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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
4.5 - 60V / 450mA / 4.5 - 60V Output
DESCRIPTION
FEATURES
The LDHM type of the MagI³C Power Module family
provides a fully integrated constant current LED driver
including the buck switching regulator and inductor in a
package.
ƒ
ƒ
ƒ
ƒ
The 172946001 offers high efficiency and delivers up to
450mA of LED current. It operates from 4.5V input
voltage up to 60V and supports up to 16 LEDs in series. It
is designed for fast PWM dimming for no color shift.
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
It is available in an innovative industrial high power
density TO263-7EP (10.16 x 13.77 x 4.57mm) package
that enhances thermal performance and allows for hand
or machine soldering.
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
The LDHM regulator has an on-board protection circuitry
to guard against thermal overstress and electrical
damage featuring thermal shut-down, input under-voltage
lockout and LED short-circuit protections.
TYPICAL APPLICATIONS
ƒ
ƒ
ƒ
Peak efficiency up to 95%
Default LED current: 350mA
Adjustable LED current up to 450mA
Current sharing in parallel operation for higher
output current
Wide input voltage range: 4.5V to 60V
Output voltage range: 4.5V to 60V
Maximum output power: 27W
PWM dimming / Analog dimming
Integrated shielded inductor
Single exposed pad for best-in-class thermal
performance
Typical LED Current Accuracy ±3.5 %
LED short circuit protections
Under voltage lockout Protection (UVLO)
Fixed switching frequency at 800kHz
Compatible with ceramic and Low ESR Capacitors
Operating ambient temp. range up to 85°C
Operating junction temp. range: -40 to 125°C
RoHS & REACH compliant
Mold compound UL 94 Class V0 (flammability
testing) certified
Complies with EN 55015 radiated emissions
standard
ƒ
Indoor lighting: Spot light, down light
Outdoor lighting: Street light, security light, tunnel
light
Outdoor lighting: High-bay light, low-bay light
TYPICAL CIRCUIT DIAGRAM
High Power LED String
COUT
1
VIN
2
LED+
LED+
LED-
Module
IFIX
CIN
3
DIM
PGND
EP
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7
ISET
6
5
AGND
4
RIADJ
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
PACKAGE
2
DIM
3
AGND
4
6
1
LED+
7
LED+
ISET
5
IFIX
6
LED-
7
YMLLLLG3
WE201
Exposed Pad = PGND
Connect to AGND
EP
6
Top view
7
Package marking
MARKING DESCRIPTION
Marking
WE
Y
M
LLLL
G3
WE201
Description
Würth Elektronik trade name
Year
Month
Lot trace code
Lead finish code per JEDEC norm (green 3 mat sin)
Part identifier
PIN DESCRIPTION
SYMBOL
PIN #
TYPE
PIN DESCRIPTION
LED+
1, 2
Power
Supply input and rail connection to the anode of the LED string.
DIM
3
Input
Dimming control signal input. Left floating enables the driver. Optional: apply a logic
level PWM signal to control the brightness of the LED string.
AGND
4
Supply
The analog ground pin is the reference point for all stated voltages and must be
connected to the exposed pad (EP) externally.
ISET
5
Input
Connect a resistor between this pin and GND to adjust the LED current up to
450mA. If the default LED current of 350mA is desired, leave this pin floating.
IFIX
6
Input
Connect this pin to GND to set the default LED current of 350mA. In case a different
value of LED current is required, leave this pin floating.
LED-
7
Power
The current return pin of the LED string. Connect to the cathode of the LED string.
PGND
EP
Power
Exposed Pad. Connect to copper plane(s) with thermal vias for thermal
performance. Must be electrically connected to pin 4.
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
ORDERING INFORMATION
ORDER CODE
PART DESCRIPTION
PACKAGE
PACKING UNIT
172946001
WLMDU9456001JT
TO263-7EP
Tape and Reel with 250 Units
158998
Demonstration Board
1
178946001
Evaluation Board
1
SALES INFORMATION
SALES CONTACTS
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
[email protected]
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
ABSOLUTE MAXIMUM RATINGS
Caution:
Exceeding the listed absolute maximum ratings may affect the device negatively and may cause permanent damage.
LED+, LEDDIM
IFIX, ISET
VESD-HBM
TJ
Tstorage
TSOLR
LIMITS
PARAMETER
SYMBOL
LED Input and LED output to GND
PWM Dimming input to GND
LED current Adjustment Pins to GND
ESD, human body model (1) (All Pins except IFIX Pin 6)
Junction temperature
Assembled, non operating storage temperature
UNIT
MIN
-0.3
-0.3
-0.3
MAX
67
6
5
V
V
V
-2000
2000
V
0
150
150
°C
°C
240 ±5°C
°C
Peak case/leads temperature during reflow soldering, max. 30sec
(2)
Maximum two cycles!
OPERATING CONDITIONS
Operating conditions are conditions under which operation of the device is intended to be functional. All values are
referenced to GND.
MIN and MAX limits are valid for the recommended ambient temperature range of -40°C to 85°C.
PARAMETER
SYMBOL
LED+
DIM
Input voltage
PWM Dimming input
MIN (3)
TYP (4)
MAX (3)
UNIT
4.5
-
60
V
0
-
5.5
V
TA
Ambient temperature range
-40
-
85
°C
TJ
Junction temperature range
-40
-
125
°C
450
mA
ILED
Nominal LED current
THERMAL SPECIFICATIONS
SYMBOL
θJA
θJC
TSD
TSD-HYST
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PARAMETER
Thermal resistance junction to ambient (5)
TYP
19.3
UNIT
°C/W
Thermal resistance junction to case, no air flow
Thermal shut down, junction temperature, rising
Thermal shut down hysteresis, falling
1.9
170
10
°C/W
°C
°C
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
ELECTRICAL SPECIFICATIONS
MIN and MAX limits are valid for the recommended junction temperature range of -40°C to 125°C unless otherwise stated.
Typical values represent statistically the utmost probability at following conditions: V IN=48V, ILED = 350 mA.
VIN is the voltage applied across LED+ and GND. I IN is the input current flowing into the LED+ node. I LED is a LED current
flowing into the LED- pin. VLED is the voltage applied across LED+ and LED-. VDIM is the voltage applied across the DIM pin
to GND. Resistor RIADJ connect from ISET pin to GND.
SYMBOL
PARAMETER
IIN
Input current
ILED
LED current
ILED-60V
LED current VIN = 60V
ILED-ADJ450
Adjustment LED current
ILED-ADJ300
Adjustment LED current
ILED-SHORT
LED short circuit current VIN
= 60V
ILED-LEAK
“LED-“ pin leakage current
VDIM
VDIM-HYS
fSW
DIM pin threshold
DIM pin hysteresis
Switching frequency
TEST CONDITIONS
VIN = 4.5 to 60V
VLED = 0V;
VDIM=0V
TJ = 25°C
VLED = 24V;
IFIX connected to GND;
RIADJ = not connected;
TJ = -40°C to 125°C
VIN = 60V;
VLED = 36V;
IFIX connected to GND;
RIADJ = not connected;
TJ = -40°C to 125°C
VLED = 24V;
IFIX floating;
RIADJ = 2.33kΩ;
TJ = -40°C to 125°C
VLED = 24V;
IFIX floating;
RIADJ = 3.5 kΩ;
TJ = -40°C to 125°C
VLED = 0V;
VIN = 60V;
DIM = open
VLED = 0V;
VIN = operating max;
DIM = 0V
VDIM increasing
MIN (3)
TYP (4)
MAX (3)
UNIT
2.1
2.65
3.0
mA
337
350
371
mA
338
350
374
mA
437
450
483
mA
282
300
316
mA
800
920
1020
mA
1.2
µA
1.3
V
V
MHz
0.72
1.0
0.25
0.8
0.92
NOTES
(1)
The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. The pin 6 ( IFIX
pin) passes ± 1 kV. Test method is per JESD22-AI14S.
(2)
JEDEC J-STD020
(3)
Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are
guaranteed through correlation using Statistical Quality Control (SQC) methods.
(4)
Typical numbers are valid at 25°C ambient temperature and represent statistically the utmost probability assuming
the Gaussian distribution.
(5)
θJA measured on a 43.3 mm x 76.2 mm four layer board, with 35 µm copper , thirty five 0.3 mm thermal vias, no air
flow, and 1 W power dissipation.
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 48 V; CIN = 2.2 µF 100 V X7R ceramic capacitor for driving
5-13 power LEDs, ILED = 350 mA; Single LED forward voltage used is 3.2 V; TAMB = 25 °C
Radiated Emissions EN55015 compliant:
VIN = 60V; ILED = 350mA; CIN/COUT = 2.2µF;
LEDs = 16
Radiated Emissions (dBλV/m)
Radiated Emissions (dBλV/m)
80
EMI
EN 55015 limit
70
60
50
40
30
20
10
0
100
30
Radiated Emissions EN55015 compliant:
VIN = 60V; ILED = 350mA; CIN/COUT = 2.2µF;
LEDs = 16
80
EMI
EN 55015 limit
70
60
50
40
30
20
10
0
300
100
30
300
Freqency (MHz)
Freqency (MHz)
Conditions: vertical; height = 1m; ran ge = 10m
Conditions: horizontal; height = 3m; range = 10m
28D
27D
Efficiency: ILED = 350mA; TAMB = 25°C
Efficiency: ILED = 350mA; TAMB = 25°C
100
95
90
Efficiency (%)
Efficiency (%)
95
85
80
75
1LED
2LED
3LED
4LED
70
65
60
0
10
20
30
90
85
6LED
10LED
14LED
16LED
80
75
40
25
30
Input Voltage(V)
3
2
2
1
0
1LED
2LED
3LED
4LED
-2
-3
0
10
20
30
Input Voltage (V)
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40
45
50
55
60
ILED Regulation: 350mA; TAMB = 25°C
3
ILED Regulation (%)
ILED Regulation (%)
ILED Regulation: 350mA; TAMB = 25°C
-1
35
Input Voltage(V)
40
1
0
-1
6LED
10LED
14LED
16LED
-2
-3
25
30
35
40
45
50
55
60
Input Voltage (V)
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 48 V; CIN = 2.2 µF 100 V X7R ceramic capacitor for driving
5-13 power LEDs, ILED = 350 mA; Single LED forward voltage used is 3.2 V; TAMB = 25 °C
Efficiency: ILED = 450mA; TAMB = 25°C
Efficiency: ILED = 450mA; TAMB = 25°C
100
95
95
Efficiency (%)
Efficiency (%)
90
85
80
75
1LED
2LED
3LED
4LED
70
65
60
0
10
20
30
90
85
6LED
10LED
14LED
16LED
80
75
40
25
30
Input Voltage(V)
3
2
2
1
0
1LED
2LED
3LED
4LED
-2
-3
0
10
20
30
40
45
50
55
60
ILED Regulation: 450mA; TAMB = 25°C
3
ILED Regulation (%)
ILED Regulation (%)
ILED Regulation: 450mA; TAMB = 25°C
-1
35
Input Voltage(V)
1
0
-1
-3
40
6LED
10LED
14LED
16LED
-2
25
30
Input Voltage (V)
35
40
45
50
55
60
Input Voltage (V)
Efficiency: ILED = 300mA; TAMB = 25°C
Efficiency: ILED = 300mA; TAMB = 25°C
100
100
95
90
85
80
75
1LED
2LED
3LED
4LED
70
65
60
0
10
20
30
Input Voltage(V)
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Efficiency (%)
Efficiency (%)
95
90
85
6LED
10LED
14LED
16LED
80
40
75
25
30
35
40
45
50
55
60
Input Voltage(V)
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 48 V; CIN = 2.2 µF 100 V X7R ceramic capacitor for driving
5-13 power LEDs, ILED = 350 mA; Single LED forward voltage used is 3.2 V; TAMB = 25 °C
ILED Regulation: 300mA; TAMB = 25°C
3
3
2
2
ILED Regulation (%)
ILED Regulation (%)
ILED Regulation: 300mA; TAMB = 25°C
1
0
-1
1LED
2LED
3LED
4LED
-2
-3
0
10
20
30
1
0
-1
-3
40
6LED
10LED
14LED
16LED
-2
25
30
Input Voltage (V)
ILED Regulation over Temperature
45
50
55
60
450
11LED (VIN = 60V)
8LED (VIN = 48V)
6LED (VIN = 36V)
2
400
LED Current (mA)
ILED Regulation (%)
40
ILED vs VIN - 6LED
3
1
0
-1
-2
350
300
250
200
150
25°C
-40°C
125°C
100
50
-3
-50
-25
0
25
50
75
100
0
125
0
10
Temperature (°C)
4.0
2.5
3.5
Input Current (mA)
3.0
2.0
1.5
1.0
25°C
-40°C
125°C
0.5
20
30
40
50
60
Input Voltage (V)
Input current vs VIN; VDIM = 0V
Input Current (mA)
35
Input Voltage (V)
Input current vs VIN
LED = open; DIM = open
3.0
2.5
2.0
1.5
25°C
-40°C
125°C
1.0
0.5
0.0
0
10
20
30
40
Input Voltage (V)
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50
60
0.0
0
10
20
30
40
50
60
Input Voltage (V)
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 48 V; CIN = 2.2 µF 100 V X7R ceramic capacitor for driving
5-13 power LEDs, ILED = 350 mA; Single LED forward voltage used is 3.2 V; TAMB = 25 °C
1000
ILED vs VIN
VLED = 0V; DIM = open
100
600
400
25°C
-40°C
125°C
200
80
Input Current (mA)
800
LED Current (mA)
IIN vs VIN
VLED = 0V; DIM = open
60
40
0
0
10
20
30
40
50
25°C
-40°C
125°C
20
0
60
0
10
Input Voltage (V)
20
30
40
50
60
Input Voltage (V)
LED Current over Dimming Duty Ratio
LED Current over Dimming Duty
Ratio (0-1%)
100
1.0
90
LED Current (%)
80
LED Current (%)
70
60
50
40
30
11LED (VIN = 60V)
8LED (VIN = 48V)
6LED (VIN = 36V)
20
10
0
0 10 20 30 40 50 60 70 80 90 100
0.8
0.6
0.4
11LED (VIN = 60V)
8LED (VIN = 48V)
6LED (VIN = 36V)
0.2
0.0
0.0
Dimming Duty Ratio (%)
0.2
0.4
0.6
0.8
Dimming Duty Ratio (%)
500
2
450
LED Current [mA]
Frequency Deviation (%)
3
0
-1
25°C
-40°C
125°C
-2
20D
ILED vs RIADJ - 6 LEDs, VIN = 24V
Frequency Deviation vs VIN (800kHz)
1
1.0
400
350
300
250
-3
20
25
30
35
40
45
50
Input Voltage (V)
55
60
200
2300
2500
2700
2900
3100
3300
3500
RIADJ [Ω]
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
BLOCK DIAGRAM
GND
4
47µH
LED- 7
AGND
Error
Amplifier
5
ISET
6
3kΩ
IFIX
1
Switch Control
& Logic
Vref
Voltage
Regulator
VIN
COUT
Current
mirror
VCC 1 λF
LED+ 2
LED+
1.25V
0.33µF
-
CIN
High Power LED array
Power Module
Rsense
EP PGND
+
VCC
DIM
3
CIRCUIT DESCRIPTION
The MagI³C Power Module 172946001 is based on a non-synchronous floating buck regulator (simplified schematic below)
with integrated MOSFET, integrated diode and a power inductor. Note that in a floating buck topology the load (LEDs) is not
connected to GND. The control loop is based on a current mode control scheme with fixed switching frequency, assuring
accurate constant current regulation and good EMI performance. High speed dimming is implemented by direct control of
the PWM signal.
LED-
PGND
Rsense
CIN
COUT
controller
VIN
LED+
LED+
Floating buck
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
DESIGN FLOW
The next 4 simple steps will show how to select the external components to design your power application:
Essential Steps
1.
2.
3.
Set the LED driver module current
Select the appropriate number of LEDs
Layout and EMI considerations
Optional Steps
4.
5.
Dimming control
Parallel operation
2.
High Power LED String
COUT
3.
1
VIN
2
LED+
LED+
LED-
Module
5.
CIN
4.
DIM
PGND
EP
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IFIX
3.
3
7
ISET
AGND
4
6
5
1.
RIADJ
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
DESIGN FLOW
Step 1 Program the LED driver module current
The LED driver module requires no external current sensing resistor for LED current regulation. If the default LED current of
350mA is desired, no external resistor is necessary. It is enough to connect the IFIX pin to GND and to leave the ISET pin
open, as shown in the picture below:
High Power LED String
COUT
1
VIN
2
LED+
LED+
LED-
Module
IFIX
CIN
3
DIM
PGND
7
ISET
6
5
AGND
EP
4
Setup for fixed 350mA LED current
If a different LED current is required, it can be adjusted from 300 mA to 450 mA by varying the value of the resistor R IADJ,
connected between ISET pin and GND, leaving the IFIX pin open, according to the following equation and as shown in the
picture on the next page:
I
=
V ∙ k 1,25V ∙ 840
=
(1)
R
R
where VREF is the internal voltage reference and k is the current mirror ratio between the LED current and the current flowing
through RIADJ. The factor k is fixed by design to 840.
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
DESIGN FLOW
High Power LED String
COUT
1
VIN
LED+
2
LED+
LED-
Module
IFIX
CIN
3
7
DIM
ISET
PGND
EP
6
5
AGND
4
RIADJ
Setup for full adjustable LED current
According to equation (1) LED current values lower than 300mA can be also set. The minimum value of the LED current
depends on the minimum current that keeps the device operating in CCM. This current is a function of the number of LEDs
and the input voltage:
I
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,
_
=
(V − V
2∙L∙f
)∙V
∙V
(2)
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
DESIGN FLOW
The picture below shows the minimum adjustable LED current according to the number of LEDs (forward voltage assumed
3,2V) and the input voltage.
Minimum adjustable LED current [mA]
250
Vin = 12V
Vin = 24V
Vin = 36V
Vin = 48V
200
Vin = 60V
150
100
50
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Number of LEDs
Maximum Switch Current Limit
The LED Driver Module features an integrated switch current limiting mechanism to prevent the LEDs from being overdriven.
The switch current limiter is triggered when the switch current is three times exceeding the current level set by the resistor.
Once the current limiter is triggered, the internal power switch turns OFF for 3.6 μs to demagnetize the inductor until inductor
current reduces back to normal level. The current limiting feature is exceptionally important to avoid permanent damage of
the LED driver module application circuit due to short circuit of the LED string.
Step 2 Select the appropriate number of LEDs
The on-time of the internal switch should not be shorter than 400 ns. The number of LEDs (typical forward voltage at 3.2 V)
to input voltage is constrained by that as shown in the following table.
No. of LED
Max. VIN (V)
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1
12
2
20
3
30
4
40
5
50
6-16
60
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
DESIGN FLOW
Step 3 Layout and EMI considerations
The overall performance of the LED driver module highly depends on the PCB layout. Poor board layout can disrupt the
performance of the LED driver module and surrounding circuitry by contributing to EMI, ground bounce and resistive voltage
drop in the traces. These can send incorrect signals to the LED driver module resulting in poor regulation and stability. Good
layout can be implemented by following a few simple design rules.
∂
Place CIN as close as possible to the LED+ pin (pin 1 + pin 2) and PGND exposed pad (EP).
Exposed pad
PGND
GND
CIN1
CIN2
1
2
2
3
4
5
6
7
VIN
LED+
DIM AGND ISET IFIX LED-
Bottom
GROUND PLANE
Top layer
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COUT1
COUT2
RIADJ
Bottom layer
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DESIGN FLOW
∂
Place COUT (for reduction of LED current ripple and EMI compliance) as close as possible to the LED+ pin
(pin 1+pin 2) and LED- pin (pin 7).
Exposed pad
PGND
GND
CIN1
CIN2
1
2
2
3
4
5
6
7
VIN
LED+ DIM AGND ISET IFIX LED-
Bottom
GROUND PLANE
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COUT1
COUT2
RIADJ
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∂
PGND exposed pad (EP) must be connected to the AGND pin (pin 4) directly.
Exposed pad
PGND
GND
CIN1
1
CIN2
2
2
3
4
5
6
7
VIN
LED+ DIM AGND ISET IFIX LED-
COUT1
COUT2
RIADJ
Bottom
GROUND PLANE
From an EMI reduction standpoint, it is imperative to minimize the di/dt current paths (refer to LED driver module current
loops). Therefore, it is recommended to connect an 2.2 μF capacitor (C OUT) across the LED+ pin and LED- pin. This will
minimize the ripple current so that it can reduce radiated EMI.
LED driver module current loops
ON-loop
LED-
PGND
Rsense
CIN
OFF-loop
COUT
controller
VIN
LED+
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The 172946001 could work properly also without any COUT. In this case the inductor ripple will be added to the LED current,
as shown in the picture below.
LED current with and without output capacitor
500
LED Current [mA]
400
300
200
100
Without Cout
With Cout
0
0
2
4
6
8
10
Time [µs]
Considering the frequency range of the ripple oscillations (800kHz), it does not lead to any visible flickering of the emitted
light. Nevertheless the presence of a certain ripple in the LED current increases the LED junction temperature. This
accelerates the aging of the LED and reduces its lifetime. Higher LED temperature causes the efficiency of the LED to drop.
In addition, electromagnetic emissions are increased due to the presence of the current ripple along the complete LED string
and connection wires.
Therefore a small MLCC output capacitor of 2,2µF is anyway recommended.
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Step 4 Dimming Control
Two ways to implement the LED dimming are offered: the analog dimming and the PWM dimming. Both methods control the
average current flowing through the LEDs.
Analog dimming
The analog dimming can be achieved adjusting the LED current by using an external voltage source (V ADIM), as shown in the
schematic below:
High Power LED String
COUT
1
VIN
LED+
2
LED-
LED+
Module
IFIX
CIN
3
7
DIM
ISET
PGND
6
5
RADIM
VADIM
AGND
EP
RIADJ
4
Variable
voltage source
The LED current can be adjusted from I LEDmax to ILEDmin by selecting the resistor RIADJ and RADIM, as described by the
following equations:
R
R
=
V
=
∙I
,
I
,
V
∙k
−I
,
V
∙V
∙k
−V
∙ (I ,
where VREF = 1.25V and k is the current mirror ratio (internally set to 840).
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(3)
−I
,
)
(4)
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Example. In the following table two possible external voltage sources and the required resistors are shown. In both cases a
LED current from 300mA to 450mA can be adjusted
VADIM range [V]
0 to 3.3
0 to 5
RADIM [kΩ]
18.48 (18.7 closest value 1% series)
28.00
RIADJ [kΩ]
2.67
2.55
The picture below shows how the LED current varies according to the analog dimming voltage, using the above mentioned
resistors.
LED current variation through the analog dimming
450
LED current [mA]
400
350
300
0
1
2
3
4
5
Analog dimming voltage ADIM [V]
Since the color temperature of the LED depends on the current flowing through the LED, the analog dimming does not allow
to keep constant the color of the emitted light. For applications where the color of the emitted light plays a crucial role, a
PWM (following section) is strongly recommended.
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PWM Dimming
Controlling the brightness of the LED emitted light while keeping the same color can be achieved by properly driving the
LED. A well-known limitation of the human eye is not to distinguish light flickering with frequency above 100-120Hz. The idea
of the PWM dimming of LEDs means simply switching on and off the LED above this frequency. The human eye will
perceive the color corresponding to the current flowing through the LED during the switch-on phase. It will implement a kind
of integration of the perceived brightness, corresponding to the average current flowing through the LED, as described in the
picture below:
I LED
COLOR
ILED,peak
Average current
BRIGHTNESS
t
The 172946001 offers the possibility to implement a PWM dimming by using the dedicated pin DIM.
The DIM pin of the LED driver module is an input with internal pull-up that accepts logic signals for average LED current
control. Applying a logic high (above 1.3 V) signal to the DIM pin or leaving the DIM pin open will enable the device. Applying
a logic low signal (below 0.7 V) to the DIM pin will disable the switching activity of the device but maintain the operation of
the internal voltage regulator (VCC).
PWM dimming
500
LED current [mA]
400
300
200
100
0
0
4
8
12
16
12
16
time [ms]
10
PWM dimming signal [V]
8
6
4
2
0
0
4
8
time [ms]
Example with PWM dimming frequency of 250Hz
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The maximum frequency of the PWM dimming signal (f DIM,max) should not exceed, as rule of thumb,1/10 of the switching
frequency:
f
= 800kHz ⇒ f
,
= 80kHz(5)
The minimum dimming on-time pulse (t DIM,on_min) is around 16µs. The frequency of the dimming signal must be adjusted
according to the required dimming contrast ratio (CR). The contrast ratio is defined as the number of steps between the
minimum (dark) and maximum (full light) brightness of a lighting source.
The higher the CR, the lower is the frequency, as described by the equation below:
f
,
=
t
,
1
_
∙ CR
(6)
Example 1. If a PWM signal is generated by a 8 bit timer of a microcontroller, 256 different steps are available (the
achievable contrast ratio would be 256:1). According to the equation (6), the following dimming frequency is calculated:
f
=
1
= 244Hz(7)
16μs ∙ 256
A PWM dimming frequency of 250Hz can be used. Varying the duty cycle of the PWM signal, 256 different level of
brightness of the LEDs can be achieved, as shown in the picture below:
fDIM = 250Hz
16µs
Darker LED
fDIM = 250Hz
32µs
fDIM = 250Hz
48µs
Brighter LED
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Example 2. Assuming to keep the on-time of the PWM signal always equal to the t DIM,on_min, varying the frequency of the
PWM signal (PFM LED brightness control), the LED brightness can be adjusted as well as different contrast ratios can be
achieved (see picture below):
fDIM < 250Hz
Higher CR
16µs
Darker LED
fDIM = 250Hz
16µs
fDIM > 250Hz
Lower CR
16µs
Brighter LED
The constant duration of the LED on-time limits the LED junction temperature increase during dimming. As consequence,
the efficiency of this brightness control is higher compared to the PWM control.
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Example 3. The schematic below shows a possible combination of analog and PWM dimming in order to set the color temperature of the
emitted light and, at the same time, to adjust the brightness.
High Power LED String
CIN
1
VIN
2
LED+
LED+
LED-
Module
IFIX
PWM signal
CIN
3
DIM
PGND
BRIGHNTESS SETTING
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EP
7
ISET
6
COLOR SETTING
5
RADIM
VADIM
AGND
4
RIADJ
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Step 5 Parallel operation
When a load current higher than 450 mA is required by the application, LED driver modules can be used in parallel to deliver
higher current. With common VIN and GND pins, each LED driver module will operate as independent asynchronous current
source driving the same current. The total DC current of the modules will be additive; however, low frequency sub-harmonic
current ripple may be present and its frequency and magnitude will depend upon the phase relationship between the internal
clocks as there is no possibility for synchronizing driver clocks. Current sharing modules should have a local C IN capacitor of
minimum 2.2 μF located as close to VIN and GND as possible.
Parallel operation circuit schematic
Module
Module
Exposed Pad
(EP)
Exposed Pad
(EP)
CIN
3
4
5
6
7
IFIX
2
LED-
ISET
1
ISET
DIM
GND
7
DIM
LED+
6
GND
5
LED+
4
LED+
3
IFIX
2
LED-
1
LED+
CIN
VIN
RIADJ
RIADJ
ILED1
ILED2
COUT
High Power LED Array
COUT
Parallel operation result; ILED = 900mA
1.0
LED Current (A)
0.9
0.8
0.7
0.6
0.5
0.4
1LED
9LED
16LED
0.3
0.2
0.1
0.0
0
10
20
30
40
50
60
Input Voltage (V)
31D
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PROTECTIVE FEATURES
Shorted LED protection
Example
350mA
18V
15V
350mA
3V
3V
3V
3V
3V
3V
3V
3V
LED shorted
3V
0V
3V
3V
In case of a short circuit of one or more LEDs, the loop will react in order to adapt the voltage across the LED string, as
shown in the picture below.
Shorted LED protection
24
22
LED Voltage [V]
20
6 LEDs
18
5 LEDs
16
LED shorted
14
12
10
8
0
50
100
150
200
Time [µs]
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Similarly, in case the LED is only temporary shorted and then again normally working, the voltage across the LED string will
be adapted accordingly. In any case the current through the LED string is not affected, keeping the programmed value.
Open LED behavior
350mA
18V
0mA
VIN
3V
3V
3V
3V
3V
3V
3V
3V
3V
LED or string open
3V
3V
When a LED becomes an open circuit or simply the LED string is disconnected by the LED driver, the current stops flowing
through the LED string. As consequence the control loop will set the voltage between LED+ and LED- to the input voltage
(VIN), as shown below:
Behavior of the LED driver in case of open LED or open string
30
1,5
VIN
1,2
VLED
20
0,9
15
LED open
0,6
LED Current [A]
LED Voltage [V]
25
10
LEDcurrent=350mA
0,3
5
LED current= 0mA
0
0
0
100
200
300
400
500
600
Time [µs]
Monitoring the LED string voltage by an external microcontroller allows the detection of defective strings.
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APPLICATIONS
The MagI³C LED driver module for constant current is easy-to-use for current solutions capable of driving up to a 450 mA
load with exceptional power conversion efficiency. They are available in an innovative package that enhances thermal
performance and allows for hand or machine soldering. Following application circuits show possible operating
configurations.
Application Circuit
High Power LED String
COUT
1
VIN
2
LED+
LED+
LED-
Module
IFIX
CIN
3
DIM
PGND
EP
7
ISET
6
5
AGND
4
RIADJ
In the table below the recommended component values, under the following conditions: TA = 25°C; VIN = up to 60V; up to
16 LEDs.
ILED
RIADJ
IFIX pin
CIN
COUT
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300mA
3.5kΩ
open
350mA
Not connected
to GND
450mA
2.33kΩ
open
2.2 µF ; 100 V ; X7R
2.2 µF ; 100 V ; X7R
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HANDLING RECOMMENDATIONS
1.
2.
3.
4.
The power module is classified as MSL3 (JEDEC Moisture Sensitivity Level 3) and requires special handling due to
moisture sensitivity (JEDEC J-STD033).
The parts are delivered in a sealed bag (Moisture Barrier Bags = MBB) and should be processed within one year.
When opening the moisture barrier bag check the Humidity Indicator Card (HIC) for color status. Bake parts prior to
soldering in case indicator color has changed according to the notes on the card .
Parts must be processed after 168 hour (7 days) of floor life. Once this time has been exceeded, bake parts prior to
soldering per JEDEC J-STD033 recommendation.
SOLDER PROFILE
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
Only Pb-Free assembly is recommended according to JEDEC J-STD020.
Measure the peak reflow temperature of the MagI³C power module in the middle of the top view.
Ensure that the peak reflow temperature does not exceed 240°C ±5°C as per JEDEC J-STD020.
The reflow time period during peak temperature of 240°C ±5°C must not exceed 20 seconds.
Reflow time above liquidus (217°C) must not exceed 60 seconds.
Maximum ramp up is rate 3°C per second
Maximum ramp down rate is 6°C per second
Reflow time from room (25°C) to peak must not exceed 8 minutes as per JEDEC J-STD020.
Maximum numbers of reflow cycles is two.
For minimum risk, solder the module in the last reflow cycle of the PCB production.
For soldering process please consider lead material copper (Cu) and lead finish tin (Sn).
For solder paste use a standard SAC Alloy such as SAC 305, type 3 or higher.
Below profile is valid for convection reflow only
Other soldering methods (e.g.vapor phase) are not verified and have to be validated by the customer on his own risk
Temperature [°C]
Max 245
217
Max 10 - 30 sec
Peak
Ramp Up Rate
Max 3°C/sec
Liquidus
Ramp Down Rate
Max 6°C/sec
Max 60 sec
Min 30 sec
180
150
240°C
Preheat
Max 120 sec
Min 60 sec
Max 2 solder cycles !
Time [sec]
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PHYSICAL DIMENSIONS (mm)
Package Type: TO263-7
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recommended soldering pad
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recommended stencil design
solder paste recommendation 150µm
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PACKAGING
Reel (mm)
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Tape (mm)
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DOCUMENT HISTORY
Revision
Date
1.0
May 2016
Description
Comment
Release of final version
CAUTIONS AND WARNINGS
The following conditions apply to all goods within the product series of MagI³C of
Würth Elektronik eiSos GmbH & Co. KG:
General:
All recommendations according to the general technical specifications of the data-sheet have to be complied with.
The usage and operation of the product within ambient conditions which probably alloy or harm the component surface has
to be avoided.
The responsibility for the applicability of customer specific products and use in a particular customer design is always within
the authority of the customer. All technical specifications for standard products do also apply for customer specific products.
Residual washing varnish agent that is used during the production to clean the application might change the characteristics
of the body, pins or termination. The washing varnish agent could have a negative effect on the long term function of the
product.
Direct mechanical impact to the product shall be prevented as the material of the body, pins or termination could flake or in
the worst case it could break. As these devices are sensitive to electrostatic discharge customer shall follow proper IC
Handling Procedures.
Customer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related
requirements concerning its products, and any use of Würth Elektronik eiSos GmbH & Co. KG components in its
applications, notwithstanding any applications-related information or support that may be provided by Würth Elektronik eiSos
GmbH & Co. KG. Customer represents and agrees that it has all the necessary expertise to create and implement
safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences lessen the
likelihood of failures that might cause harm and take appropriate remedial actions. Customer will fully indemnify Würth
Elektronik eiSos and its representatives against any damages arising out of the use of any Würth Elektronik eiSos GmbH &
Co. KG components in safety-critical applications.
Product specific:
Follow all instructions mentioned in the datasheet, especially:
∂
The solder profile has to comply with the technical reflow or wave soldering specification, otherwise this will void the
warranty.
∂
All products are supposed to be used before the end of the period of 12 months based on the product date-code.
∂
Violation of the technical product specifications such as exceeding the absolute maximum ratings will void the warranty.
∂
It is also recommended to return the body to the original moisture proof bag and reseal the moisture proof bag again.
∂
ESD prevention methods need to be followed for manual handling and processing by machinery.
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IMPORTANT NOTES
The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:
1. General Customer Responsibility
Some goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general
suitability for certain application areas. These statements about suitability are based on our knowledge and experience of
typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about
the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is
always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to
investigate and decide whether the device with the specific product characteristics described in the product specification is
valid and suitable for the respective customer application or not. Accordingly, the customer is cautioned to verify that the
datasheet is current before placing orders.
2. Customer Responsibility related to Specific, in particular Safety-Relevant Applications
It has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the
usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the
range of the specifications. In certain customer applications requiring a very high level of safety and especially in customer
applications in which the malfunction or failure of an electronic component could endanger human life or health it must be
ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is
caused to third parties in the event of malfunction or failure of an electronic component.
3. Best Care and Attention
Any product-specific notes, warnings and cautions must be strictly observed.
4. Customer Support for Product Specifications
Some products within the product range may contain substances which are subject to restrictions in certain jurisdictions in
order to serve specific technical requirements. Necessary information is available on request. In this case the field sales
engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.
5. Product R&D
Due to constant product improvement product specifications may change from time to time. As a standard reporting
procedure of the Product Change Notification (PCN) according to the JEDEC-Standard we inform about minor and major
changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should
be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.
6. Product Life Cycle
Due to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of
products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDECStandard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee
that all products within our product range will always be available. Therefore it needs to be verified with the field sales
engineer or the internal sales person in charge about the current product availability expectancy before or when the product
for application design-in disposal is considered. The approach named above does not apply in the case of individual
agreements deviating from the foregoing for customer-specific products.
7. Property Rights
All the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas,
development contracts as well as models or templates that are subject to copyright, patent or commercial protection
supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG
does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright,
mask work right, or other intellectual property right relating to any combination, application, or process in which Würth
Elektronik eiSos GmbH & Co. KG components or services are used.
8. General Terms and Conditions
Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and
Conditions of Würth Elektronik eiSos Group”, last version available at www.we-online.com.
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