Data Sheet

MF1S70yyX/V1
MIFARE Classic EV1 4K - Mainstream contactless smart card
IC for fast and easy solution development
Rev. 3.1 — 8 September 2014
279331
Product data sheet
COMPANY PUBLIC
1. General description
NXP Semiconductors has developed the MIFARE Classic MF1S70yyX/V1 to be used in a
contactless smart card according to ISO/IEC 14443 Type A.
The MIFARE Classic EV1 4K MF1S70yyX/V1 IC is used in applications like public
transport ticketing and can also be used for various other applications.
1.1 Anticollision
An intelligent anticollision function allows to operate more than one card in the field
simultaneously. The anticollision algorithm selects each card individually and ensures that
the execution of a transaction with a selected card is performed correctly without
interference from another card in the field.
energy
MIFARE
CARD PCD
data
001aam199
Fig 1.
Contactless MIFARE system
1.2 Simple integration and user convenience
The MF1S70yyX/V1 is designed for simple integration and user convenience which allows
complete ticketing transactions to be handled in less than 100 ms.
1.3 Security and privacy
•
•
•
•
Manufacturer programmed 7-byte UID or 4-byte NUID identifier for each device
Random ID support
Mutual three pass authentication (ISO/IEC DIS 9798-2)
Individual set of two keys per sector to support multi-application with key hierarchy
MF1S70yyX/V1
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MIFARE Classic EV1 4K - Mainstream contactless smart card IC
1.4 Delivery options
• 7-byte UID, 4-byte NUID
• Bumped die on sawn wafer
• MOA4 and MOA8 contactless module
2. Features and benefits
 Contactless transmission of data and
energy supply
 Operating distance up to 100 mm
depending on antenna geometry and
reader configuration
 Data transfer of 106 kbit/s
 Anticollision
 Operating frequency of 13.56 MHz
 Data integrity of 16-bit CRC, parity, bit
coding, bit counting
 Typical ticketing transaction time of
 7 Byte UID or 4 Byte NUID
< 100 ms (including backup
management)
 Random ID support (7 Byte UID version)
2.1 EEPROM
 4 kB, organized in 32 sectors of 4 blocks  User definable access conditions for
and 8 sectors of 16 blocks (one block
each memory block
consists of 16 byte)
 Data retention time of 10 years
 Write endurance 200000 cycles
3. Applications








Public transportation
Electronic toll collection
School and campus cards
Internet cafés
Access management
Car parking
Employee cards
Loyalty
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Ci
input capacitance
fi
input frequency
Conditions
[1]
Min
Typ
Max
Unit
14.9
16.9
19.0
pF
-
13.56
-
MHz
EEPROM characteristics
tret
retention time
Tamb = 22 C
10
-
-
year
Nendu(W)
write endurance
Tamb = 22 C
100000
200000
-
cycle
[1]
MF1S70yyX_V1
Product data sheet
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Tamb=22°C, f=13,56Mhz, VLaLb = 1,5 V RMS
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5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
MF1S7001XDUD/V1 FFC Bump 8 inch wafer, 120 m thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S7001XDUF/V1 FFC Bump 8 inch wafer, 75 m thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
-
MF1S7000XDA4/V1
MOA4
plastic leadless module carrier package; 35 mm wide tape, 7-byte UID
SOT500-2
MF1S7000XDA8/V1
MOA8
plastic leadless module carrier package; 35 mm wide tape, 7-byte UID
SOT500-4
MF1S7031XDUD/V1 FFC Bump 8 inch wafer, 120 m thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S7031XDUF/V1 FFC Bump 8 inch wafer, 75 m thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
-
MF1S7030XDA4/V1
MOA4
plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
SOT500-2
MF1S7030XDA8/V1
MOA8
plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
SOT500-4
6. Block diagram
RF
INTERFACE
UART
ISO/IEC 14443
TYPE A
POWER ON
RESET
CRYPTO1
RNG
VOLTAGE
REGULATOR
CRC
CLOCK
INPUT FILTER
RESET
GENERATOR
LOGIC UNIT
EEPROM
001aan006
Fig 2.
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Product data sheet
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Block diagram of MF1S70yyX/V1
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7. Pinning information
7.1 Pinning
The pinning for the MF1S70yyX/V1DAx is shown as an example in Figure 3 for the MOA4
contactless module. For the contactless module MOA8, the pinning is analogous and not
explicitly shown.
LA
top view
LB
001aan002
Fig 3.
Table 3.
MF1S70yyX_V1
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Pin configuration for SOT500-2 (MOA4)
Pin allocation table
Pin
Symbol
LA
LA
Antenna coil connection LA
LB
LB
Antenna coil connection LB
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8. Functional description
8.1 Block description
The MF1S70yyX/V1 chip consists of a 4 kB EEPROM, RF interface and Digital Control
Unit. Energy and data are transferred via an antenna consisting of a coil with a small
number of turns which is directly connected to the MF1S70yyX/V1. No further external
components are necessary. Refer to the document Ref. 1 for details on antenna design.
• RF interface:
– Modulator/demodulator
– Rectifier
– Clock regenerator
– Power-On Reset (POR)
– Voltage regulator
• Anticollision: Multiple cards in the field may be selected and managed in sequence
• Authentication: Preceding any memory operation the authentication procedure
ensures that access to a block is only possible via the two keys specified for each
block
• Control and Arithmetic Logic Unit: Values are stored in a special redundant format and
can be incremented and decremented
• EEPROM interface
• Crypto unit: The CRYPTO1 stream cipher of the MF1S70yyX/V1 is used for
authentication and encryption of data exchange.
• EEPROM: 4 kB is organized in 32 sectors of 4 blocks and 8 sectors of 16 blocks. One
block contains 16 bytes. The last block of each sector is called “trailer”, which
contains two secret keys and programmable access conditions for each block in this
sector.
8.2 Communication principle
The commands are initiated by the reader and controlled by the Digital Control Unit of the
MF1S70yyX/V1. The command response is depending on the state of the IC and for
memory operations also on the access conditions valid for the corresponding sector.
8.2.1 Request standard / all
After Power-On Reset (POR) the card answers to a request REQA or wakeup WUPA
command with the answer to request code (see Section 9.4, ATQA according to ISO/IEC
14443A).
8.2.2 Anticollision loop
In the anticollision loop the identifier of a card is read. If there are several cards in the
operating field of the reader, they can be distinguished by their identifier and one can be
selected (select card) for further transactions. The unselected cards return to the idle state
and wait for a new request command. If the 7-byte UID is used for anticollision and
selection, two cascade levels need to be processes as defined in ISO/IEC 14443-3.
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Remark: For the 4-byte non-unique ID product versions, the identifier retrieved from the
card is not defined to be unique. For further information regarding handling of non-unique
identifiers see Ref. 6.
8.2.3 Select card
With the select card command the reader selects one individual card for authentication
and memory related operations. The card returns the Select AcKnowledge (SAK) code
which determines the type of the selected card, see Section 9.4. For further details refer to
the document Ref. 2.
8.2.4 Three pass authentication
After selection of a card the reader specifies the memory location of the following memory
access and uses the corresponding key for the three pass authentication procedure. After
a successful authentication all commands and responses are encrypted.
Remark: The HLTA command needs to be sent encrypted to the PICC after a successful
authentication in order to be accepted.
Transaction Sequence
POR
Request Standard
Typical Transaction Time
Request All
Identification and Selection
Procedure
Anticollision Loop
Get Identifier
~2.5 ms
+ ~1 ms
without collision
for 7-byte UID
+ ~1 ms
for each collision
Select Card
Authentication Procedure
3 Pass Authenticationon
specific sector
~2 ms
Memory Operations
Read
Block
Write
Block
Decrement
Increment
Restore
Halt
~2.5 ms
~5.5 ms
~2.5 ms
~4.5 ms
read block
write block
de-/increment
transfer
Transfer
001aan921
(1) the command flow diagram does not include the Personalize UID Usage and the
SET_MOD_TYPE command, for details on those commands please see Section 10.1.1 and
Section 11
Fig 4.
MF1S70yyX_V1
Product data sheet
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MIFARE Classic command flow diagram
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8.2.5 Memory operations
After authentication any of the following operations may be performed:
• Read block
• Write block
• Decrement: Decrements the contents of a block and stores the result in the internal
Transfer Buffer
• Increment: Increments the contents of a block and stores the result in the internal
Transfer Buffer
• Restore: Moves the contents of a block into the internal Transfer Buffer
• Transfer: Writes the contents of the internal Transfer Buffer to a value block
8.3 Data integrity
Following mechanisms are implemented in the contactless communication link between
reader and card to ensure very reliable data transmission:
•
•
•
•
•
16 bits CRC per block
Parity bits for each byte
Bit count checking
Bit coding to distinguish between “1”, “0” and “no information”
Channel monitoring (protocol sequence and bit stream analysis)
8.4 Three pass authentication sequence
1. The reader specifies the sector to be accessed and chooses key A or B.
2. The card reads the secret key and the access conditions from the sector trailer. Then
the card sends a number as the challenge to the reader (pass one).
3. The reader calculates the response using the secret key and additional input. The
response, together with a random challenge from the reader, is then transmitted to the
card (pass two).
4. The card verifies the response of the reader by comparing it with its own challenge
and then it calculates the response to the challenge and transmits it (pass three).
5. The reader verifies the response of the card by comparing it to its own challenge.
After transmission of the first random challenge the communication between card and
reader is encrypted.
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8.5 RF interface
The RF-interface is according to the standard for contactless smart cards
ISO/IEC 14443A.
For operation, the carrier field from the reader always needs to be present (with short
pauses when transmitting), as it is used for the power supply of the card.
For both directions of data communication there is only one start bit at the beginning of
each frame. Each byte is transmitted with a parity bit (odd parity) at the end. The LSB of
the byte with the lowest address of the selected block is transmitted first. The maximum
frame length is 163 bits (16 data bytes + 2 CRC bytes = 16  9 + 2  9 + 1 start bit).
8.6 Memory organization
The 4096  8 bit EEPROM memory is organized in 32 sectors of 4 blocks and 8 sectors of
16 blocks. One block contains 16 bytes.
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Byte Number within a Block
Sector
Block
39
15
32
31
0
0
1
2
3
Key A
4
5
6
7
8
9 10 11 12 13 14 15
Access Bits
Key B
Description
Sector Trailer 39
14
Data
13
Data
:
:
:
:
2
Data
1
Data
0
Data
:
:
:
:
:
:
15
Key A
Access Bits
Key B
Sector Trailer 32
14
Data
13
Data
:
:
:
:
2
Data
1
Data
0
Data
3
Key A
Access Bits
Key B
Sector Trailer 31
2
Data
1
Data
0
Data
:
:
:
:
:
:
3
Key A
Access Bits
Key B
Sector Trailer 0
2
Data
1
Data
0
Manufacturer Data
Manufacturer Block
001aan021
Fig 5.
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Memory organization
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8.6.1 Manufacturer block
This is the first data block (block 0) of the first sector (sector 0). It contains the IC
manufacturer data. This block is programmed and write protected in the production test.
The manufacturer block is shown in Figure 6 and Figure 7 for the 4-byte NUID and 7-byte
UID version respectively.
Block 0/Sector 0
Byte
0
1
2
3
4
5
6
7
NUID
Fig 6.
8
9
10
11
12
13
Manufacturer Data
14
15
001aan010
Manufacturer block for MF1S503yX with 4-byte NUID
Block 0/Sector 0
Byte
0
1
2
3
4
5
6
7
8
UID
Fig 7.
9
10
11
12
13
Manufacturer Data
14
15
001aam204
Manufacturer block for MF1S500yX with 7-byte UID
8.6.2 Data blocks
One block consists of 16 bytes. The first 32 sectors contain 3 blocks and the last 8 sectors
contain 15 blocks for storing data (Sector 0 contains only two data blocks and the
read-only manufacturer block).
The data blocks can be configured by the access bits as
• read/write blocks
• value blocks
Value blocks can be used for e.g. electronic purse applications, where additional
commands like increment and decrement for direct control of the stored value are
provided
A successful authentication has to be performed to allow any memory operation.
Remark: The default content of the data blocks at delivery is not defined.
8.6.2.1
Value blocks
Value blocks allow performing electronic purse functions (valid commands are: read,
write, increment, decrement, restore, transfer). Value blocks have a fixed data format
which permits error detection and correction and a backup management.
A value block can only be generated through a write operation in value block format:
• Value: Signifies a signed 4-byte value. The lowest significant byte of a value is stored
in the lowest address byte. Negative values are stored in standard 2´s complement
format. For reasons of data integrity and security, a value is stored three times, twice
non-inverted and once inverted.
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• Adr: Signifies a 1-byte address, which can be used to save the storage address of a
block, when implementing a powerful backup management. The address byte is
stored four times, twice inverted and non-inverted. During increment, decrement,
restore and transfer operations the address remains unchanged. It can only be
altered via a write command.
Byte Number
0
Description
1
2
3
4
value
5
6
7
8
value
9
10
11
value
12
13
14
15
adr adr adr adr
001aan018
Fig 8.
Value blocks
An example of a valid value block format for the decimal value 1234567d and the block
address 17d is shown in Table 4. First, the decimal value has to be converted to the
hexadecimal representation of 0012D687h. The LSByte of the hexadecimal value is
stored in Byte 0, the MSByte in Byte 3. The bit inverted hexadecimal representation of the
value is FFED2978h where the LSByte is stored in Byte 4 and the MSByte in Byte 7.
The hexadecimal value of the address in the example is 11h, the bit inverted hexadecimal
value is EEh.
Table 4.
Value block format example
Byte Number
0
Description
Values [hex]
1
2
3
4
value
87
D6
12
5
6
7
8
value
00
78
29 ED FF
9
10
11
value
87
D6
12
12
13
14
15
adr adr adr adr
00
11
EE
11
EE
8.6.3 Sector trailer
The sector trailer is always the last block in one sector. For the first 32 sectors this is block
3 and for the remaining 8 sectors it is block 15. Each sector has a sector trailer containing
the
• secret keys A (mandatory) and B (optional), which return logical “0”s when read and
• the access conditions for the blocks of that sector, which are stored in bytes 6...9. The
access bits also specify the type (data or value) of the data blocks.
If key B is not needed, the last 6 bytes of the sector trailer can be used as data bytes. The
access bits for the sector trailer have to be configured accordingly, see Section 8.7.2.
Byte 9 of the sector trailer is available for user data. For this byte the same access rights
as for byte 6, 7 and 8 apply.
When the sector trailer is read, the key bytes are blanked out by returning logical zeros. If
key B is configured to be readable, the data stored in bytes 10 to 15 is returned, see
Section 8.7.2.
All keys are set to FFFF FFFF FFFFh at chip delivery and the bytes 6, 7 and 8 are set to
FF0780h.
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Byte Number
0
1
Description
2
3
4
5
6
Key A
7
8
9
10
Access Bits
11
12
13
14
15
Key B (optional)
001aan013
Fig 9.
Sector trailer
8.7 Memory access
Before any memory operation can be done, the card has to be selected and authenticated
as described in Section 8.2. The possible memory operations for an addressed block
depend on the key used during authentication and the access conditions stored in the
associated sector trailer.
Table 5.
Memory operations
Operation
Description
Valid for Block Type
Read
reads one memory block
read/write, value and sector trailer
Write
writes one memory block
read/write, value and sector trailer
Increment
increments the contents of a block and
stores the result in the internal
value
Transfer Buffer
Decrement
decrements the contents of a block and
stores the result in the internal
value
Transfer Buffer
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Transfer
writes the contents of the internal
Transfer Buffer to a block
value and read/write
Restore
reads the contents of a block into the
internal Transfer Buffer
value
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8.7.1 Access conditions
The access conditions for every data block and sector trailer are defined by 3 bits, which
are stored non-inverted and inverted in the sector trailer of the specified sector.
The access bits control the rights of memory access using the secret keys A and B. The
access conditions may be altered, provided one knows the relevant key and the current
access condition allows this operation.
Remark: With each memory access the internal logic verifies the format of the access
conditions. If it detects a format violation the whole sector is irreversibly blocked.
Remark: In the following description the access bits are mentioned in the non-inverted
mode only.
The internal logic of the MF1S70yyX/V1 ensures that the commands are executed only
after a successful authentication.
Table 6.
Access conditions
Access Bits
Valid Commands
Block
Block(s)
Description
(sectors 0 - 31) (sectors 32-39)
C13 C23 C33 read, write
 3
15
sector trailer
C12 C22 C32 read, write, increment,
decrement, transfer, restore
 2
10-14
data block(s)
C11 C21 C31 read, write, increment,
decrement, transfer, restore
 1
5-9
data block(s)
C10 C20 C30 read, write, increment,
decrement, transfer, restore
 0
0-4
data block(s)
Byte Number
0
1
Description
2
3
4
5
Key A
Bit 7
6
7
8
9
10
11
Access Bits
12
13
14
15
Key B (optional)
6
5
4
3
2
1
0
Byte 6
C23
C22
C21
C20
C13
C12
C11
C10
Byte 7
C13
C12
C11
C10
C33
C32
C31
C30
Byte 8
C33
C32
C31
C30
C23
C22
C21
C20
Byte 9
user data
001aan003
Fig 10. Access conditions
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8.7.2 Access conditions for the sector trailer
Depending on the access bits for the sector trailer (block 3, respectively block 15) the
read/write access to the keys and the access bits is specified as ‘never’, ‘key A’, ‘key B’ or
key A|B’ (key A or key B).
On chip delivery the access conditions for the sector trailers and key A are predefined as
transport configuration. Since key B may be read in the transport configuration, new cards
must be authenticated with key A. Since the access bits themselves can also be blocked,
special care has to be taken during the personalization of cards.
Table 7.
Access conditions for the sector trailer
Access bits
Access condition for
KEYA
Product data sheet
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Access bits
KEYB
C1
C2
C3
read
write
read
write
read
write
0
0
0
never
key A
key A
never
key A
key A
Key B may be read[1]
0
1
0
never
never
key A
never
key A
never
Key B may be read[1]
1
0
0
never
key B
key A|B never
never
key B
1
1
0
never
never
key A|B never
never
never
0
0
1
never
key A
key A
key A
key A
key A
0
1
1
never
key B
key A|B key B
never
key B
1
0
1
never
never
key A|B key B
never
never
1
1
1
never
never
key A|B never
never
never
[1]
MF1S70yyX_V1
Remark
Key B may be read,
transport configuration[1]
For this access condition key B is readable and may be used for data
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8.7.3 Access conditions for data blocks
Depending on the access bits for data blocks (blocks 0...2) the read/write access is
specified as ‘never’, ‘key A’, ‘key B’ or ‘key A|B’ (key A or key B). The setting of the
relevant access bits defines the application and the corresponding applicable commands.
• Read/write block: the operations read and write are allowed.
• Value block: Allows the additional value operations increment, decrement, transfer
and restore. With access condition ‘001’ only read and decrement are possible which
reflects a non-rechargeable card. For access condition ‘110’ recharging is possible by
using key B.
• Manufacturer block: the read-only condition is not affected by the access bits setting!
• Key management: in transport configuration key A must be used for authentication
Table 8.
Access bits
Access condition for
C1
C2
C3
read
write
increment
decrement,
transfer,
restore
0
0
0
key A|B
key A|B
key A|B
key A|B
transport
configuration[1]
0
1
0
key A|B
never
never
never
read/write block[1]
1
0
0
key A|B
key B
never
never
read/write block[1]
1
1
0
key A|B
key B
key B
key A|B
value block[1]
0
0
1
key A|B
never
never
key A|B
value block[1]
0
1
1
key B
key B
never
never
read/write block[1]
1
0
1
key B
never
never
never
read/write block[1]
1
1
1
never
never
never
never
read/write block
[1]
MF1S70yyX_V1
Product data sheet
COMPANY PUBLIC
Access conditions for data blocks
Application
If key B may be read in the corresponding Sector Trailer it cannot serve for authentication (see grey marked
lines in Table 7). As a consequences, if the reader authenticates any block of a sector which uses such
access conditions for the Sector Trailer and using key B, the card will refuse any subsequent memory
access after authentication.
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MIFARE Classic EV1 4K - Mainstream contactless smart card IC
9. Command overview
The MIFARE Classic card activation follows the ISO/IEC 14443 Type A. After the
MIFARE Classic card has been selected, it can either be deactivated using the
ISO/IEC 14443 Halt command, or the MIFARE Classic commands can be performed. For
more details about the card activation refer to Ref. 4.
9.1 MIFARE Classic command overview
All MIFARE Classic commands typically use the MIFARE CRYPTO1 and require an
authentication.
All available commands for the MIFARE Classic EV1 4K are shown in Table 9.
Table 9.
Command overview
Command
ISO/IEC 14443
Command code
(hexadecimal)
Request
REQA
26h (7 bit)
Wake-up
WUPA
52h (7 bit)
Anticollision CL1
Anticollision CL1
93h 20h
Select CL1
Select CL1
93h 70h
Anticollision CL2
Anticollision CL2
95h 20h
Select CL2
Select CL2
95h 70h
Halt
Halt
50h 00h
Authentication with Key A
-
60h
Authentication with Key B
-
61h
Personalize UID Usage
-
40h
SET_MOD_TYPE
-
43h
MIFARE Read
-
30h
MIFARE Write
-
A0h
MIFARE Decrement
-
C0h
MIFARE Increment
-
C1h
MIFARE Restore
-
C2h
MIFARE Transfer
-
B0h
All commands use the coding and framing as described in Ref. 3 and Ref. 4 if not
otherwise specified.
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9.2 Timings
The timing shown in this document are not to scale and values are rounded to 1 s.
All given times refer to the data frames including start of communication and end of
communication. A PCD data frame contains the start of communication (1 “start bit”) and
the end of communication (one logic 0 + 1 bit length of unmodulated carrier). A PICC data
frame contains the start of communication (1 “start bit”) and the end of communication (1
bit length of no subcarrier).
The minimum command response time is specified according to Ref. 4 as an integer n
which specifies the PCD to PICC frame delay time. The frame delay time from PICC to
PCD is at least 87 s. The maximum command response time is specified as a time-out
value. Depending on the command, the TACK value specified for command responses
defines the PCD to PICC frame delay time. It does it for either the 4-bit ACK value
specified in Section 9.3 or for a data frame.
All command timings are according to ISO/IEC 14443-3 frame specification as shown for
the Frame Delay Time in Figure 11. For more details refer to Ref. 3 and Ref. 4.
last data bit transmitted by the PCD
first modulation of the PICC
FDT = (n* 128 + 84)/fc
128/fc
logic „1“
256/fc
end of communication (E)
128/fc
start of
communication (S)
FDT = (n* 128 + 20)/fc
128/fc
logic „0“
256/fc
end of communication (E)
128/fc
start of
communication (S)
aaa-006279
Fig 11. Frame Delay Time (from PCD to PICC) and TACK and TNAK
Remark: Due to the coding of commands, the measured timings usually excludes (a part
of) the end of communication. Consider this factor when comparing the specified with the
measured times.
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9.3 MIFARE Classic ACK and NAK
The MIFARE Classic uses a 4 bit ACK / NAK as shown in Table 10.
Table 10.
MIFARE ACK and NAK
Code (4-bit)
Transfer Buffer Validity
Description
Ah
Acknowledge (ACK)
0h
valid
invalid operation
1h
valid
parity or CRC error
4h
invalid
invalid operation
5h
invalid
parity or CRC error
9.4 ATQA and SAK responses
For details on the type identification procedure please refer to Ref. 2.
The MF1S70yyX/V1 answers to a REQA or WUPA command with the ATQA value shown
in Table 11 and to a Select CL1 command (CL2 for the 7-byte UID variant) with the SAK
value shown in Table 12.
Table 11.
ATQA response of the MF1S70yyX/V1
Bit Number
Sales Type
Hex Value
16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
MF1S700yX
00 42h
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
0
MF1S703yX
00 02h
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
Table 12.
SAK response of the MF1S70yyX/V1
Bit Number
Sales Type
Hex Value
8
7
6
5
4
3
2
1
MF1S70yyX/V1
18
0
0
0
1
1
0
0
0
Remark: The ATQA coding in bits 7 and 8 indicate the UID size according to
ISO/IEC 14443 independent from the settings of the UID usage.
Remark: The bit numbering in the ISO/IEC 14443 starts with LSBit = bit 1, but not LSBit =
bit 0. So one byte counts bit 1 to 8 instead of bit 0 to 7.
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10. UID Options and Handling
The MF1S70yyX/V1 product family offers two delivery options for the UID which is stored
in block 0 of sector 0.
• 7-byte UID
• 4-byte NUID (Non-Unique ID)
This section describes the MIFARE Classic MF1S70yyX/V1 operation when using one of
the 2 UID options with respect to card selection, authentication and personalization. See
also Ref. 6 for details on how to handle UIDs and NUIDs with MIFARE Classic products.
10.1 7-byte UID Operation
All MF1S70yXDyy products are featuring a 7-byte UID. This 7-byte UID is stored in
block 0 of sector 0 as shown in Figure 7. The behaviour during anti-collision, selection and
authentication can be configured during personalization for this UID variant.
10.1.1 Personalization Options
The 7-byte UID variants of the MF1S70yyX/V1 can be operated with four different
functionalities, denoted as UIDFn (UID Functionality n).
1. UIDF0: anti-collision and selection with the double size UID according to ISO/IEC
14443-3
2. UIDF1: anti-collision and selection with the double size UID according to ISO/IEC
14443-3 and optional usage of a selection process shortcut
3. UIDF2: anti-collision and selection with a single size random ID according to ISO/IEC
14443-3
4. UIDF3: anti-collision and selection with a single size NUID according to ISO/IEC
14443-3 where the NUID is calculated out of the 7-byte UID
The anti-collision and selection procedure and the implications on the authentication
process are detailed in Section 10.1.2 and Section 10.1.3.
The default configuration at delivery is option 1 which enables the ISO/IEC 14443-3
compliant anti-collision and selection. This configuration can be changed using the
‘Personalize UID Usage’ command. The execution of this command requires an
authentication to sector 0. Once this command has been issued and accepted by the
PICC, the configuration is automatically locked. A subsequently issued ‘Personalize UID
Usage’ command is not executed and a NAK is replied by the PICC.
Remark: As the configuration is changeable at delivery, it is strongly recommended to
send this command at personalization of the card to prevent unwanted changes in the
field. This should also be done if the default configuration is used.
Remark: The configuration becomes effective only after PICC unselect or PICC field
reset.
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PCD
Cmd
Type
CRC
ACK
PICC `ACK`
368 µs
TACK
59 µs
TNAK
59 µs
NAK
PICC `NAK`
TTimeOut
TimeOut
001aan919
Fig 12. Personalize UID Usage
Table 13.
Personalize UID Usage command
Name
Code
Description
Length
Cmd
40h
Set anti-collision, selection and
authentication behaviour
1 byte
Type
-
Encoded type of UID usage:
1 byte
UIDF0:
00h
UIDF1:
40h
UIDF2:
20h
UIDF3:
60h
CRC
-
CRC according to Ref. 4
2 bytes
ACK, NAK
see Table 10
see Section 9.3
4-bit
Table 14.
Personalize UID Usage timing
TACK min
Personalize UID Usage n=9
TACK max
TNAK min
TNAK max
TTimeOut
TTimeOut
n=9
TTimeOut
10 ms
10.1.2 Anti-collision and Selection
Depending on the chosen personalization option there are certain possibilities to perform
anti-collision and selection. To bring the MIFARE Classic into the ACTIVE state according
to ISO/IEC 14443-3, the following sequences are available.
Sequence 1: ISO/IEC 14443-3 compliant anti-collision and selection using the cascade
level 1 followed by the cascade level 2 SEL command
Sequence 2: using cascade level 1 anti-collision and selection procedure followed by a
Read command from block 0
Sequence 3: ISO/IEC 14443-3 compliant anti-collision and selection using the cascade
level 1 SEL command
Remark: The Read from Block 0 in Sequence 2 does not require a prior authentication to
Sector 0 and is transmitted in plain data. For all other sequences, the readout from Block
0 in Sector 0 is encrypted and requires an authentication to that sector.
Remark: The settings done with Personalize UID Usage do not change the ATQA coding.
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Table 15.
Available activation sequences for 7-byte UID options
UID Functionality
Available Activation Sequences
UIDF0
Sequence 1
UIDF1
Sequence 1, Sequence 2
UIDF2
Sequence 3
UIDF3
Sequence 3
10.1.3 Authentication
During the authentication process, 4-byte of the UID are passed on to the MIFARE Classic
Authenticate command of the contactless reader IC. Depending on the activation
sequence, those 4-byte are chosen differently. In general, the input parameter to the
MIFARE Classic Authenticate command is the set of 4 bytes retrieved during the last
cascade level from the ISO/IEC 14443-3 Type A anticollision.
Table 16.
Input parameter to MIFARE Classic Authenticate
UID Functionality
Input to MIFARE Classic Authenticate Command
Sequence 1
CL2 bytes (UID3...UID6)
Sequence 2
CL1 bytes (CT, UID0...UID2)
Sequence 3
4-byte NUID/RID (UID0...UID3)
10.2 4-byte UID Operation
All MF1S703yXDyy products are featuring a 4-byte NUID. This 4-byte NUID is stored in
block 0 of sector 0 as shown in Figure 6.
10.2.1 Anti-collision and Selection
The anti-collision and selection process for the product variants featuring 4-byte NUIDs is
done according to ISO/IEC 14443-3 Type A using cascade level 1 only.
10.2.2 Authentication
The input parameter to the MIFARE Classic Authenticate command is the full 4-byte UID
retrieved during the anti-collision procedure. This is the same as for the activation
Sequence 3 in the 7-byte UID variant.
11. Load Modulation Strength Option
The MIFARE Classic EV1 4K features the possibility to set the load modulation strength to
high or normal. The default level is set to a high modulation strength and it is
recommended for optimal performance to maintain this level and only switch to the low
load modulation strength if the contactless system requires it.
Remark: The configuration becomes effective only after a PICC unselect or a PICC field
reset. The configuration can be changed multiple times by asserting the command.
Remark: The MIFARE Classic EV1 4K needs to be authenticated to sector 0 with Key A
to perform the SET_MOD_TYPE command. The Access Bits for sector 0 are irrelevant.
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Cmd
PCD
Type
CRC
ACK
PICC `ACK`
368 µs
TACK
59 µs
TNAK
59 µs
NAK
PICC `NAK`
TTimeOut
TimeOut
001aan919
Fig 13. SET_MOD_TYPE
Table 17.
SET_MOD_TYPE command
Name
Code
Description
Length
Cmd
43h
Set load modulation strength
1 byte
Type
-
Encoded load modulation strength:
1 byte
strong modulation:
01h (default)
normal modulation:
00h
CRC
-
CRC according to Ref. 4
2 bytes
ACK, NAK
see Table 10
see Section 9.3
4-bit
Table 18.
SET_MOD_TYPE timing
SET_MOD_TYPE
TACK min
TACK max
TNAK min
TNAK max
TTimeOut
n=9
TTimeOut
n=9
TTimeOut
5 ms
The configured load modulation is shown in the manufacturer data of block 0 in sector 0.
The exact location is shown below in Figure 14 and Table 19.
Block 0/Sector 0
Byte
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Load Modulation Status Byte
aaa-012192
Fig 14. Byte Location of Load Modulation Status in Block 0 / Sector 0
Table 19.
Load Modulation Status Indication
Bit Number
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Product data sheet
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Load Modulation Type
Hex Value
7
6
5
4
3
2
1
0
strong load modulation
20h (default)
0
0
1
0
0
0
0
0
normal load modulation
00h
0
0
0
0
0
0
0
0
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12. MIFARE Classic commands
12.1 MIFARE Authentication
The MIFARE authentication is a 3-pass mutual authentication which needs two pairs of
command-response. These two parts, MIFARE authentication part 1 and part 2 are shown
in Figure 15, Figure 16 and Table 20.
Table 21 shows the required timing.
PCD
Auth
Addr
CRC
Token RB
PICC ,,ACK''
368 μs
359 μs
TACK
NAK
PICC ,,NAK''
TNAK
59 μs
TTimeOut
Time out
001aan004
Fig 15. MIFARE Authentication part 1
PCD
Token AB
Token BA
PICC `ACK`
TACK
708 µs
359 µs
TTimeOut
TimeOut
001aan917
Fig 16. MIFARE Authentication part 2
Table 20.
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Product data sheet
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MIFARE authentication command
Name
Code
Description
Length
Auth (with Key A)
60h
Authentication with Key A
1 byte
Auth (with Key B)
61h
Authentication with Key B
1 byte
Addr
-
MIFARE Block address (00h to FFh)
1 byte
CRC
-
CRC according to Ref. 4
2 bytes
Token RB
-
Challenge 1 (Random Number)
4 bytes
Token AB
-
Challenge 2 (encrypted data)
8 bytes
Token BA
-
Challenge 2 (encrypted data)
4 bytes
NAK
see Table 10
see Section 9.3
4-bit
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Table 21.
MIFARE authentication timing
TACK min
TACK max
TNAK min
TNAK max
TTimeOut
Authentication part 1
n=9
TTimeOut
n=9
n=9
1 ms
Authentication part 2
n=9
TTimeOut
1 ms
Remark: The minimum required time between MIFARE Authentication part 1 and part 2 is
the minimum required FDT according to Ref. 4. There is no maximum time specified.
Remark: The MIFARE authentication and encryption requires an MIFARE reader IC (e.g.
the CL RC632). For more details about the authentication command refer to the
corresponding data sheet (e.g. Ref. 5). The 4-byte input parameter for the MIFARE
Classic Authentication is detailed in Section 10.1.3 and Section 10.2.2.
12.2 MIFARE Read
The MIFARE Read requires a block address, and returns the 16 bytes of one
MIFARE Classic block. The command structure is shown in Figure 17 and Table 22.
Table 23 shows the required timing.
PCD
Cmd
Addr
CRC
Data
PICC ,,ACK''
368 μs
CRC
1548 μs
TACK
NAK
PICC ,,NAK''
TNAK
59 μs
TTimeOut
Time out
001aan014
Fig 17. MIFARE Read
Table 22.
Name
Code
Description
Length
Cmd
30h
Read one block
1 byte
Addr
-
MIFARE Block address (00h to FFh)
1 byte
CRC
-
CRC according to Ref. 4
2 bytes
Data
-
Data content of the addressed block
16 bytes
NAK
see Table 10
see Section 9.3
4-bit
Table 23.
Read
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MIFARE Read command
MIFARE Read timing
TACK min
TACK max
TNAK min
TNAK max
TTimeOut
n=9
TTimeOut
n=9
TTimeOut
5 ms
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12.3 MIFARE Write
The MIFARE Write requires a block address, and writes 16 bytes of data into the
addressed MIFARE Classic EV1 4K block. It needs two pairs of command-response.
These two parts, MIFARE Write part 1 and part 2 are shown in Figure 18 and Figure 19
and Table 24.
Table 25 shows the required timing.
PCD
Cmd
Addr
CRC
ACK
PICC ,,ACK''
368 μs
59 μs
TACK
NAK
PICC ,,NAK''
59 μs
TNAK
TTimeOut
Time out
001aan015
Fig 18. MIFARE Write part 1
PCD
Data
CRC
ACK
PICC ,,ACK''
1558 μs
TACK
59 μs
TNAK
59 μs
NAK
PICC ,,NAK''
TTimeOut
Time out
001aan016
Fig 19. MIFARE Write part 2
Table 24.
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Product data sheet
COMPANY PUBLIC
MIFARE Write command
Name
Code
Description
Length
Cmd
A0h
Write one block
1 byte
Addr
-
MIFARE Block or Page address (00h
to FFh)
1 byte
CRC
-
CRC according to Ref. 4
2 bytes
Data
-
Data
16 bytes
NAK
see Table 10
see Section 9.3
4-bit
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Table 25.
MIFARE Write timing
TACK min
TACK max
TNAK min
TNAK max
TTimeOut
Write part 1
n=9
TTimeOut
n=9
TTimeOut
5 ms
Write part 2
n=9
TTimeOut
n=9
TTimeOut
10 ms
Remark: The minimum required time between MIFARE Write part 1 and part 2 is the
minimum required FDT according to Ref. 4. There is no maximum time specified.
12.4 MIFARE Increment, Decrement and Restore
The MIFARE Increment requires a source block address and an operand. It adds the
operand to the value of the addressed block, and stores the result in the Transfer Buffer.
The MIFARE Decrement requires a source block address and an operand. It subtracts the
operand from the value of the addressed block, and stores the result in the Transfer
Buffer.
The MIFARE Restore requires a source block address. It copies the value of the
addressed block into the Transfer Buffer. The 4 byte Operand in the second part of the
command is not used and may contain arbitrary values.
All three commands are responding with a NAK to the first command part if the addressed
block is not formatted to be a valid value block, see Section 8.6.2.1.
The two parts of each command are shown in Figure 20 and Figure 21 and Table 26.
Table 27 shows the required timing.
PCD
Cmd
Addr
CRC
ACK
PICC ,,ACK''
368 μs
TACK
59 μs
TNAK
59 μs
NAK
PICC ,,NAK''
Time out
TTimeOut
001aan015
Fig 20. MIFARE Increment, Decrement, Restore part 1
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PCD
Data
CRC
PICC ,,ACK''
538 μs
NAK
PICC ,,NAK''
59 μs
TNAK
TTimeOut
Time out
001aan009
(1) Increment, Decrement and Restore part 2 does not acknowledge
Fig 21. MIFARE Increment, Decrement, Restore part 2
Table 26.
MIFARE Increment, Decrement and Restore command
Name
Code
Description
Length
Cmd
C1h
Increment
1 byte
Cmd
C0h
Decrement
1 byte
Cmd
C2h
Restore
1 byte
Addr
-
MIFARE source block address (00h to FFh)
1 byte
CRC
-
CRC according to Ref. 4
2 bytes
Data
-
Operand (4 byte signed integer)
4 bytes
NAK
see Table 10
see Section 9.3
4-bit
Table 27.
MIFARE Increment, Decrement and Restore timing
TACK min
TACK max
TNAK min
TNAK max
TTimeOut
Increment,
Decrement, and
Restore part 1
n=9
TTimeOut
n=9
TTimeOut
5 ms
Increment,
Decrement, and
Restore part 2
n=9
TTimeOut
n=9
TTimeOut
5 ms
Remark: The minimum required time between MIFARE Increment, Decrement, and
Restore part 1 and part 2 is the minimum required FDT according to Ref. 4. There is no
maximum time specified.
Remark: The MIFARE Increment, Decrement, and Restore commands require a MIFARE
Transfer to store the value into a destination block.
Remark: The MIFARE Increment, Decrement, and Restore command part 2 does not
provide an acknowledgement, so the regular time out has to be used instead.
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12.5 MIFARE Transfer
The MIFARE Transfer requires a destination block address, and writes the value stored in
the Transfer Buffer into one MIFARE Classic block. The command structure is shown in
Figure 22 and Table 28.
Table 29 shows the required timing.
PCD
Cmd
Addr
CRC
ACK
PICC ,,ACK''
368 μs
59 μs
TACK
NAK
PICC ,,NAK''
59 μs
TNAK
TTimeOut
Time out
001aan015
Fig 22. MIFARE Transfer
Table 28.
Name
Code
Description
Length
Cmd
B0h
Write the value from the Transfer
Buffer into destination block
1 byte
Addr
-
MIFARE destination block address
(00h to FFh)
1 byte
CRC
-
CRC according to Ref. 4
2 bytes
NAK
see Table 10
see Section 9.3
4-bit
Table 29.
Transfer
MF1S70yyX_V1
Product data sheet
COMPANY PUBLIC
MIFARE Transfer command
MIFARE Transfer timing
TACK min
TACK max
TNAK min
TNAK max
TTimeOut
n=9
TTimeOut
n=9
TTimeOut
10 ms
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13. Limiting values
Stresses above one or more of the limiting values may cause permanent damage to the
device. Exposure to limiting values for extended periods may affect device reliability.
Table 30. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
II
input current
-
30
mA
Ptot/pack
total power dissipation per package
-
120
mW
Tstg
storage temperature
55
125
C
Tamb
ambient temperature
25
70
C
2
-
kV
VESD
[1]
electrostatic discharge voltage on LA/LB
[1]
ANSI/ESDA/JEDEC JS-001; Human body model: C = 100 pF, R = 1.5 k
14. Characteristics
Table 31.
Symbol
Characteristics
Parameter
Ci
input capacitance
fi
input frequency
Conditions
[1]
Min
Typ
Max
Unit
14.9
16.9
19.0
pF
-
13.56
-
MHz
EEPROM characteristics
tret
retention time
Tamb = 22 C
10
-
-
year
Nendu(W)
write endurance
Tamb = 22 C
100000
200000
-
cycle
[1]
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Tamb=22°C, f=13,56Mhz, VLaLb = 1,5 V RMS
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15. Wafer specification
For more details on the wafer delivery forms see Ref. 9.
Table 32.
Wafer specifications MF1S70yyXDUy
Wafer
diameter
200 mm typical (8 inches)
maximum diameter after foil expansion
210 mm
thickness
MF1S70yyXDUD
120 m  15 m
MF1S70yyXDUF
75 m  10 m
flatness
not applicable
Potential Good Dies per Wafer (PGDW)
64727
Wafer backside
material
Si
treatment
ground and stress relieve
roughness
Ra max = 0.5 m
Rt max = 5 m
Chip dimensions
x = 658 m
step size[1]
y = 713 m
typical = 19 m
gap between chips[1]
minimum = 5 m
Passivation
type
sandwich structure
material
PSG / nitride
thickness
500 nm / 600 nm
Au bump (substrate connected to VSS)
material
> 99.9 % pure Au
hardness
35 to 80 HV 0.005
shear strength
> 70 MPa
height
18 m
height uniformity
within a die = 2 m
within a wafer = 3 m
wafer to wafer = 4 m
flatness
minimum = 1.5 m
size
LA, LB, VSS, TEST[2] = 66 m  66 m
size variation
5 m
under bump metallization
sputtered TiW
[1]
The step size and the gap between chips may vary due to changing foil expansion
[2]
Pads VSS and TESTIO are disconnected when wafer is sawn.
15.1 Fail die identification
Electronic wafer mapping covers the electrical test results and additionally the results of
mechanical/visual inspection. No ink dots are applied.
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15.2 Package outline
For more details on the contactless modules MOA4 and MOA8 please refer to Ref. 7 and
Ref. 8.
PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-2
X
D
A
detail X
0
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
max.
D
mm
0.33
35.05
34.95
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
Note
1. Total package thickness, exclusive punching burr.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT500-2
---
---
---
EUROPEAN
PROJECTION
ISSUE DATE
03-09-17
06-05-22
Fig 23. Package outline SOT500-2
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PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-4
X
D
A
detail X
0
10
scale
Dimensions
Unit
A(1)
D
max 0.26 35.05
nom
35.00
min
34.95
mm
20 mm
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
Note
1. Total package thickness, exclusive punching burr.
sot500-4_po
References
Outline
version
IEC
JEDEC
JEITA
SOT500-4
---
---
---
European
projection
Issue date
11-02-18
Fig 24. Package outline SOT500-4
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16. Bare die outline
For more details on the wafer delivery forms, see Ref. 9.
Chip Step
Bump size
LA, LB, VSS, TEST
x [µm]
y [µm]
658(1)
713(1)
60
60
typ. 18(1)
min. 5
typ. 18(1)
min. 5
238
LA
TESTIO
typ. 713(1)
633
43
VSS
LB
43
y
578
x
typ. 658(1)
aaa-012193
(1) The air gap and thus the step size may vary due to varying foil expansion
(2) All dimensions in m, pad locations measured from metal ring edge (see detail)
Fig 25. Bare die outline MF1S70yyXDUz/V1
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Product data sheet
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17. Abbreviations
Table 33.
MF1S70yyX_V1
Product data sheet
COMPANY PUBLIC
Abbreviations and symbols
Acronym
Description
ACK
ACKnowledge
ATQA
Answer To reQuest, Type A
CRC
Cyclic Redundancy Check
CT
Cascade Tag (value 88h) as defined in ISO/IEC 14443-3 Type A
EEPROM
Electrically Erasable Programmable Read-Only Memory
FDT
Frame Delay Time
FFC
Film Frame Carrier
IC
Integrated Circuit
LCR
L = inductance, Capacitance, Resistance (LCR meter)
LSB
Least Significant Bit
NAK
Not AcKnowledge
NUID
Non-Unique IDentifier
NV
Non-Volatile memory
PCD
Proximity Coupling Device (Contactless Reader)
PICC
Proximity Integrated Circuit Card (Contactless Card)
REQA
REQuest command, Type A
RID
Random ID
RF
Radio Frequency
RMS
Root Mean Square
RNG
Random Number Generator
SAK
Select AcKnowledge, type A
SECS-II
SEMI Equipment Communications Standard part 2
TiW
Titanium Tungsten
UID
Unique IDentifier
WUPA
Wake-Up Protocol type A
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18. References
1.
[1]
MIFARE (Card) Coil Design Guide — Application note, BU-ID Document
number 0117**1
[2]
MIFARE Type Identification Procedure — Application note, BU-ID Document
number 0184**1
[3]
ISO/IEC 14443-2 — 2001
[4]
ISO/IEC 14443-3 — 2001
[5]
MIFARE & I-CODE CL RC632 Multiple protocol contactless reader IC —
Product data sheet
[6]
MIFARE and handling of UIDs — Application note, BU-ID Document number
1907**1
[7]
Contactless smart card module specification MOA4 — Delivery Type
Description, BU-ID Document number 0823**1
[8]
Contactless smart card module specification MOA8 — Delivery Type
Description, BU-ID Document number 1636**1
[9]
General specification for 8" wafer on UV-tape with electronic fail die marking;
delivery types — Delivery Type Description, BU-ID Document number 1093**1
** ... document version number
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19. Revision history
Table 34.
Revision history
Document ID
Release date Data sheet status
MF1S70yyX_V1 v.3.1 20140908
Modifications:
•
•
Product data sheet
COMPANY PUBLIC
Supersedes
-
MF1S70yyX_V1 v.3.0
NXP originality check support only for 1 kB memory version
Wafer delivery specification reference corrected
MF1S70yyX_V1 v.3.0 20140303
MF1S70yyX_V1
Product data sheet
Change notice
Product data sheet
-
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20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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Product data sheet
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Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP Semiconductors N.V.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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22. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . .3
Pin allocation table . . . . . . . . . . . . . . . . . . . . . . .4
Value block format example . . . . . . . . . . . . . . . 11
Memory operations . . . . . . . . . . . . . . . . . . . . . .12
Access conditions . . . . . . . . . . . . . . . . . . . . . . .13
Access conditions for the sector trailer . . . . . .14
Access conditions for data blocks. . . . . . . . . . .15
Command overview . . . . . . . . . . . . . . . . . . . . .16
MIFARE ACK and NAK . . . . . . . . . . . . . . . . . .18
ATQA response of the MF1S70yyX/V1 . . . . . .18
SAK response of the MF1S70yyX/V1. . . . . . . .18
Personalize UID Usage command . . . . . . . . . .20
Personalize UID Usage timing . . . . . . . . . . . . .20
Available activation sequences for 7-byte
UID options . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Input parameter to MIFARE Classic
Authenticate . . . . . . . . . . . . . . . . . . . . . . . . . . .21
SET_MOD_TYPE command . . . . . . . . . . . . . .22
SET_MOD_TYPE timing . . . . . . . . . . . . . . . . .22
Load Modulation Status Indication . . . . . . . . . .22
MIFARE authentication command . . . . . . . . . .23
MIFARE authentication timing . . . . . . . . . . . . .24
MIFARE Read command . . . . . . . . . . . . . . . . .24
MIFARE Read timing . . . . . . . . . . . . . . . . . . . .24
MIFARE Write command . . . . . . . . . . . . . . . . .25
MIFARE Write timing . . . . . . . . . . . . . . . . . . . .26
MIFARE Increment, Decrement
and Restore command . . . . . . . . . . . . . . . . . . .27
MIFARE Increment, Decrement
and Restore timing . . . . . . . . . . . . . . . . . . . . . .27
MIFARE Transfer command . . . . . . . . . . . . . . .28
MIFARE Transfer timing . . . . . . . . . . . . . . . . . .28
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .29
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .29
Wafer specifications MF1S70yyXDUy . . . . . . .30
Abbreviations and symbols . . . . . . . . . . . . . . .34
Revision history . . . . . . . . . . . . . . . . . . . . . . . .36
MF1S70yyX_V1
Product data sheet
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23. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
Fig 23.
Fig 24.
Fig 25.
Contactless MIFARE system . . . . . . . . . . . . . . . . .1
Block diagram of MF1S70yyX/V1 . . . . . . . . . . . . .3
Pin configuration for SOT500-2 (MOA4) . . . . . . . .4
MIFARE Classic command flow diagram. . . . . . . .6
Memory organization . . . . . . . . . . . . . . . . . . . . . . .9
Manufacturer block for MF1S503yX with 4-byte
NUID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Manufacturer block for MF1S500yX with 7-byte
UID. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Value blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Sector trailer . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Access conditions . . . . . . . . . . . . . . . . . . . . . . . .13
Frame Delay Time (from PCD to PICC)
and TACK and TNAK. . . . . . . . . . . . . . . . . . . . . . . .17
Personalize UID Usage . . . . . . . . . . . . . . . . . . . .20
SET_MOD_TYPE . . . . . . . . . . . . . . . . . . . . . . . .22
Byte Location of Load Modulation Status in
Block 0 / Sector 0. . . . . . . . . . . . . . . . . . . . . . . . .22
MIFARE Authentication part 1 . . . . . . . . . . . . . . .23
MIFARE Authentication part 2 . . . . . . . . . . . . . . .23
MIFARE Read . . . . . . . . . . . . . . . . . . . . . . . . . . .24
MIFARE Write part 1 . . . . . . . . . . . . . . . . . . . . . .25
MIFARE Write part 2 . . . . . . . . . . . . . . . . . . . . . .25
MIFARE Increment, Decrement, Restore part 1 .26
MIFARE Increment, Decrement, Restore part 2 .27
MIFARE Transfer . . . . . . . . . . . . . . . . . . . . . . . . .28
Package outline SOT500-2 . . . . . . . . . . . . . . . . .31
Package outline SOT500-4 . . . . . . . . . . . . . . . . .32
Bare die outline MF1S70yyXDUz/V1 . . . . . . . . . .33
MF1S70yyX_V1
Product data sheet
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24. Contents
1
1.1
1.2
1.3
1.4
2
2.1
3
4
5
6
7
7.1
8
8.1
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.3
8.4
8.5
8.6
8.6.1
8.6.2
8.6.2.1
8.6.3
8.7
8.7.1
8.7.2
8.7.3
9
9.1
9.2
9.3
9.4
10
10.1
10.1.1
10.1.2
10.1.3
10.2
10.2.1
10.2.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Simple integration and user convenience. . . . . 1
Security and privacy . . . . . . . . . . . . . . . . . . . . . 1
Delivery options . . . . . . . . . . . . . . . . . . . . . . . . 2
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Block description . . . . . . . . . . . . . . . . . . . . . . . 5
Communication principle . . . . . . . . . . . . . . . . . 5
Request standard / all. . . . . . . . . . . . . . . . . . . . 5
Anticollision loop . . . . . . . . . . . . . . . . . . . . . . . . 5
Select card . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Three pass authentication . . . . . . . . . . . . . . . . 6
Memory operations . . . . . . . . . . . . . . . . . . . . . . 7
Data integrity. . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Three pass authentication sequence . . . . . . . . 7
RF interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Memory organization . . . . . . . . . . . . . . . . . . . . 8
Manufacturer block . . . . . . . . . . . . . . . . . . . . . 10
Data blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Value blocks . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Sector trailer . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Memory access . . . . . . . . . . . . . . . . . . . . . . . 12
Access conditions . . . . . . . . . . . . . . . . . . . . . . 13
Access conditions for the sector trailer . . . . . . 14
Access conditions for data blocks. . . . . . . . . . 15
Command overview . . . . . . . . . . . . . . . . . . . . . 16
MIFARE Classic command overview . . . . . . . 16
Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
MIFARE Classic ACK and NAK . . . . . . . . . . . 18
ATQA and SAK responses . . . . . . . . . . . . . . . 18
UID Options and Handling . . . . . . . . . . . . . . . 19
7-byte UID Operation . . . . . . . . . . . . . . . . . . . 19
Personalization Options . . . . . . . . . . . . . . . . . 19
Anti-collision and Selection. . . . . . . . . . . . . . . 20
Authentication . . . . . . . . . . . . . . . . . . . . . . . . . 21
4-byte UID Operation . . . . . . . . . . . . . . . . . . . 21
Anti-collision and Selection. . . . . . . . . . . . . . . 21
Authentication . . . . . . . . . . . . . . . . . . . . . . . . . 21
11
12
12.1
12.2
12.3
12.4
12.5
13
14
15
15.1
15.2
16
17
18
19
20
20.1
20.2
20.3
20.4
21
22
23
24
Load Modulation Strength Option . . . . . . . . .
MIFARE Classic commands . . . . . . . . . . . . . .
MIFARE Authentication . . . . . . . . . . . . . . . . .
MIFARE Read . . . . . . . . . . . . . . . . . . . . . . . .
MIFARE Write . . . . . . . . . . . . . . . . . . . . . . . .
MIFARE Increment, Decrement and Restore
MIFARE Transfer . . . . . . . . . . . . . . . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . .
Wafer specification . . . . . . . . . . . . . . . . . . . . .
Fail die identification . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
References. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
23
23
24
25
26
28
29
29
30
30
31
33
34
35
36
37
37
37
37
38
38
39
40
41
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 September 2014
279331
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