram of KMA199E
signal conditioning integrated circuit
GND
KMA199E
NXP Semiconductors
Programmable angle sensor
5. Functional description
The KMA199E amplifies two orthogonal differential signals, which are delivered by MR
sensor bridges and converts them into the digital domain. The angle is calculated using
the COordinate Rotation DIgital Computer (CORDIC) algorithm. After a digital-to-analog
conversion the analog signal is provided to the output. Thus, the output is a linear
representation of the angular value. Zero angle, clamping voltages and angular range are
programmable. In addition, two 16-bit registers are available for customer purposes, like
sample identification.
The KMA199E comprises a Cyclic Redundancy Check (CRC) and an Error Detection and
Correction (EDC) supervision, as well as a magnet-lost detection to ensure a fail-safe
operation. A power-lost detection circuit pulls the analog output to the remaining supply
line, if either the supply voltage or the ground line is interrupted.
After multiplexing the two MR Wheatstone bridge signals and their successive
amplification, the signal is converted into the digital domain by an Analog-to-Digital
Converter (ADC). Further processing is done within an on-chip state machine. This
includes offset cancellation, calculation of the mechanical angle using the CORDIC
algorithm, as well as zero angle and angular range adjustment. The internal
Digital-to-Analog Converter (DAC) and the analog output stage are used for conversion of
the angle information into an analog output voltage, which is ratiometric to the supply
voltage.
The configuration parameters are stored in an user-programmable EEPROM. For this
purpose the OWI, which is accessible via the pin OUT/DIGINT, is used.
5.1 Angular measurement directions
The differential signals of the MR sensor bridges depend only on the direction of the
external magnetic field strength Hext, which is applied parallel to the plane of the sensor. In
order to obtain a correct output signal, the minimum saturation field strength has to be
exceeded.
KMA199E
Product data sheet
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KMA199E
NXP Semiconductors
Programmable angle sensor
α
Hext
001aag741
Fig 2. Angular measurement directions
Since the Anisotropic MR (AMR) effect is periodic over 180, the sensor output is also
180-periodic, whereas the angle is calculated relative to a freely programmable zero
angle. The dashed line indicates the mechanical zero degree position.
6. Diagnostic features
The KMA199E provides four diagnostic features:
6.1 EEPROM CRC and EDC supervision
The KMA199E includes a supervision of the programmed data. At power-on, a CRC of the
EEPROM is done. Furthermore the EEPROM is protected against bit errors. For this
purpose every 16-bit data word is saved internally as a 22-bit word. The protection logic
corrects any single-bit error in a data word, while the sensor continues in normal operation
mode and can detect all double-bit errors by going into diagnostic mode.
6.2 Magnet-lost detection
If the applied magnetic field strength is not sufficient, the KMA199E raises a diagnostic
condition. In order to enter the diagnostic mode, due to EEPROM CRC or magnet-lost
detection, the device can be programmed for an active diagnostic mode, where the output
is driven below 4 %VDD or above 96 %VDD.
KMA199E
Product data sheet
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KMA199E
NXP Semiconductors
Programmable angle sensor
6.3 Power-lost detection
The power-lost detection circuits enable the detection of an interrupted supply or ground
line of the KMA199E. In case of a power-lost condition, two internal switches within the
sensor are closed, connecting the pin of the analog output with the pins of the supply
voltage and the ground.
KMA199E
VDD
ZO(pl)
OUT/DIGINT
ZO(pl)
GND
001aag810
Fig 3. Equivalent output circuit in case of a power-lost condition
Table 3 shows the resulting output voltage depending on the error case and the load
resistance.
Table 3.
Power-lost behavior
Load resistance
Supply voltage lost
Ground lost
RL > 5 k
VO  4 %VDD
VO  96 %VDD
6.4 Low supply voltage detection
If the supply voltage is below the switch-off threshold voltage, a status bit is set.
Following table describes the behavior of the analog output at different supply voltages.
Table 4.
Supply voltage behavior
Voltage range
Description
Analog output
0 V to  1.5 V
the output drives an active LOW, but the
switches of the power-lost detection circuits
are not fully opened and set the output to a
level between ground and half the supply
voltage
actively driven output to a
voltage level between ground
and half the supply voltage
 1.5 V to VPOR
all modules begin to work and the power-on
reset is active
diagnostics at LOW level
VPOR to Vth(on) or
Vth(off)
all modules begin to work and the digital part is EEPROM defined diagnostic
initialized
level
Vth(on) or Vth(off) to analog output is switched on after power-on
4.5 V
time and represents the measured angle
4.5 V to 5.5 V
KMA199E
Product data sheet
analog output of the
measured angle without the
specified accuracy
normal operation where the sensor works with analog output of the
the specified accuracy
measured angle
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KMA199E
NXP Semiconductors
Programmable angle sensor
7. Analog output
The KMA199E provides one analog output signal on pin OUT/DIGINT. The measured
angle  is converted linearly into a value, which is ratiometric to the supply voltage VDD.
For this purpose either a positive or a negative slope is provided.
The following table describes the analog output behavior for a positive slope. If for
example a magnetic field angle, larger than the programmed maximum angle max, but
smaller than the clamp switch angle sw(CL) is applied to the sensor, the analog output is
set to the upper clamping voltage. But if the magnetic field angle is even larger than the
clamp switch angle, the analog output switches from upper to lower clamping voltage. In
case of a negative slope, the clamping voltages are changed.
Table 5.
Analog output behavior for a positive slope
Magnetic field angle
Analog output
max <  < sw(CL)
V(CL)u
sw(CL) <  < ref + 180
V(CL)l
The analog output voltage range codes both angular and diagnostic information. A valid
value of the angle is between the upper and lower clamping voltage. If the analog output is
in the diagnostic range, that is below 4 %VDD or above 96 %VDD, an error condition has
been detected. The analog output repeats every 180.
VO
(%VDD)
αrng
V(CL)u
V(CL)I
0
αref
α (deg)
αmax
180
αsw(CL)
αref + 180°
001aag811
max = ref + rng
Fig 4. Characteristic of the analog output
KMA199E
Product data sheet
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NXP Semiconductors
Programmable angle sensor
8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
supply voltage
Conditions
tinit < 200 h
Min
Max
Unit
0.3
+5.7
V
[1]
-
6.0
V
[2]
0.3
VDD + 0.3 V
-
150
mA
VO
output voltage
Ir
reverse current
Tamb
ambient temperature
40
+160
C
Tamb(pr)
programming ambient
temperature
10
70
C
Tstg
storage temperature
40
+125
C
Tamb < 70 C
EEPROM
tret(D)
data retention time
Nendu(W_ER) write or erase endurance
Tamb = 50 C
17
-
year
Tamb(pr) = 70 C
100
-
cycle
[1]
Time until sensor environment is initialized.
[2]
The maximum value of the output voltage is 5.7 V.
9. Recommended operating conditions
Table 7.
Operating conditions
In a homogenous magnetic field.
Symbol
Parameter
Conditions
[1]
Min
Typ
Max
Unit
4.5
5.0
5.5
V
VDD
supply voltage
Tamb
ambient temperature
40
-
+160
C
Tamb(pr)
programming ambient temperature
10
-
70
C
CL
load capacitance
[2]
0.33
-
22
nF
blocking capacitance
[3]
75
100
-
nF
RL
load resistance
[4]
Hext
external magnetic field strength
Cblock
5
-

k
35
-
-
kA/m
[1]
Normal operation mode.
[2]
Between ground and analog output, as close as possible to the package.
[3]
Between ground and supply voltage, as close as possible to the package and with a low equivalent series
resistance.
[4]
Power-lost detection is only possible with a load resistance within the specified range.
10. Thermal characteristics
Table 8.
KMA199E
Product data sheet
Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from junction
to ambient
Conditions
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Rev. 2 — 7 December 2011
Typ
Unit
120
K/W
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KMA199E
NXP Semiconductors
Programmable angle sensor
11. Characteristics
Table 9.
Supply current
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
[1][2]
supply current
IDD
[1]
Normal operation mode.
[2]
Without load current at the analog output.
Min
Typ
Max
Unit
-
-
10
mA
Table 10. Power-on reset
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vth(on)
switch-on threshold
voltage
analog output switches on, if
VDD > Vth(on)
4.20
4.30
4.49
V
Vth(off)
switch-off threshold
voltage
analog output switches off, if
VDD < Vth(off)
-
4.20
4.30
V
Vhys
hysteresis voltage
Vhys = Vth(on)  Vth(off)
0.1
-
0.4
V
VPOR
power-on reset voltage
IC is initialized
2.4
-
3.3
V
Unit
Table 11. System performance
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
Min
Typ
Max
[1]
res
angle resolution
-
-
0.04
deg
max
maximum angle
programmable angular range
for V(CL)u  V(CL)l  80 %VDD
[2]
5
-
180
deg
ref
reference angle
programmable zero angle
[2]
0
-
180
deg
VO(nom)
nominal output voltage
at full supply operating range
5
-
95
%VDD
VO(udr)
upper diagnostic range
output voltage
[3]
96
-
100
%VDD
VO(ldr)
lower diagnostic range
output voltage
[3]
0
-
4
%VDD
V(CL)u
upper clamping voltage
[4]
40
-
95
%VDD
V(CL)l
lower clamping voltage
[4]
5
-
30.5
%VDD
V(CL)
clamping voltage variation
deviation from programmed
value
0.3
-
+0.3
%VDD
IO
output current
normal operation mode;
operating as sink or source
-
-
2
mA
Vn(o)(RMS)
RMS output noise voltage
equivalent power noise
-
0.4
2.5
mV
1.55
-
+1.55
deg
-
-
0.8
deg
-
-
0.55
deg
lin
linearity error
temp
temperature drift error
[5]
[5][6]
[1][5][6]
[7][8]
tempRT
[6][7][8]
temperature drift error at
room temperature
KMA199E
Product data sheet
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NXP Semiconductors
Programmable angle sensor
Table 11. System performance …continued
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
hys
Parameter
hysteresis error
Conditions
Min
Typ
Max
Unit
referred to input
[5][6]
-
-
0.09
deg
[5][6]
0.1
-
+0.1
deg
-
-
210

lin
microlinearity error
referred to input
ZO(pl)
power-lost output
impedance
impedance to remaining supply
line in case of lost supply
voltage or lost ground
[1]
At a nominal output voltage between 5 %VDD and 95 %VDD and a maximum angle of max = 180.
[2]
In steps of resolution < 0.022.
[3]
Activation is dependent on the programmed diagnostic mode.
[4]
In steps of 0.02 %VDD.
[5]
At a low-pass filtered analog output with a cut-off frequency of 0.7 kHz.
[6]
See Section 12.
[7]
Temperature range 40 C to +140 C.
[8]
Based on a 3 standard deviation.
Table 12. Dynamics
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ton
turn-on time
until first valid result
-
-
5
ms
fupd
update frequency
2
3.125
-
kHz
ts
settling time
-
-
1.8
ms
tcmd(ent)
enter command mode time after power on
16
-
26
ms
Min
Typ
Max
Unit
after an ideal mechanical angle
step of 45, until 90 % of the
final value is reached;
CL = 5 nF
Table 13. Digital interface
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
VIH
HIGH-level input voltage
80
-
-
%VDD
VIL
LOW-level input voltage
-
-
20
%VDD
VOH
HIGH-level output voltage
IO = 2 mA
80
-
-
%VDD
VOL
LOW-level output voltage
IO = 2 mA
-
-
20
%VDD
Iod
overdrive current
absolute value for overdriving
the output buffer
-
-
20
mA
tstart
start time
LOW level before rising edge
5
-
-
s
tstop
stop time
HIGH level before falling edge
5
-
-
s
Tbit
bit period
minimum period may be limited
by the load capacitance
10
-
100
s
tw0
pulse width 0
0.175Tbit
0.25Tbit
0.375Tbit
s
tw1
pulse width 1
0.625Tbit
0.75Tbit
0.825Tbit
s
tto
time-out time
-
-
220
s
KMA199E
Product data sheet
Conditions
digital communication reset
guaranteed after maximum tto
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KMA199E
NXP Semiconductors
Programmable angle sensor
Table 13. Digital interface …continued
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tbit
bit period deviation
deviation between received
clock and sent clock
0.8Tbit
1Tbit
1.2Tbit
s
ttko(slv)
slave takeover time
duration of LOW level for slave
takeover
1
-
5
s
ttko(mas)
master takeover time
duration of LOW level for
master takeover
0Tbit
-
0.5Tbit
s
tprog
programming time
for a single EEPROM address
20
-
-
ms
tcp
charge pump time
waiting time after enabling the
EEPROM charge pump clock
1
-
-
ms
12. Definition of errors
12.1 General
Angular measurement errors by the KMA199E result from linearity errors, temperature
drift errors and hysteresis errors. Figure 5 shows the output signal of an ideal sensor,
where the measured angle meas corresponds ideally to the magnetic field angle . This
curve will further be denoted as angle reference line ref() with a slope of 0.5 %VDD/deg.
φmeas
(deg)
φref(α)
180
α (deg)
001aag812
Fig 5. Definition of the reference line
For valid definition of errors, the angular range is set to max = 180 and the clamping
voltages are programmed to V(CL)l = 5 %VDD and V(CL)u = 95 %VDD.
12.2 Hysteresis error
The hysteresis error hys is defined as the maximum difference between angles, given by
the device output when performing a positive (clockwise) rotation and negative (counter
clockwise) rotation over an angular range of 180, measured at a constant temperature.
KMA199E
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Programmable angle sensor
φmeas
(deg)
Δφhys
180
α (deg)
001aag813
Fig 6. Definition of the hysteresis error
12.3 Linearity error
The deviation of the KMA199E output signal from a best straight line BSL, with the same
slope as the reference line, is defined as linearity error. For measurement of this linearity
error, the magnetic field angle is varied at fixed temperatures. The deviation of the output
signal from the best straight line at the given temperature is the linearity error lin. It is a
function of the magnetic field angle  and the temperature of the device Tamb.
φmeas
(deg)
φBSL(α, Tamb)
φref(α)
Δφlin(α, Tamb)
180
α (deg)
001aag814
Fig 7. Definition of the linearity error
12.4 Microlinearity error
The microlinearity error lin is the deviation of the device output from 1, if the magnetic
field angle  is changed by  = 1.
φmeas
(deg)
φref(α)
Δφmeas = 1° + Δφμlin(α)
Δα = 1°
α (deg)
001aag815
Fig 8. Definition of the microlinearity error
KMA199E
Product data sheet
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Programmable angle sensor
12.5 Temperature drift error
The temperature drift temp is defined as the envelope over the deviation of the angle
versus the temperature range. It is considered as the pure thermal effect.
φmeas
(deg)
Ty
Tx
Δφtemp
180
α (deg)
001aag816
Fig 9. Definition of the temperature drift error
Following mathematical description is given for temperature drift value temp:
 temp() =  meas( , T x) –  meas( , T y)
(1)
with:
Tx: temperature for maximum meas at angle 
Ty: temperature for minimum meas at angle 
The deviation from the value at room temperature tempRT describes the temperature
drift of the angle, compared to the value, which the sensor provides at room temperature:
 temp
RT( ,
T amb) =  meas( , T amb) –  meas( , T RT)
(2)
with:
TRT: room temperature (25 C)
13. Programming
13.1 General description
The KMA199E provides an OWI for programming. For this purpose the pin OUT/DIGINT
can be used bidirectional.
In general the device runs in analog output mode, the normal operation mode, which is
configured by the on-chip programmed data and will be started by default after a power-on
reset and the time ton. In this mode the magnetic field angle is converted into a
corresponding output voltage.
KMA199E
Product data sheet
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Programmable angle sensor
For programming the command mode has to be entered. In this mode the customer can
adjust all required parameters (like zero angle and angular range for example) to his own
application. The data can be stored in the EEPROM, after enabling the internal charge
pump and waiting for tcp. After changing EEPROM constants, the checksum has to be
recalculated and written (see Section 13.4).
In order to enter the command mode, a specific command sequence has to be sent after a
power-on reset and during the time slot tcmd(ent). For this purpose the external source,
which is used to send the command sequence, has to overdrive the output buffer of the
KMA199E, hence it has to provide the current Iod.
During the communication, the KMA199E is always the slave and the external
programming hardware is always the master. Figure 10 illustrates the structure of the OWI
data format.
write
IDLE
START COMMAND DATA BYTE 1 DATA BYTE 2 STOP
IDLE
read
IDLE
START COMMAND HANDOVER DATA BYTE 1 DATA BYTE 2 TAKEOVER STOP IDLE
001aag742
Fig 10. OWI data format
The master has to provide the start condition, which is a rising edge after a LOW level.
Then a command byte is sent, which can be either a read or a write command. Depending
on the command, the master or the slave has to send the data immediately after the
command sequence. In case of a read command, an additional handover or takeover bit
respectively is inserted before and after the data bytes. Each communication has to be
closed with a stop condition driven by the master. If the slave gets no rising edge for a
time longer than tto, a time-out condition will be recognized. Then the bus is reset to the
idle state and waits for a start condition and a new command. This can be used to
synchronize the device regardless of the state before.
All communications are based on this structure (see Figure 10), even for entering the
command mode. In this case a special write command is required, followed by the
command sequence (two data bytes). The customer can access the EEPROM, the
CTRL1, the TESTCTRL0 and the SIGNATURE register, which are described in
Section 13.5. Only a power-on reset will leave the command mode. A more detailed
description of the programming is given in the next sections.
13.2 Timing characteristics
As described in the previous section, a start and stop condition is necessary for
communication. The duration of the LOW level before the rising edge of the start condition
is defined as tstart and the duration of the HIGH level after the rising edge of the stop
condition is defined as tstop. These parameters, as well as all other timing characteristics
can be found in Table 13.
KMA199E
Product data sheet
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Programmable angle sensor
tstart
tstop
001aag817
Fig 11. OWI start and stop condition
Figure 12 shows the coding of a single bit with a HIGH level of VIH and a LOW level of VIL.
Here the pulse width t1 or t0 respectively represents a logic 1 or a logic 0 of a full bit period
Tbit.
bit = 0
bit = 1
Tbit
0.175
Tbit
0.375
0.625
tw0
0.825
tw1
0.25
0.75
001aag818
Fig 12. OWI timing
13.3 Sending and receiving data
For sending or receiving data, the master has to control the communication. The
command byte defines the region, address and type of command, which is requested by
the master, that is either a read or a write command. In case of a read command, an
additional handover or takeover bit respectively has to be inserted before and after the
two data bytes (see Figure 10). However the OWI is a serial data transmission, whereas
the Most Significant Byte (MSB) must be sent at first.
Table 14.
Format of a command byte
7
6
5
4
3
2
1
0
CMD7
CMD6
CMD5
CMD4
CMD3
CMD2
CMD1
CMD0
Table 15.
Command byte bit description
Bit
Symbol
Description
7 to 5
CMD[7:5]
region bits
000 = 16-bit EEPROM
001 to 011 = reserved
100 = 16-bit register
101 to 111 = reserved
4 to 1
CMD[4:1]
address bits
0
CMD0
read/write
0 = write
1 = read
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Programmable angle sensor
A more detailed description of all registers, that can be accessed by the customer, is given
in Section 13.5. Both default value and the complete command, which already includes
the address and write or read request respectively, is listed there.
13.3.1 Write access
In order to write data into the EEPROM, the internal charge pump must be enabled at first
by setting the bits EEP_CP_CLOCK_EN and EEP_WRITE_EN and waiting for tcp.
Afterwards the following procedure must be done:
•
•
•
•
Start condition: The master drives a rising edge after a LOW level
Command: The master sends a write command, that is the last bit is not set
Data: The master sends two data bytes
Stop condition: The master drives a rising edge after a LOW level
Figure 13 shows the write access of the digital interface. The signal OWI represents the
data on the bus, which is either caused by the master or by the slave. The signals master
output enable and slave output enable just symbolize if the master or the slave output is
enabled or disabled respectively.
START
CMD7
CMD0
WDATA15
WDATA0
STOP
IDLE
master
output
enable
OWI
(2)
slave
output
enable
(1)
001aag743
(1) Missing rising edges generate a time-out condition and the written data is ignored.
(2) If the master might not drive the bus, the bus is defined by the bus-pull.
Fig 13. OWI write access
Note: As already mentioned in Section 13.1, even the command mode has to be entered
using the write procedure. Without entering the command mode a digital communication
is not possible and the sensor would work in normal operation mode. After changing a
single address the time tprog must elapse before changing another address. Finally the
checksum has to be recalculated and written, after changing the EEPROM constants
(see Section 13.4).
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13.3.2 Read access
In order to read data from the sensor, the following procedure must be done:
• Start condition: The master drives a rising edge after a LOW level
• Command: The master sends a read command, that is the last bit is set
• Handover: The master sends a handover bit, that is a logic 0 and disables his output
after a three-quarter bit period
• Takeover: The slave drives a LOW level after the falling edge for ttko(slv)
• Data: The slave sends two data bytes
• Handover: The slave sends a handover bit, that is a logic 0 and disables his output
after a three-quarter bit period
• Takeover: The master drives a LOW level after the falling edge for ttko(mas)
• Stop condition: The master drives a rising edge after a LOW level
Figure 14 shows the read access of the digital interface. The signal OWI represents the
data on the bus, which is either caused by the master or by the slave. The signals master
output enable and slave output enable just symbolize if the master or the slave output is
enabled or disabled respectively.
START
CMD7
CMD0
HANDSHAKE
RDATA15
RDATA0
HANDSHAKE
STOP
IDLE
master
output
enable
(3)
OWI
(5)
(1)
slave
output
enable
(2)
(2)
(4)
001aag744
(1) Duration of LOW level for slave takeover ttko(slv).
(2) There is an overlap in the output enables of master and slave, because both drive a LOW
level. However this ensures the independency from having a pull-up or pull-down on the bus.
In addition it improves the ElectroMagnetic Compatibility (EMC) robustness, because all levels
are actively driven.
(3) Duration of LOW level for master takeover ttko(mas).
(4) If the master does not take the bus and a pull-up exists, the stop condition is generated by the
pull-up. Otherwise a time-out is generated if there is a pull-down and the slave waits for a rising
edge as start condition.
(5) If the master might not drive the bus, the bus is defined by the bus-pull.
Fig 14. OWI read access
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13.3.3 Entering the command mode
After a power-on reset, the sensor provides a time slot tcmd(ent) for entering the command
mode. For this purpose a specific command sequence has to be sent (see Figure 15).
Without entering the command mode, the sensor starts in normal operation mode.
However the signature can always be written by the master, if the sensor switches into
diagnostic mode.
During the command mode sequence, the analog output is enabled, hence the external
programming hardware has to overdrive the output with the current Iod. If the command
mode is activated, the analog output will be disabled and the pin OUT/DIGINT works as a
digital interface.
tcmd(ent)
VDD
OWI
START
94h
command
9Bh
A4h
STOP
signature
001aag819
Fig 15. OWI command mode procedure
13.4 Cyclic redundancy check
As already mentioned in Section 6, there is an 8-bit checksum of the EEPROM data. In
order to calculate this value, a CRC has to be generated with the MSB of the EEPROM
data word at first over all corresponding addresses in increasing order.
For calculating the checksum, all addresses from 0h to Fh have to be read out and
consulted. The Least Significant Byte (LSB) of address Fh, which contains the previous
checksum, must be overwritten with 0h before the calculation can be started.
Finally the internal charge pump has to be enabled for programming by setting the bits
EEP_CP_CLOCK_EN and EEP_WRITE_EN (see Table 16) and waiting for tcp.
The generator polynomial for the calculation of the checksum is:
8
2
G(x) = x + x + x + 1
(3)
With a start value of FFh and the data bits are XOR at x8 point.
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Programmable angle sensor
13.4.1 Software example in C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
#include <stdio.h.>
// calc_crc accepts unsigned 16-bit data in data
int calc_crc(int crc, unsigned int data)
{
const int gpoly = 0x107; // generator polynomial
int i;
//index variable
for (i = 15; i >= 0; i--)
{
crc <<= 1;
//shift left
crc = (int) ((data & (1u<<i))>>i);
// XOR of with generator polynomial when MSB(9) = HIGH
if (crc & 0x100) crc ^= gpoly;
}
return crc;
}
int main(void)
{
int crc, crc_res, i;
// 8 LSB are CRC field filled with 0
unsigned int data_seq[] = {0x1111, 0x2222, 0x3333, 0x4444,
0x5555, 0x6666, 0x7777, 0x8888,
0x9999, 0xAAAA, 0xBBBB, 0xCCCC,
0xDDDD, 0xEEEE, 0xFFFF, 0x4200};
// calculate checksum over all data
crc = 0xFF;
// start value of crc register
printf(“Address\tValue\n”);
for (i = 0; i <= 15; i++)
{
printf(“0x%1X\t0x%04X\n”, i, data_seq[i]);
crc = calc_crc(crc, data_seq[i]);
}
crc_res = crc;
// crc_res = 0x6F
printf(“\nChecksum\n0x%02X\n”, crc_res);
// check procedure for above data sequence
crc = 0xFF;
for (i = 0; i <= 14; i++)
crc = calc_crc(crc, data_seq[i]);
// last word gets crc inserted
crc = calc_crc(crc, data_seq[i]  crc_res);
printf(“\nCheck procedure for data sequence: must be 0x00 is 0x%02X.\n”,crc);
return 1;
}
The checksum of this data sequence is 6Fh.
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13.5 Registers
13.5.1 Command registers
In order to enter the command mode, the signature given in Table 16 has to be written via
the OWI into the specific register. This must be done as described in Section 13.3.3, with
a write command, followed by the signature, but after a power-on reset and not later than
tcmd(ent).
Table 16.
Command registers
Command Register
write/read
Bit
Access Field
Description
82h/83h
15
R
IN_DIAG_MODE
shows if there is a diagnostic condition present;
this bit is not affected by the setting of the register
field FORCE_DIAG_OFF
14
R/W
FORCE_DIAG_OFF
force diagnostic mode off; default: 0b
reserved
CTRL1
13
-
-
12
R
LOW_VOLTAGE_DET low voltage condition detected
11
R/W
EEP_CP_CLOCK_EN
charge pump clock on (must be set after setting
EEPROM write enable signal for writing to
EEPROM); default: 0b
10 and 9 -
-
reserved
8
R
EEP_ERR_CORRECT EDC: EEPROM error has been corrected; updated
every EEPROM readout and stays set once set
7
R
EEP_UNCORR_ERR
6
R
MAGNET_LOST_DET magnet-lost detected; bit stays set even if the
condition disappears; for this detection which leads
to diagnostic mode, the magnet-lost detection must
be enabled
5
-
-
reserved
4
R
CRC_BAD
CRC check has failed (checked during start-up)
3 to 0
-
-
reserved
EDC: EEPROM uncorrectable error has been
detected; updated every EEPROM readout and
stays set once set
94h/-
SIGNATURE 15 to 0
W
SIGNATURE
write signature 9BA4h within tcmd(ent) to enter
command mode; for more details see
Section 13.3.3
96h/97h
TESTCTRL0 15 to 12
-
-
reserved
W
EEP_WRITE_EN
EEPROM write enable signal (must be set before
writing to EEPROM)
11
0605h — disabled (default)
0E05h — enabled
10 to 0
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13.5.2 EEPROM registers
The device includes several internal registers, which are used for purposes, such as
customization and identification.
The initial signature allows read access to all areas, but write access just to customer
registers only. Write accesses to reserved areas are ignored. Since these registers are
implemented as EEPROM cells, writing to the registers needs a specific time tprog after
each write access.
Since there is no check for the programming time, the user has to take care that no other
access to the EEPROM is done during the programming. The EEPROM must not be
addressed during the time tprog.
Note: Before data can be stored in the EEPROM, the internal charge pump has to be
switched on for the duration of programming by setting register CTRL1, bit 11
EEP_CP_CLOCK_EN, as well as register TESTCTRL0, bit 11 EEP_WRITE_EN. For
calculating the checksum, all register addresses have to be read out and consulted,
although some of them are reserved for calibration purposes.
Table 17.
EEPROM registers
Address Command Register
write/read
Bit
Description
Default
MSB/LSB
0h
00h/01h
-
addresses are reserved for calibration purposes
[1]
1h
02h/03h
2h
04h/05h
3h
06h/07h
4h
08h/09h
5h
0Ah/0Bh
6h
0Ch/0Dh
7h
0Eh/0Fh
ZERO_ANGLE
15 to 0
mechanical zero degree position
00h/00h
8h
10h/11h
MAGNET_LOST
15 to 0
magnet-lost detection
00h/00h
reserved
Note: These addresses have to be read out for
calculating the checksum. The content stored in
these registers may not be changed!
0000h — disabled
004Fh — enabled
9h
Ah
Bh
12h/13h
14h/15h
16h/17h
ANG_RNG_MULT_LSB 15 to 3
CLAMP_LO
CLAMP_HI
least significant bits of angular range multiplicator 20h/00h
2 to 0
undefined[2]
15 to 13
undefined[2]
12 to 0
lower clamping level output voltage
15 to 13
undefined[2]
12 to 0
upper clamping level output voltage
01h/00h
12h/FFh
Ch
18h/19h
ID_LO
15 to 0
lower 16 bits of identification code
00h/00h
Dh
1Ah/1Bh
ID_HI
15 to 0
upper 16 bits of identification code
00h/00h
Eh
1Ch/1Dh
CLAMP_SW_ANGLE
15 to 6
when angle is bigger than CLAMP_SW_ANGLE FFh/C1h
the output will switch to CLAMP_LO for a positive
slope
ANG_RNG_MULT_MSB 5 to 0
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Table 17.
EEPROM registers …continued
Address Command Register
write/read
Bit
Fh
15 and 14 undefined[2]
1Eh/1Fh
EEP_CTRL_CUST
Description
Default
MSB/LSB
0Ch/[1]
13 and 12 DIAGNOSTIC_LEVEL; diagnostic level behavior
of analog output
00 — active LOW (in lower diagnostic range) with
driver strength of the analog output
01 — active HIGH (in upper diagnostic range)
with driver strength of the analog output
10 — reserved
11 — reserved
11 and 10 reserved; may not be changed
9
undefined[2]
8
SLOPE_DIR; slope of analog output
0 — rising (not inverted)
1 — falling (inverted)
7 to 0
[1]
Variable and individual for each device.
[2]
Undefined; must be written as zero for default.
CRC; checksum over all data (see Section 13.4)
Table 18. ZERO_ANGLE - mechanical zero degree position (address 7h) bit allocation
Data format: unsigned fixed point; resolution: 216.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Value
21
22
23
24
25
26
27
28
29
210
211
212
213
214
215
216
Mechanical angular range 0000h = 0 to FFFFh = 180  1 LSB
Examples:
• Mechanical zero angle 0 = 0000h
• Mechanical zero angle 10 = 0E38h
• Mechanical zero angle 45 = 4000h
Table 19. ANG_RNG_MULT_LSB - least significant bits of angular range multiplicator (address 9h) bit allocation
Data format: unsigned fixed point; resolution: 214.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Value
22
23
24
25
26
27
28
29
210
211
212
213
214
U[1]
U[1]
U[1]
[1]
Undefined; must be written as zero for default and may return any value when read.
CLAMP_HI – CLAMP_LO
180
ANG_RNG_MULT = --------------------------------------------------------------------  ----------------------------------------------------8192
ANGULAR_RANGE
(4)
Table 20. CLAMP_LO - lower clamping level output voltage (address Ah) bit allocation
Data format: integer (DAC values 256 to 4864); resolution: 20.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Value
U[1]
U[1]
U[1]
212
211
210
29
28
27
26
25
24
23
22
21
20
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[1]
Undefined; must be written as zero for default and may return any value when read.
Values 0 to 255 are reserved. It is not permitted to use such values.
Examples:
• 100 %VDD = 5120 (reserved)
• 10 %VDD = 512
• 5 %VDD = 256
Table 21. CLAMP_HI - upper clamping level output voltage (address Bh) bit allocation
Data format: integer (DAC values 256 to 4864); resolution: 20.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Value
U[1]
U[1]
U[1]
212
211
210
29
28
27
26
25
24
23
22
21
20
[1]
Undefined; must be written as zero for default and may return any value when read.
Values 4865 to 5120 are reserved. It is not permitted to use such values.
Examples:
• 100 %VDD = 5120 (reserved)
• 95 %VDD = 4864
• 90 %VDD = 4608
Table 22. ANG_RNG_MULT_MSB - most significant bits of angular range multiplicator (address Eh) bit allocation
Data format: unsigned fixed point.
Bit
15
14
13
Value
12
11
10
9
8
7
6
CLAMP_SW_ANGLE
5
4
3
2
1
0
24
23
22
21
20
21
CLAMP_HI – CLAMP_LO
180
ANG_RNG_MULT = --------------------------------------------------------------------  ----------------------------------------------------8192
ANGULAR_RANGE
(5)
Examples:
•
4864 – 256 180
ANG_RNG_MULT = ---------------------------  ----------- = 0.5625
8192
180
•
4864 – 256 90
ANG_RNG_MULT = ---------------------------  ----------- = 1.125
8192
180
Table 23. CLAMP_SW_ANGLE - clamp switch angle (address Eh) bit allocation
Data format: unsigned fixed point.
Bit
15
14
13
12
11
10
9
8
7
6
Value
21
22
23
24
25
26
27
28
29
210
5
4
3
2
1
0
ANG_RNG_MULT_MSB
Mechanical angular range 0000h = 0 to 3FFh = 180  1 LSB.
1
CLAMP_HI – CLAMP_LO
1
CLAMP_SW_ANGLE = ---   1 + ---------------------------------------------------------------------  -------------------------------------------------
2 
8192
ANG_RNG_MULT
(6)
If the magnetic field angle is larger than the CLAMP_SW_ANGLE, the output will switch to
CLAMP_LO for a positive slope. The value of CLAMP_SW_ANGLE can be calculated
from other EEPROM constants, but must be programmed.
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14. Electromagnetic compatibility
EMC is achieved by the KMA199E.
14.1 Emission (CISPR 25)
Tests according to CISPR 25 were fulfilled.
14.1.1 Conducted radio disturbance
Test of the device according to CISPR 25, chapter 11 (artificial network).
Class: 5.
14.1.2 Radiated radio disturbance
Test of the device according to CISPR 25, chapter 13 (anechoic chamber component/module).
Class: 5 (without addition of 6 dB in FM band).
14.2 Radiated disturbances (ISO 11452-2, ISO 11452-4 and ISO 11452-5)
The common understanding of the requested function is that an effect is tolerated as
described in Table 24 during the disturbance. If the KMA199E operates in operation
mode, the Radio Frequency (RF) noise will occur on the signal and supply line.
Table 24.
Failure condition for radiated disturbances
Parameter
Comment
Min
Max
Unit
Variation of output signal in analog
output mode
value measured relative to the
output at test start
-
0.9
%VDD
14.2.1 Absorber lined shielded enclosure
Tests according to ISO 11452-2 were fulfilled.
Test levels:
> 200 V/m 200 MHz to 400 MHz (step 10 MHz)
> 200 V/m 400 MHz to 1000 MHz (step 25 MHz)
> 200 V/m 1 GHz to 10 GHz (step 100 MHz)
Modulation: Continuous Wave (CW); AM: 1 kHz, 80 %.
State: A.
14.2.2 Bulk-current injection
Tests according to ISO 11452-4 were fulfilled.
Test level: 200 mA with CL = 1 nF.
State: A.
14.2.3 Strip line
Tests according to ISO 11452-5 were fulfilled.
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Test level: 200 V/m with CL = 1 nF.
State: A.
In deviation of ISO 11452-5 the measurement must be taken up to 1 GHz.
14.2.4 Immunity against mobile phones
Tests according to ISO 11452-2 were fulfilled.
State: A.
Definition of Global System for Mobile Communications (GSM) signal:
• Pulse modulation: per GSM specification (217 Hz; 12.5 % duty cycle)
• Modulation grade:  60 dB
• Sweep: linear 800 MHz to 3 GHz (duration 10 s at 890 MHz, 940 MHz and 1.8 GHz
band)
• Antenna polarization: vertical, horizontal
• Field strength: 200 V/m during on-time (calibration in CW)
In deviation of ISO 11452-2 a GSM signal (definition see above) instead of an AM signal
was used.
14.3 Transients - pulses (ISO 7637-1 and ISO 7637-3)
The KMA199E is designed for a stabilized 5 V supply. To raise immunity against
non-galvanic coupled transient pulses, protection diodes are implemented into the
KMA199E.
For applications with disturbances by capacitive or inductive coupling on supply line or
radiated disturbances an application circuit is recommended. Applications with this
arrangement passed the EMC tests according to the product standard 1 (electrical
transient transmission by capacitive or inductive coupling) and standard 3 (radiated
disturbances).
The common understanding of the requested function is that an effect is tolerated as
described in Table 25 during the disturbance. Class C means that the device goes into
reset or diagnostic mode and comes back after disturbances. If the KMA199E operates in
normal operation mode, the test pulses are visible on the signal line. A protection circuit is
used. The KMA199E is directly supplied with 5 V.
Table 25.
Failure condition for transients
Parameter
Comment
Min
Max
Unit
Variation of output signal after exposure to
pulses in analog output mode
value measured relative to
the output at test start
-
0.9
%VDD
14.3.1 Coupled
Tests according to ISO 7637-3 were fulfilled.
Level of pulses: IV (60 V for pulse 3a and +40 V for pulse 3b).
Class: B for pulse 3a, B for pulse 3b.
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Test time: 10 min.
Transient transmission by capacitive and inductive coupling via lines other than supply
lines (interface, analog output) have to be tolerated according to ISO 7637-3 (pulses 3a
and 3b).
15. ElectroStatic Discharge (ESD)
To raise immunity against ESD pulses, protection diodes are implemented into the
KMA199E.
15.1 Human body model
The KMA199E must not be damaged at 8 kV, according to the human body model at
100 pF and 1.5 k. The test is according to AEC-Q100, Rev-E, method 002. This
protection must be ensured at all external pins (OUT/DIGINT, VDD and GND).
Furthermore all interconnects (pins between package head and package body) must not
be damaged at 2 kV, according to AEC-Q100, Rev-E, method 002.
15.2 Machine model
The KMA199E must not be damaged at 400 V, according to the machine model. The test
is according to AEC-Q100, Rev-E, method 003. This protection must be ensured at all
external pins (OUT/DIGINT, VDD and GND).
Furthermore all interconnects (pins between package head and package body) must not
be damaged at 200 V, according to AEC-Q100, Rev-E, method 003.
All pins have a latch-up protection.
16. Application information
VDD
pull-up to VDD or
pull-down to GND
VDD
1
KMA199E
3
Cblock
2
OUT/DIGINT
FILTER
fg = 0.7 kHz
1st order
OUT/DIGINT
CL
GND
GND
KMA199E and external
capacitances
electronic control unit
001aag820
(1) The block capacitance Cblock is used to suppress noise on the supply line of the device. For best
functionality, the capacitances should be mounted close to the pins of the device.
Fig 16. Application diagram of KMA199E
KMA199E
Product data sheet
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Rev. 2 — 7 December 2011
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KMA199E
NXP Semiconductors
Programmable angle sensor
17. Marking
N NNNN
2.1 min
batch
number
A
X Y Y Y Z
B
C
001aag745
Marking paint: laser
Code: see drawing
Type face: DIN 1451 condensed type
Letter height: 0.8 mm
Line spacing: 0.25 mm
Crossing of lines not allowed
A: leading letters of type number (5 characters max.)
B: number and attached letters of type number (6 characters max.)
C: day code/date code
All lines A to C to be marked in centered position
Date code: x yyy z
x: product manufacturing code; m for manufacturing Manila
Day code: x yyy z
x: --y: day of year
z: year of production (last figure)
Fig 17. Marking
18. Terminals
Lead frame material: CuZr with 99.9 % Cu and 0.1 % Zr
Lead finish: matt tin; thickness 7 m to 11 m
KMA199E
Product data sheet
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Rev. 2 — 7 December 2011
© NXP B.V. 2011. All rights reserved.
27 of 32
KMA199E
NXP Semiconductors
Programmable angle sensor
19. Package outline
Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads
SOT880
view A-B
HE1
A
B
E
Q1
L1
b1
D
L
(1)
(1)
HE
D1
A
A
B
(1)
Q1
A
L2
1
2
e
3
b
c
w A
v B
HE2
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
mm
1.65
1.45
b
b1
0.41 1.57
0.34 1.47
c
D
D1
0.30
0.24
4.1
3.9
8.1
7.9
E
e
5.45
2.54
5.25
HE
HE1
HE2
max
21.4 6.42
5.85
21.0 6.32
L
L1
L2
min
Q1
v
w
7.1
6.9
0.85
0.75
4.75
0.65
0.55
0.4
1.2
Note
1. Terminals within this zone are uncontrolled to allow for flow of plastic between and besides the leads.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
07-09-03
07-09-11
SOT880
Fig 18. Package outline SOT880
KMA199E
Product data sheet
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Rev. 2 — 7 December 2011
© NXP B.V. 2011. All rights reserved.
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KMA199E
NXP Semiconductors
Programmable angle sensor
20. Handling information
(2)
0.7 (1)
0.7 (1)
R 0.25 min
(2)
0.7 (1)
R 0.25 min
006aaa246
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 19. Bending recommendation
21. Solderability information
The solderability qualification is done according to AEC-Q100, Rev-E. Recommended
soldering process for leaded devices is wave soldering. The maximum soldering
temperature is 260 C for maximum 5 s. Device terminals shall be compatible with laser
and electrical welding.
22. Revision history
Table 26.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KMA199E_2
20111207
Product data sheet
PCN 201106032F01
KMA199E_1
Modifications:
KMA199E_1
KMA199E
Product data sheet
•
Section 18 “Terminals”: Lead finish dimensions changed
20071018
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 December 2011
-
© NXP B.V. 2011. All rights reserved.
29 of 32
KMA199E
NXP Semiconductors
Programmable angle sensor
23. Legal information
23.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
23.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
23.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
KMA199E
Product data sheet
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer's own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 December 2011
© NXP B.V. 2011. All rights reserved.
30 of 32
KMA199E
NXP Semiconductors
Programmable angle sensor
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
23.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
24. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
KMA199E
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 7 December 2011
© NXP B.V. 2011. All rights reserved.
31 of 32
KMA199E
NXP Semiconductors
Programmable angle sensor
25. Contents
1
1.1
1.2
2
3
4
5
5.1
6
6.1
6.2
6.3
6.4
7
8
9
10
11
12
12.1
12.2
12.3
12.4
12.5
13
13.1
13.2
13.3
13.3.1
13.3.2
13.3.3
13.4
13.4.1
13.5
13.5.1
13.5.2
14
14.1
14.1.1
14.1.2
14.2
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Angular measurement directions . . . . . . . . . . . 4
Diagnostic features . . . . . . . . . . . . . . . . . . . . . . 5
EEPROM CRC and EDC supervision. . . . . . . . 5
Magnet-lost detection . . . . . . . . . . . . . . . . . . . . 5
Power-lost detection . . . . . . . . . . . . . . . . . . . . . 6
Low supply voltage detection . . . . . . . . . . . . . . 6
Analog output. . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Thermal characteristics . . . . . . . . . . . . . . . . . . 8
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Definition of errors. . . . . . . . . . . . . . . . . . . . . . 11
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Hysteresis error . . . . . . . . . . . . . . . . . . . . . . . 11
Linearity error . . . . . . . . . . . . . . . . . . . . . . . . . 12
Microlinearity error . . . . . . . . . . . . . . . . . . . . . 12
Temperature drift error . . . . . . . . . . . . . . . . . . 13
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . 13
General description . . . . . . . . . . . . . . . . . . . . 13
Timing characteristics . . . . . . . . . . . . . . . . . . . 14
Sending and receiving data . . . . . . . . . . . . . . 15
Write access . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Read access . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Entering the command mode . . . . . . . . . . . . . 18
Cyclic redundancy check . . . . . . . . . . . . . . . . 18
Software example in C . . . . . . . . . . . . . . . . . . 19
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Command registers . . . . . . . . . . . . . . . . . . . . 20
EEPROM registers . . . . . . . . . . . . . . . . . . . . . 21
Electromagnetic compatibility . . . . . . . . . . . . 24
Emission (CISPR 25) . . . . . . . . . . . . . . . . . . . 24
Conducted radio disturbance . . . . . . . . . . . . . 24
Radiated radio disturbance. . . . . . . . . . . . . . . 24
Radiated disturbances (ISO 11452-2,
ISO 11452-4 and ISO 11452-5) . . . . . . . . . . . 24
14.2.1
Absorber lined shielded enclosure . . . . . . . . . 24
14.2.2
Bulk-current injection . . . . . . . . . . . . . . . . . . . 24
14.2.3
Strip line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
14.2.4
14.3
Immunity against mobile phones . . . . . . . . . .
Transients - pulses (ISO 7637-1 and
ISO 7637-3) . . . . . . . . . . . . . . . . . . . . . . . . . .
14.3.1
Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15
ElectroStatic Discharge (ESD) . . . . . . . . . . . .
15.1
Human body model . . . . . . . . . . . . . . . . . . . .
15.2
Machine model. . . . . . . . . . . . . . . . . . . . . . . .
16
Application information . . . . . . . . . . . . . . . . .
17
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
20
Handling information . . . . . . . . . . . . . . . . . . .
21
Solderability information . . . . . . . . . . . . . . . .
22
Revision history . . . . . . . . . . . . . . . . . . . . . . .
23
Legal information . . . . . . . . . . . . . . . . . . . . . .
23.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
23.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
23.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
23.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
24
Contact information . . . . . . . . . . . . . . . . . . . .
25
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
25
25
25
26
26
26
26
27
27
28
29
29
29
30
30
30
30
31
31
32
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 December 2011
Document identifier: KMA199E
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