MF1SEP10x1 Secure contactless smart card IC for seamless migration Rev. 3.0 — 27 April 2015 328630 Product short data sheet COMPANY PUBLIC 1. General description MIFARE Plus is the only mainstream smart card family compatible with MIFARE Classic 1K and MIFARE Classic 4K that offers pre-issuance of cards prior to making security upgrades in the infrastructure. After security upgrade to Security Level 3, MIFARE Plus uses Advanced Encryption Standard (AES) for authentication, data integrity, and encryption. MIFARE Plus SE is the entry-level version of NXP’s proven and reliable MIFARE Plus product family. Designed for full functional compatibility with MIFARE Classic 1K, it provides complete support for the MIFARE Classic value blocks. MIFARE Plus SE is the choice for customers who want to switch to higher security while preparing for the future by introducing cards, ready for AES security, into the existing system environment. MIFARE Plus SE cards are easy to distribute into running MIFARE Classic systems, since it uses a linear memory structure compatible to MIFARE Classic, and because MIFARE Plus SE supports all MIFARE Classic value-block operations in the Security Levels SL1 and SL3. MIFARE Plus SE stores its 128-bit AES keys on top of the data blocks. The optional AES authentication in SL1 enables efficient detection of cards not belonging to the system. 2. Features and benefits Entry level version of the proven MIFARE Plus product family Simple fixed memory structure compatible with MIFARE Classic AES-128 for authenticity and integrity Freely configurable access conditions [1] 1 kB EEPROM Fully supports MIFARE Classic value block operations NXP originality check Supports ISO/IEC 14443-3[1] UIDs (4-Byte NUID, 7-byte UID) Optional support of random IDs Multi-sector authentication, Multi-block read and write Anti-tearing mechanism for writing AES Keys can be stored as MIFARE keys CRYPTO1 keys (2 x 48-bit per sector) and AES keys (2 x 128-bit per sector) Virtual card concept Communication speed up to 848 kbit/s Number of single write operations: Data retention time: 10 years 200000 typical ISO/IEC 14443-x used in this data sheet refers to ISO/IEC 14443 Type A. MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 3. Applications Public transportation Access management Electronic toll collection Car parking School and campus cards Employee cards Loyalty 4. Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Ci input capacitance Tamb = 22 C; fi = 13.56 MHz; 2.8 V RMS fi input frequency [1] Min Typ Max Unit 15.0 17.0 19.04 pF - 13.56 - MHz - - year - cycle EEPROM characteristics tret retention time Tamb = 22 C 10 Nendu(W) write endurance Tamb = 22 C; excluding anti-tearing for AES keys or sector trailers in security level 3 100000 200000 [1] MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC Measured with LCR meter. All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 5. Ordering information Table 2. Ordering information Type number Package Commercial Name Name Description Version MF1SEP1001DUD/03 FFC - 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECS-II format), 1 kB EEPROM, 7-byte UID - MF1SEP1031DUD/03 FFC - 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECS-II format), 1 kB EEPROM, 4-byte NUID - MF1SEP1001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 7-byte UID SOT500-2 MF1SEP1031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 4-byte NUID SOT500-2 MF1SEP1001DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 7-byte UID SOT500-4 MF1SEP1031DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide tape, 1 kB EEPROM, 4-byte NUID SOT500-4 6. Block diagram UART ISO/IEC 14443A RF INTERFACE AES CRYPTO CO-PROCESSOR TRUE RANDOM NUMBER GENERATOR CRYPTO1 SECURITY SENSORS POWER ON RESET CPU/LOGIC UNIT CRC VOLTAGE REGULATOR CLOCK INPUT FILTER ROM RESET GENERATOR RAM EEPROM 001aah389 Fig 1. MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC Block diagram All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 7. Pinning information 7.1 Smart card contactless module LA top view LB 001aaj820 Fig 2. Table 3. MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC Contact assignments for SOT500-2 (MOA4) Bonding pad assignments to smart card contactless module Contactless interface module MF1SEP10x1DA4/z3 Antenna contacts Symbol Description LA LA antenna coil connection LA LB LB antenna coil connection LB All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 8. Functional description 8.1 Memory organization The 1 kB EEPROM memory is organized in 16 sectors of 4 blocks One block consists of 16 bytes. Byte numbers within a block Sector Block 15 3 0 1 2 3 4 CRYPTO1 Key A 5(1) 6 7 8 9 Access bytes 10 11 12 13 14 15 CRYPTO1 Key B or Data 2 Data 1 Data Data 0 14 0 Description Sector trailer 15 3 CRYPTO1 Key A Access bytes CRYPTO1 Key B or Data Sector trailer 14 2 Data 1 0 Data Data ... ... ... ... ... ... 3 CRYPTO1 Key A Access bytes CRYPTO1 Key B or Data Sector trailer 0 2 Data 1 Data Manufacturer data 0 aaa-018291 (1) CRYPTO1 Key A in security level 0, 1, 2; plain text access byte in security level 3 Fig 3. Memory organization 8.1.1 Manufacturer block The first data block (block 0) of the first sector (sector 0) contains the PICC manufacturer data. This block is programmed and write protected at production test. 8.1.2 Data blocks Sectors 0D to 16D contain 3 blocks each for data storage. The data blocks can be configured using the access bits as: • read/write blocks for storing binary data • value blocks Value blocks are special counters where the stored value can be manipulated with specific commands such as MF Increment, MF Decrement and MF Transfer. A successful mutual authentication is required to allow any data operation. 8.1.2.1 Access conditions The access conditions for every data block and the sector trailer itself are stored in the sector trailer of the corresponding sector. MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC The access bits control the rights of memory operations using the secret keys A and B. The access conditions may be altered after authentication with the relevant key and the current access condition allows this operation. Furthermore, value blocks are configured using the access bits. 8.1.3 AES keys AES keys are not shown in the memory map. The keys are stored on top of the other data and can be updated and used by referencing the so-called Key Number. In security level 3, anti-tearing is supported for the update of AES keys as well as for the update of the sector trailer. This anti-tearing mechanism is done by the PICC itself. The EEPROM stays in a defined status, even if the PICC is removed from the electromagnetic field during the write operation. 8.1.4 Multi-sector authentication A new feature has been provided in security level 3 for data which is spread over multiple sectors to improve transaction performance. Providing that such sectors are secured with identical keys (key value and key type) only one authentication is required to read and/or write data from these sectors. There is no need to re-authenticate when accessing any data within these sectors. Therefore it is possible to configure a card in such a way that operating with only one authentication is needed in security level 3 to access all sectors. 8.1.5 Originality function The originality function is implemented by an AES authentication with the originality key. The authentication is performed in ISO/IEC 14443-4 protocol layer. 8.2 Card activation and communication protocol The ISO/IEC 14443-3 anticollision mechanism allows for simultaneous handling of multiple PICCs in the field. The anticollision algorithm selects each PICC individually and ensures that execution of a transaction with a selected PICC is performed correctly without data corruption from other PICCs in the field. MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC There are two different versions of the PICC. The UID is programmed into a locked part of the NV-memory which is reserved for the manufacturer: • unique 7-byte serial number • non-unique 4-byte serial number Due to security and system requirements, these bytes are write-protected after being programmed by the PICC manufacturer at production. Remark: The programmed 4-byte NUID serial number is not globally unique which has to be considered in the contactless system design. See Ref. 10 for further information regarding handling of UIDs. The customer must decide which UID length to use when ordering the product, see Table 2 for ordering information. During personalization, the PICC can be configured to support Random ID in security level 3. The user can configure whether Random ID or fixed UID shall be used. According to ISO/IEC 14443-3 (see Ref. 4), the first anticollision loop returns the Random Number Tag 08h, the 3-byte Random Number and the BCC, if Random ID is used. The retrieval of the UID in this case can be done using the Virtual Card Support Last command (see Ref. 2) or by reading out block 0. 8.2.1 Backwards compatibility protocol The backwards compatibility of this product, as used in security level 1 and security level 2, runs on the same protocol layer as MIFARE Classic 1K. The protocol is formed out of the following components: • • • • Frame definition: according to ISO/IEC 14443-3 Bit encoding: according to ISO/IEC 14443-2 Error code handling: handling is proprietary as error codes are formatted in half bytes. Command specification: commands are proprietary. Please use the specification as in Ref. 1 and the additional commands which are only implemented in MIFARE Plus as described in this document and in Ref. 2. The following security levels can run on this protocol: • Security Level 0 • Security Level 1 8.2.2 ISO/IEC 14443-4 Protocol The ISO/IEC 14443-4 Protocol (also known as T=CL) is used in many processor cards. This protocol is used for the MIFARE Plus with the following security levels: • Security Level 0: all commands • Security Level 1: only the security level switch and originality function. • Security Level 3: all commands MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 8.3 Security level switching The MIFARE Plus SE offers a unique feature to support migration from CRYPTO1 based systems to AES based operation. The migration on the card-side is done using different security levels supporting different cryptographic algorithms and protocols. There are three security levels: • Security level 0: initial delivery configuration, used for card personalization • Security level 1: backwards functional compatibility mode (with MIFARE Classic 1K) with an optional AES authentication • Security level 3: 3-Pass authentication based on AES, data manipulation commands secured by AES encryption and an AES based MACing method. The security level switching (i.e. from security level 1 to security level 3) is performed using the dedicated AES authentication switching keys. The security level can only be switched from a lower level to a higher level, never in the opposite direction. 8.4 Security level 0 Security level 0 is the initial delivery configuration of the PICC. The card can be operated either using the backwards compatibility protocol or the ISO/IEC 14443-4 protocol. In this level, the card can be personalized including the programming of user data as well as of CRYPTO1 and/or AES keys. In addition, the originality function can be used. The following mandatory AES keys need to be written using the Write Perso command before the PICC can be switched to security level 1 or security level 3 (for L3 card). Security level switching is performed using the Commit Perso command: • Card Configuration Key • Card Master Key • Level 3 Switch Key Using the originality function, it is possible to verify that the chip is a genuine NXP Semiconductors MIFARE Plus. 8.5 Security level 1 Security level 1 offers the same functionality as a MIFARE Classic 1K using the backwards compatibility protocol. The MIFARE Classic 1K products is specified in Ref. 1. Furthermore, an optional AES authentication is available in this level without affecting the MIFARE Classic 1K functionality. The authenticity of the card can be proven using strong cryptographic means with this additional functionality. The timings may differ from the MIFARE Classic 1K products. Using the originality function, it is possible to verify that the chip is a genuine NXP Semiconductors MIFARE Plus. MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 8.6 Security level 3 The operation in security level 3 is solely based on the ISO/IEC 14443-4 protocol layer. The usage of the backwards compatibility protocol is not possible. In security level 3, a mandatory AES authentication between PICC and reader is conducted, where two keys are generated as a function of the random numbers from the PICC and the reader as well as of the shared key. These two session keys are used to secure the data which is exchanged on the interface between the card and reader. One of the two keys is used to ensure the confidentiality of the command and the response while the other key ensures the integrity of the command and the response. All commands carry a MAC, such that the PICC will only accept commands from the reader with which it is authenticated. Tampering of operands and messages is detected by checking the MAC. Also all responses contain a MAC, so that the reader on each response knows that neither the command nor the response has been tampered with. Each response carries a MAC. When the appropriate MAC is received, due to linking of MACs, the reader knows that the command and commands before it was properly executed. All commands between two consecutive first authenticate commands belong to one transaction and the MACing mechanism assures integrity of the whole transaction. 9. Look-up tables 9.1 Security level 0, 1, 3: ISO/IEC 14443-3 Table 4. ISO/IEC 14443-3 Command Description REQA the REQA and ATQA commands are fully implemented according to ISO/IEC 14443-3. WUPA the WAKE-UP command is fully implemented according to ISO/IEC 14443-3. ANTICOLLISION/SELECT the ANTICOLLISION and SELECT commands are fully implemented cascade level 1 according to ISO/IEC 14443-3. The response is part 1 of the UID. ANTICOLLISION/SELECT the ANTICOLLISION and SELECT commands are fully implemented cascade level 2 for 7 byte according to ISO/IEC 14443-3. The response is part 2 of the UID. UID version HALT MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC the HALT command is fully implemented according to ISO/IEC 14443-3 All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 9.2 Security level 0, 1, 3: ISO/IEC 14443-4 Table 5. ISO/IEC 14443-4 Command Description RATS the response to the RATS command identifies the PICC type to the PCD. PPS the PPS command allows an individual selection of the communication baud rate between PCD and PICC. It is possible for the MF1SEP10x1 to individually set the communication baud rate independently of each other for both directions i.e. MF1SEP10x1 allows a non-symmetrical information interchange speed. DESELECT deselection according to ISO/IEC 14443-4 Please find more information on ISO/IEC 14443 in Ref. 4 as well as on the settings of ATQA, SAK and ATS in Ref. 3. 9.3 Security level 0 command overview Table 6. Security level 0 command overview Command Description Write Perso pre-personalization of AES keys and all blocks Commit Perso switch to security level 1 First Authenticate (part 1) first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step 9.4 Security level 1 command overview Table 7. Security level 1 command overview MF1ICS50, MF1ICS70, MF1ICS20 commands Description MF Authenticate key A authentication with key A MF Authenticate key B authentication with key B MF Read reading data MF Write writing data MF Increment incrementing a value MF Decrement decrementing a value MF Restore restoring a value MF Transfer transferring a value Commands using backwards compatibility protocol, see Section 8.2.1 MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC Following Authenticate (part 1) following authenticate; protocol used as described in Section 8.2.1 Authenticate (part 2) second authentication step; protocol used as described in Section 8.2.1 All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC Table 7. Security level 1 command overview …continued MF1ICS50, MF1ICS70, MF1ICS20 commands Description Command set for security level switch and originality function using ISO/IEC 14443-4 protocol First Authenticate (part 1) first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step 9.5 Security level 3 command overview Table 8. Security level 3 command overview Command Description MIFARE Plus commands First Authenticate (part 1) first authenticate Following Authenticate (part 1) following authenticate Authenticate (part 2) second authentication step ResetAuth reset the authentication step READ commands Read Plain MACed reading in plain, MAC on response, MAC on command WRITE commands Write MACed writing encrypted, MAC on response, MAC on command Write Plain MACed writing in plain, MAC on response, MAC on command VALUE operations Increment MACed incrementing a value encrypted, MAC on response, MAC on command Decrement MACed decrementing a value encrypted, MAC on response, MAC on command Transfer MACed transferring a value, MAC on response, MAC on command Increment Transfer MACed combined incrementing and transferring a value encrypted, MAC on response, MAC on command Decrement Transfer MACed combined decrementing and transferring a value encrypted, MAC on response, MAC on command Restore MACed restoring a value, MAC on response, MAC on command Virtual card concept MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC Virtual Card Support Last check if the virtual card concept is supported, communicate PCD capabilities and retrieve the UID Deselect Virtual Card deselect the virtual card All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 10. Limiting values Table 9. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Min Max[1][2] Unit input current - 30 mA Ptot/pack total power dissipation per package - 200 mW Tstg storage temperature 55 125 C Tamb ambient temperature 25 70 C 2 - kV 100 - mA Symbol Parameter II Conditions VESD electrostatic discharge voltage Ilu latch-up current [3] [1] Stresses above one or more of the limiting values may cause permanent damage to the device. [2] Exposure to limiting values for extended periods may affect device reliability. [3] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 k. 11. Abbreviations Table 10. MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC Abbreviations and symbols Acronym Description AES Advanced Encryption Standard EEPROM Electrically Erasable Programmable Read-Only Memory LCR L = inductance, Capacitance, Resistance (LCR meter) MAC Message Authentication Code NUID Non-Unique IDentifier NV Non-Volatile memory PCD Proximity Coupling Device (Contactless Reader) PICC Proximity Integrated Circuit Card (Contactless Card) PPS Protocol Parameter Selection RATS Request Answer To Select REQA REQuest Answer SAK Select AcKnowledge, type A SECS-II SEMI Equipment Communications Standard part 2 UID Unique IDentifier VC Virtual Card, one MIFARE Plus PICC is one virtual card WUPA Wake-Up Protocol type A All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 12. References [1] Data sheet — MIFARE Classic EV1 1K - Mainstream contactless smart card IC for fast and easy solution development, BL-ID Doc. No. 2792**1. [2] Data sheet — M1PLUSx0y1 MIFARE Plus functional specification, BU-ID Doc. No. 1637**. [3] Application note — MIFARE Type identification procedure, BU-ID Doc. No. 1843**. [4] Application note — ISO 14443 PICC selection, BU-ID Doc. No. 1308**. [5] NIST Special Publication 800-38A — Recommendation for block cipher modes of operation: methods and techniques, 2001. [6] NIST Special Publication 800-38B — Recommendation for block cipher modes of operation: The CMAC mode for authentication. [7] ISO/IEC Standard — ISO/IEC 14443 Identification cards - contactless integrated circuit cards - proximity cards. [8] FIPS PUB 197 ADVANCED ENCRYPTION STANDARD — Recommendation for block cipher modes of operation: Methods and techniques. [9] ISO/IEC Standard — ISO/IEC 9797-1 Information technology - security techniques - Message Authentication Codes (MACs) - Part 1: Mechanisms using a block cipher. [10] MIFARE and handling of UIDs — Application note, BU-ID Document number 1907**1 13. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes MF1SEP10x1_SDS 20150427 Product short data sheet - 1. - ** ... document version number MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14.4 Licenses Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. ICs with DPA Countermeasures functionality NXP ICs containing functionality implementing countermeasures to Differential Power Analysis and Simple Power Analysis are produced and sold under applicable license from Cryptography Research, Inc. 14.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. MIFARE — is a trademark of NXP Semiconductors N.V. MIFARE Plus — is a trademark of NXP Semiconductors N.V. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 15 of 17 MF1SEP10x1 NXP Semiconductors Secure contactless smart card IC 16. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Quick reference data . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . .3 Bonding pad assignments to smart card contactless module . . . . . . . . . . . . . . . . . . . . . .4 ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . .9 ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . .10 Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Security level 0 command overview . . . . . . . . 10 Security level 1 command overview . . . . . . . . 10 Security level 3 command overview . . . . . . . . 11 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations and symbols . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 17. Figures Fig 1. Fig 2. Fig 3. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Contact assignments for SOT500-2 (MOA4) . . . .4 Memory organization . . . . . . . . . . . . . . . . . . . . . . .5 MF1SEP10X1_SDS Product short data sheet COMPANY PUBLIC All information provided in this document is subject to legal disclaimers. Rev. 3.0 — 27 April 2015 328630 © NXP Semiconductors N.V. 2015. All rights reserved. 16 of 17 NXP Semiconductors MF1SEP10x1 Secure contactless smart card IC 18. Contents 1 2 3 4 5 6 7 7.1 8 8.1 8.1.1 8.1.2 8.1.2.1 8.1.3 8.1.4 8.1.5 8.2 8.2.1 8.2.2 8.3 8.4 8.5 8.6 9 9.1 9.2 9.3 9.4 9.5 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Smart card contactless module . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Memory organization . . . . . . . . . . . . . . . . . . . . 5 Manufacturer block . . . . . . . . . . . . . . . . . . . . . . 5 Data blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Access conditions . . . . . . . . . . . . . . . . . . . . . . . 5 AES keys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Multi-sector authentication . . . . . . . . . . . . . . . . 6 Originality function . . . . . . . . . . . . . . . . . . . . . . 6 Card activation and communication protocol . . 6 Backwards compatibility protocol . . . . . . . . . . . 7 ISO/IEC 14443-4 Protocol . . . . . . . . . . . . . . . . 7 Security level switching . . . . . . . . . . . . . . . . . . 8 Security level 0 . . . . . . . . . . . . . . . . . . . . . . . . . 8 Security level 1 . . . . . . . . . . . . . . . . . . . . . . . . . 8 Security level 3 . . . . . . . . . . . . . . . . . . . . . . . . . 9 Look-up tables . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Security level 0, 1, 3: ISO/IEC 14443-3 . . . . . . 9 Security level 0, 1, 3: ISO/IEC 14443-4 . . . . . 10 Security level 0 command overview . . . . . . . . 10 Security level 1 command overview . . . . . . . . 10 Security level 3 command overview . . . . . . . . 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 April 2015 328630